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Soquetes para CIs, Transistores
| Foto: | Número da peça do fabricante | Disponibilidade | Preço | Quantidade | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
34-6621-30CONN IC DIP SOCKET 34POS TIN Aries Electronics |
3,505 | - |
RFQ |
Ficha técnica |
Bulk | 6621 | Active | DIP, 0.6 (15.24mm) Row Spacing | 34 (2 x 17) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole, Bottom Entry; Through Board | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
69-PGM11030-11CONN SOCKET PGA GOLD Aries Electronics |
3,746 | - |
RFQ |
Ficha técnica |
Bulk | PGM | Active | PGA | - | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
69-PGM11031-11CONN SOCKET PGA GOLD Aries Electronics |
2,215 | - |
RFQ |
Ficha técnica |
Bulk | PGM | Active | PGA | - | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
69-PGM11053-11CONN SOCKET PGA GOLD Aries Electronics |
3,838 | - |
RFQ |
Ficha técnica |
Bulk | PGM | Active | PGA | - | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
116-43-316-61-007000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
2,545 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
116-93-316-61-007000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
3,211 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
127-93-664-41-002000CONN IC DIP SOCKET 64POS GOLD Mill-Max Manufacturing Corp. |
2,421 | - |
RFQ |
Ficha técnica |
Tube | 127 | Active | DIP, 0.6 (15.24mm) Row Spacing | 64 (2 x 32) | 0.070 (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.070 (1.78mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
127-43-664-41-002000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
2,473 | - |
RFQ |
Ficha técnica |
Tube | 127 | Active | DIP, 0.6 (15.24mm) Row Spacing | 64 (2 x 32) | 0.070 (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.070 (1.78mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
123-13-632-41-801000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
3,101 | - |
RFQ |
Ficha técnica |
Tube | 123 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame, Decoupling Capacitor | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
111-43-328-61-001000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
2,084 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
111-43-428-61-001000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
3,120 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
111-43-628-61-001000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
3,347 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
111-93-328-61-001000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
3,375 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
111-93-428-61-001000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
2,835 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
111-93-628-61-001000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
2,048 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
126-93-952-41-002000CONN IC DIP SOCKET 52POS GOLD Mill-Max Manufacturing Corp. |
3,734 | - |
RFQ |
Ficha técnica |
Tube | 126 | Active | DIP, 0.9 (22.86mm) Row Spacing | 52 (2 x 26) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
126-43-952-41-002000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
2,526 | - |
RFQ |
Ficha técnica |
Tube | 126 | Active | DIP, 0.9 (22.86mm) Row Spacing | 52 (2 x 26) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
122-13-632-41-801000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
3,430 | - |
RFQ |
Ficha técnica |
Tube | 122 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame, Decoupling Capacitor | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
550-10-272M20-001166BGA PIN ADAPTER 1.27MM SMD Preci-Dip |
3,570 | - |
RFQ |
Ficha técnica |
Bulk | 550 | Active | BGA | 272 (20 x 20) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
110-41-652-61-001000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
3,560 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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