Adaptador, placas de breakout

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus ProtoBoardType PackageAccepted NumberofPositions Pitch BoardThickness Material
DIP-ADAPTER-EVM

DIP-ADAPTER-EVM

MODULE EVAL DIP ADAPTER

Texas Instruments
2,734 -

RFQ

Box - Active SMD to Plated Through Hole MSOP, SC70, SOIC, SOT23, SOT563, TSSOP 6 - - -
14-24-LOGIC-EVM

14-24-LOGIC-EVM

DEVELOPMENT SPECIALIZED

Texas Instruments
2,471 -

RFQ

Box - Active SMD to Plated Through Hole SOIC, TSSOP - - - -
EVM-LEADED1

EVM-LEADED1

EVALUATION MODULE

Texas Instruments
3,216 -

RFQ

EVM-LEADED1

Ficha técnica

Bulk - Active SMD to DIP - - - - -
EVM-LEADLESS1

EVM-LEADLESS1

EVALUATION MODULE

Texas Instruments
3,858 -

RFQ

EVM-LEADLESS1

Ficha técnica

Bulk - Active SMD to DIP - - - - -
SMALL-AMP-DIP-EVM

SMALL-AMP-DIP-EVM

BREAKOUT BOARD

Texas Instruments
3,838 -

RFQ

SMALL-AMP-DIP-EVM

Ficha técnica

Box - Active SMD to DIP DPW-5, DCN-8, DDF-8, DSG-8, RUG-10, RUC-14, RGY-14, RTE-16 16 - - -
5-8-LOGIC-EVM

5-8-LOGIC-EVM

LOGIC EVAL BOARD

Texas Instruments
2,116 -

RFQ

5-8-LOGIC-EVM

Ficha técnica

Box - Active SMD to Plated Through Hole SC-70, SOT-23, SOT-583, SSOP, VSSOP 8 - - -
QFN16-DIP-EVM

QFN16-DIP-EVM

BREAKOUT BOARD

Texas Instruments
3,704 -

RFQ

QFN16-DIP-EVM

Ficha técnica

Box - Active SMD to DIP QFN 16 - - -
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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