Microfones

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type OutputType Direction FrequencyRange Sensitivity S/NRatio Impedance Voltage-Rated VoltageRange Current-Supply PortLocation Ratings Termination Size/Dimension Height(Max)
GTM3526DB261SPA0

GTM3526DB261SPA0

MIC MEMS DIG OMNI -26DB 3.5X2.65

GMEMS Technologies
500 -

RFQ

Tape & Reel (TR) - Active MEMS (Silicon) Digital Omnidirectional 20 Hz ~ 20 kHz -26dB ±3dB @ 94dB SPL 65dB - - - 750 µA Bottom - Solder Pads 0.138 L x 0.104 W (3.50mm x 2.65mm) 0.038 (0.98mm)
GTM2718AT421XPR0

GTM2718AT421XPR0

MIC MEMS ANLG -42DB 2.75X1.85MM

GMEMS Technologies
2,362 -

RFQ

GTM2718AT421XPR0

Ficha técnica

Tape & Reel (TR) - Active MEMS (Silicon) Analog Omnidirectional 20 Hz ~ 20 kHz -42dB ±3dB @ 94dB SPL 64dB 200 Ohms - - 115 µA Top - Solder Pads 0.108 L x 0.073 W (2.75mm x 1.85mm) 0.049 (1.25mm)
GTM2718AB381WNB2

GTM2718AB381WNB2

MIC MEMS ANLG -38DB 2.75X1.85MM

GMEMS Technologies
2,118 -

RFQ

GTM2718AB381WNB2

Ficha técnica

Tape & Reel (TR) - Active MEMS (Silicon) Analog Omnidirectional 20 Hz ~ 20 kHz -38dB ±3dB @ 94dB SPL 64dB 200 Ohms - - 95 µA Bottom - Solder Pads 0.108 L x 0.073 W (2.75mm x 1.85mm) 0.038 (0.98mm)
GTM4030DT261SFD0

GTM4030DT261SFD0

MIC MEMS DIG OMNI -26DB 4X3MM

GMEMS Technologies
500 -

RFQ

GTM4030DT261SFD0

Ficha técnica

Tape & Reel (TR) - Active MEMS (Silicon) Digital Omnidirectional 20 Hz ~ 20 kHz -26dB ±1dB @ 94dB SPL 64dB - - - 800 µA Top - Solder Pads 0.157 L x 0.118 W (4.00mm x 3.00mm) 0.039 (1.00mm)
GTM2718AT421WNC2

GTM2718AT421WNC2

MIC MEMS ANLG -38DB 2.75X1.85MM

GMEMS Technologies
2,951 -

RFQ

GTM2718AT421WNC2

Ficha técnica

Tape & Reel (TR) - Active MEMS (Silicon) Analog Omnidirectional 20 Hz ~ 20 kHz -38dB ±3dB @ 94dB SPL 57dB 200 Ohms - 1.6 V ~ 3.6 V 95 µA Top - Solder Pads 0.108 L x 0.073 W (2.75mm x 1.85mm) 0.038 (0.98mm)
GTM2718AT421XPJ0

GTM2718AT421XPJ0

MIC MEMS ANLG -42DB 2.75X1.85MM

GMEMS Technologies
461 -

RFQ

GTM2718AT421XPJ0

Ficha técnica

Tape & Reel (TR) - Active MEMS (Silicon) Analog Omnidirectional 20 Hz ~ 20 kHz -42dB ±3dB @ 94dB SPL 61dB 200 Ohms - - 95 µA Top - Solder Pads 0.108 L x 0.073 W (2.75mm x 1.85mm) 0.049 (1.25mm)
GTM4020DT261SPA0

GTM4020DT261SPA0

MIC MEMS DIG PDM OMNI -26DB 4X2

GMEMS Technologies
100 -

RFQ

GTM4020DT261SPA0

Ficha técnica

Tape & Reel (TR) - Active MEMS (Silicon) Digital, PDM Omnidirectional 100 Hz ~ 10 kHz -26dB ±1dB 64dB - 1.8 V 1.6 V ~ 3.6 V 800 µA Top - Solder Pads 0.157 L x 0.079 W (4.00mm x 2.00mm) 0.043 (1.10mm)
GTM2718DT261XPB0

GTM2718DT261XPB0

MIC MEMS DIG OMN -26DB 2.75X1.85

GMEMS Technologies
100 -

RFQ

GTM2718DT261XPB0

Ficha técnica

Tape & Reel (TR) - Active MEMS (Silicon) Digital Omnidirectional 20 Hz ~ 20 kHz -26dB ±1dB @ 94dB SPL 64dB - - - 800 µA Top - Solder Pads 0.108 L x 0.073 W (2.75mm x 1.85mm) 0.051 (1.30mm)
GTM2718AB381XPR1

GTM2718AB381XPR1

MIC MEMS ANLG -38DB 2.75X1.85MM

GMEMS Technologies
3,151 -

RFQ

GTM2718AB381XPR1

Ficha técnica

Tape & Reel (TR) - Active MEMS (Silicon) Analog Omnidirectional 20 Hz ~ 20 kHz -38dB ±3dB @ 94dB SPL 66dB 200 Ohms - - 115 µA Bottom - Solder Pads 0.108 L x 0.073 W (2.75mm x 1.85mm) 0.038 (0.98mm)
GTM2718DT261XPA0

GTM2718DT261XPA0

MIC MEMS DIG OMN -26DB 2.75X1.85

GMEMS Technologies
2,418 -

RFQ

GTM2718DT261XPA0

Ficha técnica

Tape & Reel (TR) - Active MEMS (Silicon) Digital Omnidirectional 20 Hz ~ 20 kHz -26dB ±1dB @ 94dB SPL 62dB - - - 800 µA Top - Solder Pads 0.108 L x 0.073 W (2.75mm x 1.85mm) 0.051 (1.30mm)
GTM3526DB261SPB0

GTM3526DB261SPB0

MIC MEMS DIG OMNI -26DB 3.5X2.65

GMEMS Technologies
3,889 -

RFQ

GTM3526DB261SPB0

Ficha técnica

Tape & Reel (TR) - Active MEMS (Silicon) Digital Omnidirectional 20 Hz ~ 20 kHz -26dB ±1dB @ 94dB SPL 64dB - - - 800 µA Bottom - Solder Pads 0.138 L x 0.104 W (3.50mm x 2.65mm) 0.038 (0.98mm)
GTM2718AT381-FK0

GTM2718AT381-FK0

MIC MEMS ANLG -38DB 2.75X1.85MM

GMEMS Technologies
2,190 -

RFQ

GTM2718AT381-FK0

Ficha técnica

Tape & Reel (TR) - Active MEMS (Silicon) Analog Omnidirectional 20 Hz ~ 20 kHz -38dB ±3dB @ 94dB SPL 64dB 200 Ohms - - 95 µA Top - Solder Pads 0.108 L x 0.073 W (2.75mm x 1.85mm) 0.041 (1.05mm)
GTM2314AB381-N10

GTM2314AB381-N10

MIC MEMS ANLG OMNI -42DB 2.3X1.4

GMEMS Technologies
3,281 -

RFQ

GTM2314AB381-N10

Ficha técnica

Tape & Reel (TR) - Active MEMS (Silicon) Analog Omnidirectional 20 Hz ~ 20 kHz -42dB ±3dB @ 94dB SPL 59dB 200 Ohms - 1.6 V ~ 3.6 V 120 µA Bottom - Solder Pads 0.090 L x 0.050 W (2.30mm x 1.40mm) 0.038 (0.98mm)
GTM2718AB381XPV0

GTM2718AB381XPV0

MIC MEMS ANLG -38DB 2.75X1.85MM

GMEMS Technologies
3,838 -

RFQ

GTM2718AB381XPV0

Ficha técnica

Tape & Reel (TR) - Active MEMS (Silicon) Analog Omnidirectional 20 Hz ~ 20 kHz -38dB ±3dB @ 94dB SPL 68dB 250 Ohms - - 160 µA Bottom - Solder Pads 0.108 L x 0.073 W (2.75mm x 1.85mm) 0.038 (0.98mm)
GTM3325AB381-PA0

GTM3325AB381-PA0

MIC MEMS ANLG -38DB 3.31X2.46MM

GMEMS Technologies
3,345 -

RFQ

GTM3325AB381-PA0

Ficha técnica

Tape & Reel (TR) - Active MEMS (Silicon) Analog Omnidirectional 20 Hz ~ 20 kHz -38dB ±3dB @ 94dB SPL 69dB 250 Ohms - - 220 µA Bottom - Solder Pads 0.130 L x 0.097 W (3.31mm x 2.46mm) 0.038 (0.98mm)
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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