Placas de prototipagem, kits de fabricação

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus KitType Quantity PackageAccepted Specifications
OM13493UL

OM13493UL

SURFACE MOUNT TO DIP EVALUATION

NXP USA Inc.
3,254 -

RFQ

Bulk - Active Adapter, Breakout Boards 24 Pieces (4 Values - 6 Each) DHVQFN SMD to DIP
OM13491UL

OM13491UL

SURFACE MOUNT TO DIP EVALUATION

NXP USA Inc.
2,626 -

RFQ

Bulk - Active Adapter, Breakout Boards 42 Pieces (5 Values - Mixed Quantities) HWSON, MSOP, SO, VSSOP, XQFN SMD to DIP
OM13494UL

OM13494UL

SURFACE MOUNT TO DIP EVALUATION

NXP USA Inc.
3,745 -

RFQ

Bulk - Active Adapter, Breakout Boards 24 Pieces (4 Values - 6 Each) HVQFN SMD to DIP
OM13495UL

OM13495UL

SURFACE MOUNT TO DIP EVALUATION

NXP USA Inc.
2,245 -

RFQ

Bulk - Active Adapter, Breakout Boards 24 Pieces (4 Values - 6 Each) TSSOP SMD to DIP
OM13496UL

OM13496UL

SURFACE MOUNT TO DIP EVALUATION

NXP USA Inc.
3,991 -

RFQ

Bulk - Active Adapter, Breakout Boards 23 Pieces (4 Values - Mixed Quantities) QSOP, TSSOP28, XFBGA, XQFN SMD to DIP
OM13497UL

OM13497UL

SURFACE MOUNT TO DIP EVALUATION

NXP USA Inc.
3,220 -

RFQ

Bulk - Active Adapter, Breakout Boards 18 Pieces (3 Values - 6 Each) HTSSOP, VFBGA, XFBGA SMD to DIP
OM13492UL

OM13492UL

SURFACE MOUNT TO DIP EVALUATION

NXP USA Inc.
2,493 -

RFQ

Bulk - Obsolete Adapter, Breakout Boards 42 Pieces (7 Values - 6 Each) HVSON, MSOP, PCT, TSOP, TSSOP, XSON, WLCSP SMD to DIP
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Usuário