Térmico - dissipadores de calor

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type PackageCooled AttachmentMethod Shape Length Width Diameter FinHeight PowerDissipation@TemperatureRise ThermalResistance@ForcedAirFlow ThermalResistance@Natural Material
ACC-HS4-SET

ACC-HS4-SET

ACC HEATSINK ME ACC-HS4

Enclustra FPGA Solutions
3,864 -

RFQ

Box ACC-HS4 Active - Bolt On Rectangular 2.913 (74.00mm) 2.126 (54.00mm) - 0.571 (14.50mm) - - - -
HS-ZX-SET-R2

HS-ZX-SET-R2

ACC HEATSINK MA-ZX*/AX3

Enclustra FPGA Solutions
3,086 -

RFQ

Box - Active - - - - - - - - - - -
HS-XU3-SET-R2

HS-XU3-SET-R2

ACC HEATSINK MA-XU3

Enclustra FPGA Solutions
2,318 -

RFQ

Box Mars XU3 Active - - - - - - - - - - -
ACC-HS3-SET

ACC-HS3-SET

ACC HEATSINK ME ACC-HS3

Enclustra FPGA Solutions
2,245 -

RFQ

Box ACC-HS3 Active - Bolt On Rectangular 2.205 (56.00mm) 1.063 (27.00mm) - 0.571 (14.50mm) - - - -
HS-MA3-R1-SET-R1

HS-MA3-R1-SET-R1

HEATSINK MARS MA3

Enclustra FPGA Solutions
2,317 -

RFQ

Bag Mars MA3 Active Top Mount - - - - - - - - - -
HS-ZX-R1-SET-R1

HS-ZX-R1-SET-R1

HEATSINK MARS ZX2 ZX3

Enclustra FPGA Solutions
2,873 -

RFQ

Bag Mars ZX2, ZX3 Active Top Mount - - - - - - - - - -
HS-XU3-R1-SET-R1

HS-XU3-R1-SET-R1

HEATSINK MARS XU3

Enclustra FPGA Solutions
3,415 -

RFQ

Bag Mars XU3 Active Top Mount - - - - - - - - - -
EN104037

EN104037

ACC HEATSINK MA-MA3

Enclustra FPGA Solutions
2,395 -

RFQ

Box Mars MA3 Obsolete - - - - - - - - - - -
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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