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Acessórios
| Foto: | Número da peça do fabricante | Disponibilidade | Preço | Quantidade | Ficha técnica | Packaging | Series | ProductStatus | AccessoryType |
|---|---|---|---|---|---|---|---|---|---|
|
ID106FC, 3.1W AMPLIFIER BOARD, 12V DC iBASE Technology |
3,116 | - |
RFQ |
Box | - | Active | Amplifier Board | |
|
|
LCM CABLEAC, IIO2 LCM MODULE CABLE (C501E iBASE Technology |
3,790 | - |
RFQ |
Box | - | Active | Cable | |
|
|
USB-74BAC, INTERNAL USB 2.0 CABLE, 2-PO iBASE Technology |
3,075 | - |
RFQ |
Box | - | Active | Cable | |
|
|
IB881R-PWFC, ATX POWER BOARD FOR IB881 SE iBASE Technology |
2,791 | - |
RFQ |
Box | - | Active | Power Board | |
|
|
IB881R-SWFC, ATX POWER SWITCH BOARD FOR I iBASE Technology |
3,945 | - |
RFQ |
Box | - | Active | Power Switch Board | |
|
FWA8208-HDAC, 2.5 DUAL HDD-BRT-KIT + CABL iBASE Technology |
2,935 | - |
RFQ |
Box | - | Active | Bracket Kit | |
|
|
ID108FC, 6W AMPLIFIER BOARD, 12V DC-I iBASE Technology |
2,611 | - |
RFQ |
Box | - | Active | Amplifier Board | |
|
|
IP117FC, PCIE(16X) X 1 RISER CARD, NO iBASE Technology |
2,249 | - |
RFQ |
Box | - | Active | - | |
|
|
HEATSINK CPU BGA1310AC, CPU HEATSINK BGA1310 FOR MBN iBASE Technology |
3,371 | - |
RFQ |
Box | - | Active | Heat Sink | |
|
|
RG1100AC, COOLER HEATSINK FOR INTEL SO iBASE Technology |
2,711 | - |
RFQ |
Box | - | Active | Heat Sink | |
|
|
ID724LVDS/DVI EXTENSION CARD iBASE Technology |
2,755 | - |
RFQ |
Box | - | Active | Extension Card | |
|
|
H052LGA1155001000PAC, COOLER HEATSINK FOR INTEL SO iBASE Technology |
3,944 | - |
RFQ |
Box | - | Active | Heat Sink | |
|
|
HEATSINK CPU LGA1156AC, CPU HEATSINK LAG1156 FOR MB9 iBASE Technology |
2,794 | - |
RFQ |
Box | - | Active | Heat Sink | |
|
|
IP430FC, PCIE(16E) TO PCIE(8X) X 1 SL iBASE Technology |
2,137 | - |
RFQ |
Box | - | Active | - | |
|
|
ECC-01008-02-GPAC, COOLER HEATSINK FOR INTEL RP iBASE Technology |
2,306 | - |
RFQ |
Box | - | Active | Heat Sink | |
|
|
IIO2AC, 16X2 LCM MODULE WITH 4 BUTTO iBASE Technology |
2,672 | - |
RFQ |
Box | - | Active | LCM Module | |
|
|
H052SK1156ECCS000PAC, COOLER HEATSINK FOR INTEL SO iBASE Technology |
2,005 | - |
RFQ |
Box | - | Active | Heat Sink | |
|
|
ID386FC, XILINX XC3S200AN FPGA THRU L iBASE Technology |
2,011 | - |
RFQ |
Box | - | Active | - | |
|
|
ID460AC, DC CONVERTER, INPUT +19V, OU iBASE Technology |
2,038 | - |
RFQ |
Box | - | Active | Convertor | |
|
|
IIOAC, 16X2 LCM MODULE WITH 5 BUTTO iBASE Technology |
2,158 | - |
RFQ |
Box | - | Active | LCM Module |
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