Adaptador, placas de breakout

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus ProtoBoardType PackageAccepted NumberofPositions Pitch BoardThickness Material
DIP600T300P06

DIP600T300P06

DIP-6 (0.6 BODY) TO DIP-6 (0.3

Chip Quik Inc.
268 -

RFQ

DIP600T300P06

Ficha técnica

Bulk Proto-Advantage Active DIP to DIP - 6 0.100 (2.54mm) 0.063 (1.60mm) FR4 Epoxy Glass
DIP300T600P06

DIP300T600P06

DIP-6 (0.3 BODY) TO DIP-6 (0.6

Chip Quik Inc.
130 -

RFQ

DIP300T600P06

Ficha técnica

Bulk Proto-Advantage Active DIP to DIP - 6 0.100 (2.54mm) 0.063 (1.60mm) FR4 Epoxy Glass
DIP300T600P08

DIP300T600P08

DIP-8 (0.3 BODY) TO DIP-8 (0.6

Chip Quik Inc.
3,647 -

RFQ

DIP300T600P08

Ficha técnica

Bulk Proto-Advantage Active DIP to DIP - 8 0.100 (2.54mm) 0.063 (1.60mm) FR4 Epoxy Glass
DIP300T600P18

DIP300T600P18

DIP-18 (0.3 BODY) TO DIP-18 (0.

Chip Quik Inc.
2,631 -

RFQ

DIP300T600P18

Ficha técnica

Bulk Proto-Advantage Active DIP to DIP - 18 0.100 (2.54mm) 0.063 (1.60mm) FR4 Epoxy Glass
DIP300T600P20

DIP300T600P20

DIP-20 (0.3 BODY) TO DIP-20 (0.

Chip Quik Inc.
3,447 -

RFQ

DIP300T600P20

Ficha técnica

Bulk Proto-Advantage Active DIP to DIP - 20 0.100 (2.54mm) 0.063 (1.60mm) FR4 Epoxy Glass
DC2917J-10X

DC2917J-10X

DISCRETE 2917 TO TH ADAPTER - JU

Chip Quik Inc.
2,248 -

RFQ

DC2917J-10X

Ficha técnica

Bulk Proto-Advantage Active SMD to Plated Through Hole 2917 2 0.244 (6.20mm) - FR4 Epoxy Glass
DC2924J-10X

DC2924J-10X

DISCRETE 2924 TO TH ADAPTER - JU

Chip Quik Inc.
2,470 -

RFQ

DC2924J-10X

Ficha técnica

Bulk Proto-Advantage Active SMD to Plated Through Hole 2924 2 0.245 (6.22mm) - FR4 Epoxy Glass
DIP600T300P24

DIP600T300P24

DIP-24 (0.6 BODY) TO DIP-24 (0.

Chip Quik Inc.
3,113 -

RFQ

DIP600T300P24

Ficha técnica

Bulk Proto-Advantage Active DIP to DIP - 24 0.100 (2.54mm) 0.063 (1.60mm) FR4 Epoxy Glass
CN0010

CN0010

USB - MINI B ADAPTER BOARD

Chip Quik Inc.
3,145 -

RFQ

CN0010

Ficha técnica

Bulk Proto-Advantage Active Connector to SIP USB - mini B 5 - 0.062 (1.57mm) 1/16 FR4 Epoxy Glass
DIP300T600P26

DIP300T600P26

DIP-26 (0.3 BODY) TO DIP-26 (0.

Chip Quik Inc.
3,331 -

RFQ

DIP300T600P26

Ficha técnica

Bulk Proto-Advantage Active DIP to DIP - 26 0.100 (2.54mm) 0.063 (1.60mm) FR4 Epoxy Glass
DIP600T300P28

DIP600T300P28

DIP-28 (0.6 BODY) TO DIP-28 (0.

Chip Quik Inc.
2,098 -

RFQ

DIP600T300P28

Ficha técnica

Bulk Proto-Advantage Active DIP to DIP - 28 0.100 (2.54mm) 0.063 (1.60mm) FR4 Epoxy Glass
DIP900T600P48

DIP900T600P48

DIP-48 (0.9 BODY) TO DIP-48 (0.

Chip Quik Inc.
2,028 -

RFQ

DIP900T600P48

Ficha técnica

Bulk Proto-Advantage Active DIP to DIP - 48 0.100 (2.54mm) 0.063 (1.60mm) FR4 Epoxy Glass
BGA0029

BGA0029

BGA-36 TO DIP-36 SMT ADAPTER (0.

Chip Quik Inc.
3,360 -

RFQ

BGA0029

Ficha técnica

Bulk Proto-Advantage Active SMD to DIP BGA 36 0.014 (0.35mm) 0.063 (1.60mm) FR4 Epoxy Glass
BGA0033

BGA0033

BGA-144 TO PGA-144 SMT ADAPTER (

Chip Quik Inc.
3,801 -

RFQ

BGA0033

Ficha técnica

Bulk Proto-Advantage Active SMD to Plated Through Hole Board BGA 144 0.020 (0.50mm) 0.063 (1.60mm) FR4 Epoxy Glass
DIP600T300P10

DIP600T300P10

DIP-10 (0.6 BODY) TO DIP-10 (0.

Chip Quik Inc.
2,871 -

RFQ

DIP600T300P10

Ficha técnica

Bulk Proto-Advantage Active DIP to DIP - 10 0.100 (2.54mm) 0.063 (1.60mm) FR4 Epoxy Glass
DIP600T300P12

DIP600T300P12

DIP-12 (0.6 BODY) TO DIP-12 (0.

Chip Quik Inc.
2,331 -

RFQ

DIP600T300P12

Ficha técnica

Bulk Proto-Advantage Active DIP to DIP - 12 0.100 (2.54mm) 0.063 (1.60mm) FR4 Epoxy Glass
DIP600T300P16

DIP600T300P16

DIP-16 (0.6 BODY) TO DIP-16 (0.

Chip Quik Inc.
2,647 -

RFQ

DIP600T300P16

Ficha técnica

Bulk Proto-Advantage Active DIP to DIP - 16 0.100 (2.54mm) 0.063 (1.60mm) FR4 Epoxy Glass
DIP600T300P20

DIP600T300P20

DIP-20 (0.6 BODY) TO DIP-20 (0.

Chip Quik Inc.
2,253 -

RFQ

DIP600T300P20

Ficha técnica

Bulk Proto-Advantage Active DIP to DIP - 20 0.100 (2.54mm) 0.063 (1.60mm) FR4 Epoxy Glass
DIP600T300P26

DIP600T300P26

DIP-26 (0.6 BODY) TO DIP-26 (0.

Chip Quik Inc.
3,562 -

RFQ

DIP600T300P26

Ficha técnica

Bulk Proto-Advantage Active DIP to DIP - 26 0.100 (2.54mm) 0.063 (1.60mm) FR4 Epoxy Glass
PA0106C-P-R

PA0106C-P-R

PLCC-28 TO PGA-28 PIN 1 OUT SMT

Chip Quik Inc.
100 -

RFQ

PA0106C-P-R

Ficha técnica

Bulk - Active SMD to PGA LCC, JLCC, PLCC 28 0.050 (1.27mm) - FR4 Epoxy Glass
Total 1005 Record«Prev1... 4567891011...51Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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