Incorporado - FPGAs (matriz de portas programáveis ​​em campo)

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Package/Case Packaging Series ProductStatus NumberofLABs/CLBs NumberofLogicElements/Cells TotalRAMBits NumberofI/O NumberofGates Voltage-Supply MountingType OperatingTemperature
XC3S5000-5FG676C

XC3S5000-5FG676C

IC FPGA 489 I/O 676FCBGA

AMD Xilinx
2,087 -

RFQ

XC3S5000-5FG676C

Ficha técnica

676-BGA Bulk Spartan®-3 Active 8320 74880 1916928 489 5000000 1.14V ~ 1.26V Surface Mount 0°C ~ 85°C (TJ)
XC7A200T-L1FB484I

XC7A200T-L1FB484I

IC FPGA 285 I/O 484FCBGA

AMD Xilinx
2,163 -

RFQ

XC7A200T-L1FB484I

Ficha técnica

484-BBGA, FCBGA Tube Artix-7 Active 16825 215360 13455360 285 - 0.95V ~ 1.05V Surface Mount -40°C ~ 100°C (TJ)
LFE2M70E-6FN1152C

LFE2M70E-6FN1152C

IC FPGA 436 I/O 1152FBGA

Lattice Semiconductor Corporation
2,553 -

RFQ

LFE2M70E-6FN1152C

Ficha técnica

1152-BBGA Tray ECP2M Not For New Designs 8375 67000 4642816 436 - 1.14V ~ 1.26V Surface Mount 0°C ~ 85°C (TJ)
LFE2M70E-5FN1152I

LFE2M70E-5FN1152I

IC FPGA 436 I/O 1152FBGA

Lattice Semiconductor Corporation
2,278 -

RFQ

LFE2M70E-5FN1152I

Ficha técnica

1152-BBGA Tray ECP2M Not For New Designs 8375 67000 4642816 436 - 1.14V ~ 1.26V Surface Mount -40°C ~ 100°C (TJ)
LFE2M70SE-6FN1152C

LFE2M70SE-6FN1152C

IC FPGA 436 I/O 1152FBGA

Lattice Semiconductor Corporation
3,730 -

RFQ

LFE2M70SE-6FN1152C

Ficha técnica

1152-BBGA Tray ECP2M Not For New Designs 8375 67000 4642816 436 - 1.14V ~ 1.26V Surface Mount 0°C ~ 85°C (TJ)
LFE2M70SE-5FN1152I

LFE2M70SE-5FN1152I

IC FPGA 436 I/O 1152FBGA

Lattice Semiconductor Corporation
3,817 -

RFQ

LFE2M70SE-5FN1152I

Ficha técnica

1152-BBGA Tray ECP2M Not For New Designs 8375 67000 4642816 436 - 1.14V ~ 1.26V Surface Mount -40°C ~ 100°C (TJ)
A42MX16-2TQG176I

A42MX16-2TQG176I

IC FPGA 140 I/O 176TQFP

Microchip Technology
3,895 -

RFQ

A42MX16-2TQG176I

Ficha técnica

176-LQFP Tray MX Active - - - 140 24000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA)
A42MX16-3TQG176

A42MX16-3TQG176

IC FPGA 140 I/O 176TQFP

Microchip Technology
2,022 -

RFQ

A42MX16-3TQG176

Ficha técnica

176-LQFP Tray MX Active - - - 140 24000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA)
A3P1000-1FG484M

A3P1000-1FG484M

IC FPGA 300 I/O 484FBGA

Microchip Technology
2,424 -

RFQ

A3P1000-1FG484M

Ficha técnica

484-BGA Tray ProASIC3 Active - - 147456 300 1000000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TJ)
A3P1000-1FGG484M

A3P1000-1FGG484M

IC FPGA 300 I/O 484FBGA

Microchip Technology
2,056 -

RFQ

A3P1000-1FGG484M

Ficha técnica

484-BGA Tray ProASIC3 Active - - 147456 300 1000000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TJ)
A3P1000-2FG256M

A3P1000-2FG256M

IC FPGA 177 I/O 256FBGA

Microchip Technology
3,008 -

RFQ

A3P1000-2FG256M

Ficha técnica

256-LBGA Tray ProASIC3 Active - - 147456 177 1000000 1.14V ~ 1.575V Surface Mount -55°C ~ 125°C (TJ)
A3P1000-2FGG256M

A3P1000-2FGG256M

IC FPGA 177 I/O 256FBGA

Microchip Technology
2,873 -

RFQ

A3P1000-2FGG256M

Ficha técnica

256-LBGA Tray ProASIC3 Active - - 147456 177 1000000 1.14V ~ 1.575V Surface Mount -55°C ~ 125°C (TJ)
M1AFS600-2FGG256I

M1AFS600-2FGG256I

IC FPGA 119 I/O 256FBGA

Microchip Technology
3,341 -

RFQ

M1AFS600-2FGG256I

Ficha técnica

256-LBGA Tray Fusion® Active - - 110592 119 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ)
P1AFS600-2FGG256I

P1AFS600-2FGG256I

IC FPGA 119 I/O 256FBGA

Microchip Technology
2,087 -

RFQ

P1AFS600-2FGG256I

Ficha técnica

256-LBGA Tray Fusion® Active - - 110592 119 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ)
AFS600-2FG256I

AFS600-2FG256I

IC FPGA 119 I/O 256FBGA

Microchip Technology
2,411 -

RFQ

AFS600-2FG256I

Ficha técnica

256-LBGA Tray Fusion® Active - - 110592 119 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ)
P1AFS600-2FG256I

P1AFS600-2FG256I

IC FPGA 119 I/O 256FBGA

Microchip Technology
3,795 -

RFQ

P1AFS600-2FG256I

Ficha técnica

256-LBGA Tray Fusion® Active - - 110592 119 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ)
AFS600-2FGG256I

AFS600-2FGG256I

IC FPGA 119 I/O 256FBGA

Microchip Technology
3,743 -

RFQ

AFS600-2FGG256I

Ficha técnica

256-LBGA Tray Fusion® Active - - 110592 119 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ)
M1AFS600-2FG256I

M1AFS600-2FG256I

IC FPGA 119 I/O 256FBGA

Microchip Technology
3,328 -

RFQ

M1AFS600-2FG256I

Ficha técnica

256-LBGA Tray Fusion® Active - - 110592 119 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ)
A54SX16P-1TQG176

A54SX16P-1TQG176

IC FPGA 147 I/O 176TQFP

Microchip Technology
3,413 -

RFQ

A54SX16P-1TQG176

Ficha técnica

176-LQFP Tray SX Active 1452 - - 147 24000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA)
XC6SLX150-3FGG676I

XC6SLX150-3FGG676I

IC FPGA 498 I/O 676FBGA

AMD Xilinx
3,082 -

RFQ

XC6SLX150-3FGG676I

Ficha técnica

676-BGA Tray Spartan®-6 LX Active 11519 147443 4939776 498 - 1.14V ~ 1.26V Surface Mount -40°C ~ 100°C (TJ)
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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