Incorporado - Microprocessadores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Package/Case Packaging Series ProductStatus CoreProcessor NumberofCores/BusWidth Speed Co-Processors/DSP RAMControllers GraphicsAcceleration Display&InterfaceControllers Ethernet SATA USB Voltage-I/O OperatingTemperature SecurityFeatures
MC68360CEM25L

MC68360CEM25L

IC MPU M683XX 25MHZ 240FQFP

NXP USA Inc.
2,961 -

RFQ

MC68360CEM25L

Ficha técnica

240-BFQFP Tray M683xx Obsolete CPU32+ 1 Core, 32-Bit 25MHz Communications; CPM DRAM No - 10Mbps (1) - - 5.0V -40°C ~ 85°C (TA) -
MC68360EM33L

MC68360EM33L

IC MPU M683XX 33MHZ 240FQFP

NXP USA Inc.
3,049 -

RFQ

MC68360EM33L

Ficha técnica

240-BFQFP Tray M683xx Obsolete CPU32+ 1 Core, 32-Bit 33MHz Communications; CPM DRAM No - 10Mbps (1) - - 5.0V 0°C ~ 70°C (TA) -
MC68360ZP25L

MC68360ZP25L

IC MPU M683XX 25MHZ 357BGA

NXP USA Inc.
2,359 -

RFQ

MC68360ZP25L

Ficha técnica

357-BGA Tray M683xx Obsolete CPU32+ 1 Core, 32-Bit 25MHz Communications; CPM DRAM No - 10Mbps (1) - - 5.0V 0°C ~ 70°C (TA) -
MC68360ZP25VL

MC68360ZP25VL

IC MPU M683XX 25MHZ 357BGA

NXP USA Inc.
2,647 -

RFQ

MC68360ZP25VL

Ficha técnica

357-BGA Tray M683xx Obsolete CPU32+ 1 Core, 32-Bit 25MHz Communications; CPM DRAM No - 10Mbps (1) - - 3.3V 0°C ~ 70°C (TA) -
MC68EN360CEM25L

MC68EN360CEM25L

IC MPU M683XX 25MHZ 240FQFP

NXP USA Inc.
2,159 -

RFQ

MC68EN360CEM25L

Ficha técnica

240-BFQFP Tray M683xx Obsolete CPU32+ 1 Core, 32-Bit 25MHz Communications; CPM DRAM No - 10Mbps (1) - - 5.0V -40°C ~ 85°C (TA) -
MC68EN360ZP25L

MC68EN360ZP25L

IC MPU M683XX 25MHZ 357BGA

NXP USA Inc.
2,853 -

RFQ

MC68EN360ZP25L

Ficha técnica

357-BGA Tray M683xx Obsolete CPU32+ 1 Core, 32-Bit 25MHz Communications; CPM DRAM No - 10Mbps (1) - - 5.0V 0°C ~ 70°C (TA) -
MC68LC302CPU16CT

MC68LC302CPU16CT

IC MPU M683XX 16MHZ 100LQFP

NXP USA Inc.
3,790 -

RFQ

MC68LC302CPU16CT

Ficha técnica

100-LQFP Tray M683xx Obsolete M68000 1 Core, 8/16-Bit 16MHz Communications; RISC CPM DRAM No - - - - 5.0V -40°C ~ 85°C (TA) -
MC68LC302CPU20CT

MC68LC302CPU20CT

IC MPU M683XX 20MHZ 100LQFP

NXP USA Inc.
2,390 -

RFQ

MC68LC302CPU20CT

Ficha técnica

100-LQFP Tray M683xx Obsolete M68000 1 Core, 8/16-Bit 20MHz Communications; RISC CPM DRAM No - - - - 5.0V -40°C ~ 85°C (TA) -
MC68LC302PU16VCT

MC68LC302PU16VCT

IC MPU M683XX 16MHZ 100LQFP

NXP USA Inc.
2,581 -

RFQ

MC68LC302PU16VCT

Ficha técnica

100-LQFP Tray M683xx Obsolete M68000 1 Core, 8/16-Bit 16MHz Communications; RISC CPM DRAM No - - - - 3.3V 0°C ~ 70°C (TA) -
MC68LC302PU20VCT

MC68LC302PU20VCT

IC MPU M683XX 20MHZ 100LQFP

NXP USA Inc.
3,733 -

RFQ

MC68LC302PU20VCT

Ficha técnica

100-LQFP Tray M683xx Obsolete M68000 1 Core, 8/16-Bit 20MHz Communications; RISC CPM DRAM No - - - - 3.3V 0°C ~ 70°C (TA) -
MC68MH360EM25L

MC68MH360EM25L

IC MPU M683XX 25MHZ 240FQFP

NXP USA Inc.
2,924 -

RFQ

240-BFQFP Tray M683xx Obsolete CPU32+ 1 Core, 32-Bit 25MHz Communications; CPM DRAM No - 10Mbps (1) - - 5.0V 0°C ~ 70°C (TA) -
MC68MH360EM33L

MC68MH360EM33L

IC MPU M683XX 33MHZ 240FQFP

NXP USA Inc.
3,422 -

RFQ

240-BFQFP Tray M683xx Obsolete CPU32+ 1 Core, 32-Bit 33MHz Communications; CPM DRAM No - 10Mbps (1) - - 5.0V 0°C ~ 70°C (TA) -
MC68MH360ZP25VL

MC68MH360ZP25VL

IC MPU M683XX 25MHZ 357BGA

NXP USA Inc.
2,337 -

RFQ

MC68MH360ZP25VL

Ficha técnica

357-BGA Tray M683xx Obsolete CPU32+ 1 Core, 32-Bit 25MHz Communications; CPM DRAM No - 10Mbps (1) - - 3.3V 0°C ~ 70°C (TA) -
MPC8260ACZUMHBB

MPC8260ACZUMHBB

IC MPU MPC82XX 266MHZ 480TBGA

NXP USA Inc.
3,417 -

RFQ

MPC8260ACZUMHBB

Ficha técnica

480-LBGA Exposed Pad Tray MPC82xx Obsolete PowerPC G2 1 Core, 32-Bit 266MHz Communications; RISC CPM DRAM, SDRAM No - 10/100Mbps (3) - - 3.3V -40°C ~ 105°C (TA) -
MPC8260AZUMHBB

MPC8260AZUMHBB

IC MPU MPC82XX 266MHZ 480TBGA

NXP USA Inc.
166 -

RFQ

MPC8260AZUMHBB

Ficha técnica

480-LBGA Exposed Pad Tray,Tray MPC82xx Obsolete PowerPC G2 1 Core, 32-Bit 266MHz Communications; RISC CPM DRAM, SDRAM No - 10/100Mbps (3) - - 3.3V 0°C ~ 105°C (TA) -
MPC8260AZUPJDB

MPC8260AZUPJDB

IC MPU MPC82XX 300MHZ 480TBGA

NXP USA Inc.
2,077 -

RFQ

MPC8260AZUPJDB

Ficha técnica

480-LBGA Exposed Pad Tray MPC82xx Obsolete PowerPC G2 1 Core, 32-Bit 300MHz Communications; RISC CPM DRAM, SDRAM No - 10/100Mbps (3) - - 3.3V 0°C ~ 105°C (TA) -
MPC8264AZUPIBB

MPC8264AZUPIBB

IC MPU MPC82XX 300MHZ 480TBGA

NXP USA Inc.
2,132 -

RFQ

MPC8264AZUPIBB

Ficha técnica

480-LBGA Exposed Pad Tray MPC82xx Obsolete PowerPC G2 1 Core, 32-Bit 300MHz Communications; RISC CPM DRAM, SDRAM No - 10/100Mbps (3) - - 3.3V 0°C ~ 105°C (TA) -
MPC852TVR100

MPC852TVR100

IC MPU MPC8XX 100MHZ 256BGA

NXP USA Inc.
2,430 -

RFQ

MPC852TVR100

Ficha técnica

256-BBGA Tray MPC8xx Obsolete MPC8xx 1 Core, 32-Bit 100MHz Communications; CPM DRAM No - 10Mbps (1) - - 3.3V 0°C ~ 95°C (TA) -
MPC852TVR66

MPC852TVR66

IC MPU MPC8XX 66MHZ 256BGA

NXP USA Inc.
3,754 -

RFQ

MPC852TVR66

Ficha técnica

256-BBGA Tray MPC8xx Obsolete MPC8xx 1 Core, 32-Bit 66MHz Communications; CPM DRAM No - 10Mbps (1) - - 3.3V 0°C ~ 95°C (TA) -
MCF5206EFT54

MCF5206EFT54

IC MCU 32BIT ROMLESS 160QFP

NXP USA Inc.
3,479 -

RFQ

MCF5206EFT54

Ficha técnica

160-BQFP Tray MCF520x Obsolete Coldfire V2 1 Core, 32-Bit 54MHz - DRAM - - - - - 3.3V 0°C ~ 70°C (TA) -
Total 9979 Record«Prev1... 324325326327328329330331...499Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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