Incorporado - Microprocessadores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Package/Case Packaging Series ProductStatus CoreProcessor NumberofCores/BusWidth Speed Co-Processors/DSP RAMControllers GraphicsAcceleration Display&InterfaceControllers Ethernet SATA USB Voltage-I/O OperatingTemperature SecurityFeatures
MC68LC302PU20VCT

MC68LC302PU20VCT

IC MPU M683XX 20MHZ 100LQFP

NXP USA Inc.
3,733 -

RFQ

MC68LC302PU20VCT

Ficha técnica

100-LQFP Tray M683xx Obsolete M68000 1 Core, 8/16-Bit 20MHz Communications; RISC CPM DRAM No - - - - 3.3V 0°C ~ 70°C (TA) -
MC68MH360EM25L

MC68MH360EM25L

IC MPU M683XX 25MHZ 240FQFP

NXP USA Inc.
2,924 -

RFQ

240-BFQFP Tray M683xx Obsolete CPU32+ 1 Core, 32-Bit 25MHz Communications; CPM DRAM No - 10Mbps (1) - - 5.0V 0°C ~ 70°C (TA) -
MC68MH360EM33L

MC68MH360EM33L

IC MPU M683XX 33MHZ 240FQFP

NXP USA Inc.
3,422 -

RFQ

240-BFQFP Tray M683xx Obsolete CPU32+ 1 Core, 32-Bit 33MHz Communications; CPM DRAM No - 10Mbps (1) - - 5.0V 0°C ~ 70°C (TA) -
MC68MH360ZP25VL

MC68MH360ZP25VL

IC MPU M683XX 25MHZ 357BGA

NXP USA Inc.
2,337 -

RFQ

MC68MH360ZP25VL

Ficha técnica

357-BGA Tray M683xx Obsolete CPU32+ 1 Core, 32-Bit 25MHz Communications; CPM DRAM No - 10Mbps (1) - - 3.3V 0°C ~ 70°C (TA) -
MPC8260ACZUMHBB

MPC8260ACZUMHBB

IC MPU MPC82XX 266MHZ 480TBGA

NXP USA Inc.
3,417 -

RFQ

MPC8260ACZUMHBB

Ficha técnica

480-LBGA Exposed Pad Tray MPC82xx Obsolete PowerPC G2 1 Core, 32-Bit 266MHz Communications; RISC CPM DRAM, SDRAM No - 10/100Mbps (3) - - 3.3V -40°C ~ 105°C (TA) -
MPC8260AZUMHBB

MPC8260AZUMHBB

IC MPU MPC82XX 266MHZ 480TBGA

NXP USA Inc.
166 -

RFQ

MPC8260AZUMHBB

Ficha técnica

480-LBGA Exposed Pad Tray,Tray MPC82xx Obsolete PowerPC G2 1 Core, 32-Bit 266MHz Communications; RISC CPM DRAM, SDRAM No - 10/100Mbps (3) - - 3.3V 0°C ~ 105°C (TA) -
MPC8260AZUPJDB

MPC8260AZUPJDB

IC MPU MPC82XX 300MHZ 480TBGA

NXP USA Inc.
2,077 -

RFQ

MPC8260AZUPJDB

Ficha técnica

480-LBGA Exposed Pad Tray MPC82xx Obsolete PowerPC G2 1 Core, 32-Bit 300MHz Communications; RISC CPM DRAM, SDRAM No - 10/100Mbps (3) - - 3.3V 0°C ~ 105°C (TA) -
MPC8264AZUPIBB

MPC8264AZUPIBB

IC MPU MPC82XX 300MHZ 480TBGA

NXP USA Inc.
2,132 -

RFQ

MPC8264AZUPIBB

Ficha técnica

480-LBGA Exposed Pad Tray MPC82xx Obsolete PowerPC G2 1 Core, 32-Bit 300MHz Communications; RISC CPM DRAM, SDRAM No - 10/100Mbps (3) - - 3.3V 0°C ~ 105°C (TA) -
MPC852TVR100

MPC852TVR100

IC MPU MPC8XX 100MHZ 256BGA

NXP USA Inc.
2,430 -

RFQ

MPC852TVR100

Ficha técnica

256-BBGA Tray MPC8xx Obsolete MPC8xx 1 Core, 32-Bit 100MHz Communications; CPM DRAM No - 10Mbps (1) - - 3.3V 0°C ~ 95°C (TA) -
MPC852TVR66

MPC852TVR66

IC MPU MPC8XX 66MHZ 256BGA

NXP USA Inc.
3,754 -

RFQ

MPC852TVR66

Ficha técnica

256-BBGA Tray MPC8xx Obsolete MPC8xx 1 Core, 32-Bit 66MHz Communications; CPM DRAM No - 10Mbps (1) - - 3.3V 0°C ~ 95°C (TA) -
MCF5206EFT54

MCF5206EFT54

IC MCU 32BIT ROMLESS 160QFP

NXP USA Inc.
3,479 -

RFQ

MCF5206EFT54

Ficha técnica

160-BQFP Tray MCF520x Obsolete Coldfire V2 1 Core, 32-Bit 54MHz - DRAM - - - - - 3.3V 0°C ~ 70°C (TA) -
MCF5206EFT40

MCF5206EFT40

IC MCU 32BIT ROMLESS 160QFP

NXP USA Inc.
2,136 -

RFQ

MCF5206EFT40

Ficha técnica

160-BQFP Tray MCF520x Obsolete Coldfire V2 1 Core, 32-Bit 40MHz - DRAM - - - - - 3.3V 0°C ~ 70°C (TA) -
MCF5206ECFT40

MCF5206ECFT40

IC MCU 32BIT ROMLESS 160QFP

NXP USA Inc.
2,239 -

RFQ

MCF5206ECFT40

Ficha técnica

160-BQFP Tray MCF520x Obsolete Coldfire V2 1 Core, 32-Bit 40MHz - DRAM - - - - - 3.3V -40°C ~ 85°C (TA) -
MC68340FE25E

MC68340FE25E

IC MPU M683XX 25MHZ 144CQFP

NXP USA Inc.
2,790 -

RFQ

MC68340FE25E

Ficha técnica

144-BCQFP Tray M683xx Obsolete CPU32 1 Core, 32-Bit 25MHz - DRAM No - - - - 5.0V 0°C ~ 70°C (TA) -
MC68340PV16VE

MC68340PV16VE

IC MPU M683XX 16MHZ 144LQFP

NXP USA Inc.
3,232 -

RFQ

MC68340PV16VE

Ficha técnica

144-LQFP Tray M683xx Obsolete CPU32 1 Core, 32-Bit 16MHz - DRAM No - - - - 3.3V 0°C ~ 70°C (TA) -
MC68MH360ZP25L

MC68MH360ZP25L

IC MPU M683XX 25MHZ 357BGA

NXP USA Inc.
3,788 -

RFQ

357-BGA Tray M683xx Obsolete CPU32+ 1 Core, 32-Bit 25MHz Communications; CPM DRAM No - 10Mbps (1) - - 5.0V 0°C ~ 70°C (TA) -
MC68MH360ZP33L

MC68MH360ZP33L

IC MPU M683XX 33MHZ 357BGA

NXP USA Inc.
3,247 -

RFQ

357-BGA Tray M683xx Obsolete CPU32+ 1 Core, 32-Bit 33MHz Communications; CPM DRAM No - 10Mbps (1) - - 5.0V 0°C ~ 70°C (TA) -
MC68SEC000FU20

MC68SEC000FU20

IC MPU M680X0 20MHZ 64QFP

NXP USA Inc.
2,870 -

RFQ

MC68SEC000FU20

Ficha técnica

64-QFP Tray M680x0 Obsolete EC000 1 Core, 32-Bit 20MHz - - No - - - - 3.3V, 5.0V 0°C ~ 70°C (TA) -
MC9328MX1DVH20

MC9328MX1DVH20

IC MPU I.MX1 200MHZ 256MAPBGA

NXP USA Inc.
2,608 -

RFQ

MC9328MX1DVH20

Ficha técnica

256-LFBGA Tray i.MX1 Obsolete ARM920T 1 Core, 32-Bit 200MHz - SDRAM No LCD, Touch Panel - - USB 1.x (1) 1.8V, 3.0V -30°C ~ 70°C (TA) -
MC9328MX1VH20

MC9328MX1VH20

IC MPU I.MX1 200MHZ 256MAPBGA

NXP USA Inc.
2,429 -

RFQ

MC9328MX1VH20

Ficha técnica

256-LFBGA Tray i.MX1 Obsolete ARM920T 1 Core, 32-Bit 200MHz - SDRAM No LCD, Touch Panel - - USB 1.x (1) 1.8V, 3.0V 0°C ~ 70°C (TA) -
Total 5346 Record«Prev1... 949596979899100101...268Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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