PMIC - Gerenciamento de energia - Especializado

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Applications Current-Supply Voltage-Supply OperatingTemperature MountingType
MVR5510AVMA0EP

MVR5510AVMA0EP

IC PMIC VR5510 QM

NXP USA Inc.
3,064 -

RFQ

Tray Automotive, AEC-Q100 Active Automotive 15mA 2.7V ~ 60V -40°C ~ 125°C (TA) Surface Mount, Wettable Flank
MC33FS6504LAER2

MC33FS6504LAER2

SYSTEM BASIS CHIP DCDC 0.8A VCO

NXP USA Inc.
2,653 -

RFQ

MC33FS6504LAER2

Ficha técnica

Tape & Reel (TR) - Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C Surface Mount
MC33FS6522CAE

MC33FS6522CAE

SYSTEM BASIS CHIP DCDC 2.2A VCO

NXP USA Inc.
2,073 -

RFQ

MC33FS6522CAE

Ficha técnica

Bulk,Tray - Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C Surface Mount
MC33FS6523NAE

MC33FS6523NAE

SYSTEM BASIS CHIP DCDC 2.2A VCO

NXP USA Inc.
2,407 -

RFQ

MC33FS6523NAE

Ficha técnica

Tray - Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C Surface Mount
MC33FS8430G2ES

MC33FS8430G2ES

SYSTEM BASIS CHIP FS8430

NXP USA Inc.
3,813 -

RFQ

Tray * Active - - - - -
MC33FS8430G4ES

MC33FS8430G4ES

SYSTEM BASIS CHIP FS8430

NXP USA Inc.
3,848 -

RFQ

Tray * Active - - - - -
MC34FS6407NAER2

MC34FS6407NAER2

SYSTEM BASIS CHIP CAN 5V 0.7

NXP USA Inc.
3,797 -

RFQ

MC34FS6407NAER2

Ficha técnica

Tape & Reel (TR) - Active System Basis Chip 13mA 2.7V ~ 36V -40°C ~ 125°C (TA) Surface Mount
MC33FS6501CAE

MC33FS6501CAE

SYSTEM BASIS CHIP DCDC 0.8A VCO

NXP USA Inc.
3,444 -

RFQ

MC33FS6501CAE

Ficha técnica

Tray - Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C Surface Mount
MC35FS6502NAE

MC35FS6502NAE

FS6500

NXP USA Inc.
3,826 -

RFQ

MC35FS6502NAE

Ficha técnica

Tray Automotive, AEC-Q100 Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Surface Mount
MC35FS4502CAER2

MC35FS4502CAER2

FS4500

NXP USA Inc.
2,800 -

RFQ

MC35FS4502CAER2

Ficha técnica

Tape & Reel (TR) Automotive, AEC-Q100 Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Surface Mount
MC35FS6511NAE

MC35FS6511NAE

FS6500

NXP USA Inc.
2,520 -

RFQ

MC35FS6511NAE

Ficha técnica

Tray Automotive, AEC-Q100 Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Surface Mount
MC35FS6502CAER2

MC35FS6502CAER2

FS6500

NXP USA Inc.
2,203 -

RFQ

MC35FS6502CAER2

Ficha técnica

Tape & Reel (TR) Automotive, AEC-Q100 Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Surface Mount
MC33FS8510A2ES

MC33FS8510A2ES

SYSTEM BASIS CHIP FS8500

NXP USA Inc.
3,454 -

RFQ

Tray * Active - - - - -
MC33FS8510A3ES

MC33FS8510A3ES

SYSTEM BASIS CHIP FS8510

NXP USA Inc.
2,663 -

RFQ

Tray * Active - - - - -
MC33FS8510B6ES

MC33FS8510B6ES

FS8500

NXP USA Inc.
2,950 -

RFQ

Tray - Active - - - - -
MC33FS8510C4ES

MC33FS8510C4ES

FS8510

NXP USA Inc.
2,763 -

RFQ

Tray - Active - - - - -
MWCT1011BVLHR

MWCT1011BVLHR

DSC 64 LQFP 64K FLASH

NXP USA Inc.
2,966 -

RFQ

Tape & Reel (TR) - Active Wireless Charging - - - Surface Mount
MWCT1011BVLH

MWCT1011BVLH

DSC 64 LQFP 64K FLASH

NXP USA Inc.
2,539 -

RFQ

Tray - Active Wireless Charging - - - Surface Mount
MC35FS6511CAER2

MC35FS6511CAER2

FS6500

NXP USA Inc.
3,797 -

RFQ

MC35FS6511CAER2

Ficha técnica

Tape & Reel (TR) Automotive, AEC-Q100 Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Surface Mount
MC33PF8100CDES

MC33PF8100CDES

IC POWER MANAGEMENT I.MX8QM

NXP USA Inc.
3,370 -

RFQ

MC33PF8100CDES

Ficha técnica

Tray - Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) Surface Mount, Wettable Flank
Total 6701 Record«Prev1... 177178179180181182183184...336Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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