PMIC - Gerenciamento de energia - Especializado

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Applications Current-Supply Voltage-Supply OperatingTemperature MountingType
MC33911G5ACR2

MC33911G5ACR2

IC SYSTEM BASIS CHIP 32LQFP

NXP USA Inc.
3,428 -

RFQ

MC33911G5ACR2

Ficha técnica

Tape & Reel (TR) - Active System Basis Chip 4.5mA 5.5V ~ 27V -40°C ~ 125°C Surface Mount
MC32PF1550A1EP

MC32PF1550A1EP

POWER MANAGEMENT IC: 3 BUCK REGS

NXP USA Inc.
4,000 -

RFQ

Tray - Active Embedded Systems, Low-Power IoT, Mobile/Wearable Devices - 3.8V ~ 7V -40°C ~ 85°C Surface Mount
MC32PF1550A2EP

MC32PF1550A2EP

POWER MANAGEMENT IC: 3 BUCK REGS

NXP USA Inc.
3,714 -

RFQ

Tray - Active Embedded Systems, Low-Power IoT, Mobile/Wearable Devices - 3.8V ~ 7V -40°C ~ 85°C Surface Mount
MC32PF1550A3EP

MC32PF1550A3EP

POWER MANAGEMENT IC: 3 BUCK REGS

NXP USA Inc.
2,569 -

RFQ

Tray - Active Embedded Systems, Low-Power IoT, Mobile/Wearable Devices - 3.8V ~ 7V -40°C ~ 85°C Surface Mount
MC32PF1550A4EP

MC32PF1550A4EP

POWER MANAGEMENT IC: 3 BUCK REGS

NXP USA Inc.
3,706 -

RFQ

Bulk,Tray - Active Embedded Systems, Low-Power IoT, Mobile/Wearable Devices - 3.8V ~ 7V -40°C ~ 85°C Surface Mount
MC32PF1550A8EP

MC32PF1550A8EP

POWER MANAGEMENT IC 3 BUCK REGS

NXP USA Inc.
2,822 -

RFQ

MC32PF1550A8EP

Ficha técnica

Tray - Active Embedded Systems, Low-Power IoT, Mobile/Wearable Devices - 4.1V ~ 6V -40°C ~ 85°C (TA) Surface Mount
MC32PF1550A9EP

MC32PF1550A9EP

POWER MANAGEMENT IC 3 BUCK REGS

NXP USA Inc.
2,993 -

RFQ

MC32PF1550A9EP

Ficha técnica

Tray - Active Embedded Systems, Low-Power IoT, Mobile/Wearable Devices - 4.1V ~ 6V -40°C ~ 85°C (TA) Surface Mount
MC32PF1550A6EP

MC32PF1550A6EP

PF1550

NXP USA Inc.
2,496 -

RFQ

Tray - Active Embedded Systems, Low-Power IoT, Mobile/Wearable Devices - 3.8V ~ 7V -40°C ~ 85°C Surface Mount
MC33910BAC

MC33910BAC

IC SYSTEM BASIS CHIP 32LQFP

NXP USA Inc.
3,504 -

RFQ

MC33910BAC

Ficha técnica

Tray - Active System Basis Chip 4.5mA 5.5V ~ 27V -40°C ~ 125°C Surface Mount
MC34PF1510A3EP

MC34PF1510A3EP

PF1510

NXP USA Inc.
2,030 -

RFQ

MC34PF1510A3EP

Ficha técnica

Tray - Active Embedded Systems, Low-Power IoT, Mobile/Wearable Devices - 3.8V ~ 7V -40°C ~ 105°C Surface Mount
MC34912BACR2

MC34912BACR2

IC SYSTEM BASIS CHIP LIN 32-LQFP

NXP USA Inc.
3,637 -

RFQ

MC34912BACR2

Ficha técnica

Tape & Reel (TR) - Active System Basis Chip 4.5mA 5.5V ~ 18V -40°C ~ 85°C Surface Mount
MC34912G5ACR2

MC34912G5ACR2

IC SYSTEM BASIS CHIP LIN 32-LQFP

NXP USA Inc.
2,095 -

RFQ

MC34912G5ACR2

Ficha técnica

Tape & Reel (TR) - Active System Basis Chip 4.5mA 5.5V ~ 18V -40°C ~ 85°C Surface Mount
MC32PF3001A6EPR2

MC32PF3001A6EPR2

POWER MANAGEMENT IC I.MX7 PRE-

NXP USA Inc.
3,565 -

RFQ

MC32PF3001A6EPR2

Ficha técnica

Tape & Reel (TR) - Active Processor - 2.8V ~ 5.5V -40°C ~ 85°C Surface Mount
MC34PF1550A2EPR2

MC34PF1550A2EPR2

POWER MANAGEMENT IC: 3 BUCK REGS

NXP USA Inc.
3,540 -

RFQ

Tape & Reel (TR) - Active Embedded Systems, Low-Power IoT, Mobile/Wearable Devices - 3.8V ~ 7V -40°C ~ 105°C Surface Mount
MC34PF1550A3EPR2

MC34PF1550A3EPR2

POWER MANAGEMENT IC: 3 BUCK REGS

NXP USA Inc.
3,003 -

RFQ

Tape & Reel (TR) - Active Embedded Systems, Low-Power IoT, Mobile/Wearable Devices - 3.8V ~ 7V -40°C ~ 105°C Surface Mount
MC34PF1550A5EPR2

MC34PF1550A5EPR2

PF1550

NXP USA Inc.
2,397 -

RFQ

MC34PF1550A5EPR2

Ficha técnica

Tape & Reel (TR) - Active Embedded Systems, Low-Power IoT, Mobile/Wearable Devices - 3.8V ~ 7V -40°C ~ 105°C Surface Mount
MC34PF1550A6EPR2

MC34PF1550A6EPR2

PF1550

NXP USA Inc.
2,974 -

RFQ

MC34PF1550A6EPR2

Ficha técnica

Tape & Reel (TR) - Active Embedded Systems, Low-Power IoT, Mobile/Wearable Devices - 3.8V ~ 7V -40°C ~ 105°C Surface Mount
MC34PF1550A7EPR2

MC34PF1550A7EPR2

PF1550

NXP USA Inc.
3,678 -

RFQ

MC34PF1550A7EPR2

Ficha técnica

Tape & Reel (TR) - Active Embedded Systems, Low-Power IoT, Mobile/Wearable Devices - 3.8V ~ 7V -40°C ~ 105°C Surface Mount
MC34PF1550A1EPR2

MC34PF1550A1EPR2

POWER MANAGEMENT IC: 3 BUCK REGS

NXP USA Inc.
3,972 -

RFQ

MC34PF1550A1EPR2

Ficha técnica

Tape & Reel (TR),Cut Tape (CT),Bulk - Active Embedded Systems, Low-Power IoT, Mobile/Wearable Devices - 3.8V ~ 7V -40°C ~ 105°C Surface Mount
MC34PF1550A4EPR2

MC34PF1550A4EPR2

POWER MANAGEMENT IC: 3 BUCK REGS

NXP USA Inc.
3,471 -

RFQ

MC34PF1550A4EPR2

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) - Active Embedded Systems, Low-Power IoT, Mobile/Wearable Devices - 3.8V ~ 7V -40°C ~ 105°C Surface Mount
Total 716 Record«Prev1... 7891011121314...36Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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