Conectores Retangulares - Espaçadores de Placa, Empilhadores (Placa a Placa)

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus NumberofPositions Pitch NumberofRows RowSpacing Length-OverallPin Length-Post(Mating) Length-StackHeight Length-Tail MountingType Termination ContactFinish-Post(Mating) ContactFinishThickness-Post(Mating)
59202-T36-13P115LF

59202-T36-13P115LF

CONN HDR STACK SMD

Amphenol ICC (FCI)
3,648 -

RFQ

Tube * Active - - - - - - - - - - - -
54121-102360800LF

54121-102360800LF

CONN HDR 36POS 0.100 STACK T/H

Amphenol ICC (FCI)
3,605 -

RFQ

54121-102360800LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 36 0.100 (2.54mm) 1 - 0.531 (13.500mm) 0.096 (2.450mm) 0.315 (8.000mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
54122-119341300LF

54122-119341300LF

CONN HDR 34POS 0.100 STACK T/H

Amphenol ICC (FCI)
3,080 -

RFQ

54122-119341300LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 34 0.100 (2.54mm) 2 0.100 (2.54mm) 0.882 (22.400mm) 0.250 (6.350mm) 0.512 (13.000mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
54112-108321350LF

54112-108321350LF

CONN HDR 32POS 0.100 STACK T/H

Amphenol ICC (FCI)
3,089 -

RFQ

54112-108321350LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 32 0.100 (2.54mm) 2 0.100 (2.54mm) 0.925 (23.500mm) 0.298 (7.569mm) 0.531 (13.500mm) 0.095 (2.413mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
54122-110121900LF

54122-110121900LF

CONN HDR 12POS 0.100 STACK T/H

Amphenol ICC (FCI)
3,787 -

RFQ

54122-110121900LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 12 0.100 (2.54mm) 2 0.100 (2.54mm) 1.125 (28.575mm) 0.257 (6.528mm) 0.748 (19.000mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
20021832-05024T1LF

20021832-05024T1LF

CONN HDR STACK SMD

Amphenol ICC (FCI)
3,905 -

RFQ

Tube * Active - - - - - - - - - - - -
20021824-10030T1LF

20021824-10030T1LF

1.27 BTB STACK HD VT TH

Amphenol ICC (FCI)
2,580 -

RFQ

Tube Minitek127® 1.27mm Active - - - - - - - - - - - -
98426-S11-09-190LF

98426-S11-09-190LF

CONN HDR 18POS 0.079 STACK T/H

Amphenol ICC (FCI)
3,184 -

RFQ

98426-S11-09-190LF

Ficha técnica

Box Minitek® 2.00mm Active 18 0.079 (2.00mm) 2 0.079 (2.00mm) 0.878 (22.300mm) 0.157 (4.000mm) 0.583 (14.800mm) 0.091 (2.300mm) Through Hole Solder Gold, GXT™ 15.0µin (0.38µm)
54122-109301150LF

54122-109301150LF

CONN HDR 30POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,179 -

RFQ

54122-109301150LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 30 0.100 (2.54mm) 2 0.100 (2.54mm) 1.025 (26.035mm) 0.453 (11.500mm) 0.453 (11.500mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
59132-F28-17-045LF

59132-F28-17-045LF

CONN HDR STACK

Amphenol ICC (FCI)
3,344 -

RFQ

Bag * Active - - - - - - - - - - - -
54121-104360800LF

54121-104360800LF

CONN HDR 36POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,183 -

RFQ

54121-104360800LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 36 0.100 (2.54mm) 1 - 0.660 (16.764mm) 0.225 (5.715mm) 0.315 (8.000mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
54776-604-20LF

54776-604-20LF

CONN HDR 20POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,882 -

RFQ

54776-604-20LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 20 0.100 (2.54mm) 2 0.100 (2.54mm) 1.413 (35.900mm) 0.390 (9.900mm) 0.906 (23.000mm) 0.118 (3.000mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
98426-G13-22-237LF

98426-G13-22-237LF

CONN HDR 44POS 0.079 STACK T/H

Amphenol ICC (FCI)
3,732 -

RFQ

98426-G13-22-237LF

Ficha técnica

Box Minitek® 2.00mm Active 44 0.079 (2.00mm) 2 0.079 (2.00mm) 1.024 (26.000mm) 0.157 (4.000mm) 0.768 (19.500mm) 0.091 (2.300mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
54112-116142500LF

54112-116142500LF

CONN HDR STACK

Amphenol ICC (FCI)
2,670 -

RFQ

Bulk * Active - - - - - - - - - - - -
76745-376-16LF

76745-376-16LF

CONN HDR 16POS 0.100 STACK TH

Amphenol ICC (FCI)
3,215 -

RFQ

Bag BERGSTIK®, MezzSelect™, Basics+ Active 16 0.100 (2.54mm) 2 0.100 (2.54mm) - - - - Through Hole Solder Tin 78.7µin (2.00µm)
59112-T40-25-166LF

59112-T40-25-166LF

CONN HDR STACK

Amphenol ICC (FCI)
2,169 -

RFQ

Bag * Active - - - - - - - - - - - -
54112-111201000LF

54112-111201000LF

CONN HDR STACK

Amphenol ICC (FCI)
3,079 -

RFQ

Bag * Active - - - - - - - - - - - -
59202-G30-08-052LF

59202-G30-08-052LF

CONN HDR STACK SMD

Amphenol ICC (FCI)
2,867 -

RFQ

Bag * Active - - - - - - - - - - - -
76745-1CB-12LF

76745-1CB-12LF

CONN HDR 12POS 0.100 STACK T/H

Amphenol ICC (FCI)
3,098 -

RFQ

76745-1CB-12LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 12 0.100 (2.54mm) 2 0.100 (2.54mm) 1.654 (42.000mm) 0.354 (9.000mm) 1.181 (30.000mm) 0.118 (3.000mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
76745-1DT-12LF

76745-1DT-12LF

CONN HDR 12POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,890 -

RFQ

76745-1DT-12LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 12 0.100 (2.54mm) 2 0.100 (2.54mm) 1.850 (47.000mm) 0.386 (9.800mm) 1.079 (27.400mm) 0.386 (9.800mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
Total 1780 Record«Prev1... 5051525354555657...89Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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