Conectores Retangulares - Espaçadores de Placa, Empilhadores (Placa a Placa)

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus NumberofPositions Pitch NumberofRows RowSpacing Length-OverallPin Length-Post(Mating) Length-StackHeight Length-Tail MountingType Termination ContactFinish-Post(Mating) ContactFinishThickness-Post(Mating)
59112-G36-10-100LF

59112-G36-10-100LF

CONN HDR 20POS 0.079 STACK TH

Amphenol ICC (FCI)
3,058 -

RFQ

59112-G36-10-100LF

Ficha técnica

Bag Minitek® 2.00mm Active 20 0.079 (2.00mm) 2 0.079 (2.00mm) 0.673 (17.100mm) 0.181 (4.600mm) 0.394 (10.000mm) 0.098 (2.500mm) Through Hole Solder Gold 30.0µin (0.76µm)
54122-109141300LF

54122-109141300LF

CONN HDR STACK

Amphenol ICC (FCI)
2,288 -

RFQ

Bulk * Active - - - - - - - - - - - -
92813-033LF

92813-033LF

CONN HDR 32P 0.079 STACK SMD

Amphenol ICC (FCI)
3,811 -

RFQ

Bag Minitek® Active 32 0.079 (2.00mm) 2 0.079 (2.00mm) 0.465 (11.800mm) 0.161 (4.100mm) 0.264 (6.700mm) - Surface Mount Solder Gold 30.0µin (0.76µm)
59112-F32-20-076LF

59112-F32-20-076LF

CONN HDR STACK

Amphenol ICC (FCI)
3,955 -

RFQ

Bag * Active - - - - - - - - - - - -
54122-110361900LF

54122-110361900LF

CONN HDR 36POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,866 -

RFQ

54122-110361900LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 36 0.100 (2.54mm) 2 0.100 (2.54mm) 1.125 (28.575mm) 0.257 (6.528mm) 0.748 (19.000mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
20021834-11020T4LF

20021834-11020T4LF

CONN HDR 20POS 0.05 STACK SMD

Amphenol ICC (FCI)
3,180 -

RFQ

20021834-11020T4LF

Ficha técnica

Tube Minitek127® 20021834 Active 20 0.050 (1.27mm) 2 0.050 (1.27mm) 0.559 (14.200mm) 0.098 (2.500mm) 0.433 (11.000mm) - Surface Mount Solder Gold 10.0µin (0.25µm)
92813-034LF

92813-034LF

CONN HDR 32P 0.079 STACK SMD

Amphenol ICC (FCI)
3,270 -

RFQ

Bag Minitek® Active 32 0.079 (2.00mm) 2 0.079 (2.00mm) 0.244 (6.200mm) 0.146 (3.700mm) 0.098 (2.500mm) - Surface Mount Solder Gold 30.0µin (0.76µm)
54112-109301600LF

54112-109301600LF

CONN HDR 30POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,808 -

RFQ

54112-109301600LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 30 0.100 (2.54mm) 2 0.100 (2.54mm) 1.025 (26.035mm) 0.300 (7.620mm) 0.630 (16.000mm) 0.095 (2.413mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
59202-F28-11-075LF

59202-F28-11-075LF

CONN HDR STACK SMD

Amphenol ICC (FCI)
2,936 -

RFQ

Bag * Active - - - - - - - - - - - -
75970-188-09LF

75970-188-09LF

CONN HDR 9POS 0.1 STACK T/H

Amphenol ICC (FCI)
3,721 -

RFQ

Bag BERGSTIK®, MezzSelect™, Basics+ Active 9 0.100 (2.54mm) 1 - - - - - Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
75970-504-25LF

75970-504-25LF

CONN HDR 25POS 0.100 STACK TH

Amphenol ICC (FCI)
3,263 -

RFQ

Bag BERGSTIK®, MezzSelect™, Basics+ Active 25 0.100 (2.54mm) 1 - 0.625 (15.875mm) 0.249 (6.325mm) 0.256 (6.500mm) 0.120 (3.050mm) Through Hole Solder Gold Flash
76745-579R24LF

76745-579R24LF

CONN HDR 24POS 0.100 STACK T/H

Amphenol ICC (FCI)
3,906 -

RFQ

76745-579R24LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 24 0.100 (2.54mm) 2 0.100 (2.54mm) 2.047 (52.000mm) 0.392 (9.950mm) 1.535 (39.000mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 15.0µin (0.38µm)
54122-107141150LF

54122-107141150LF

CONN HDR 14POS 0.100 STACK T/H

Amphenol ICC (FCI)
3,740 -

RFQ

54122-107141150LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 14 0.100 (2.54mm) 2 0.100 (2.54mm) 0.825 (20.955mm) 0.252 (6.400mm) 0.453 (11.500mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
59202-G36-05-125LF

59202-G36-05-125LF

CONN HDR STACK SMD

Amphenol ICC (FCI)
3,692 -

RFQ

Bag * Active - - - - - - - - - - - -
54121-105360800LF

54121-105360800LF

CONN HDR 36POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,171 -

RFQ

54121-105360800LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 36 0.100 (2.54mm) 1 - 0.695 (17.650mm) 0.260 (6.600mm) 0.315 (8.000mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
54121-106361000LF

54121-106361000LF

CONN HDR 36POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,939 -

RFQ

54121-106361000LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 36 0.100 (2.54mm) 1 - 0.744 (18.900mm) 0.230 (5.842mm) 0.394 (10.000mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
54121-106360800LF

54121-106360800LF

CONN HDR 36POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,361 -

RFQ

54121-106360800LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 36 0.100 (2.54mm) 1 - 0.744 (18.900mm) 0.309 (7.849mm) 0.315 (8.000mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
98426-G13-25-237LF

98426-G13-25-237LF

CONN HDR 50POS 0.079 STACK T/H

Amphenol ICC (FCI)
3,848 -

RFQ

98426-G13-25-237LF

Ficha técnica

Box Minitek® 2.00mm Active 50 0.079 (2.00mm) 2 0.079 (2.00mm) 1.024 (26.000mm) 0.157 (4.000mm) 0.768 (19.500mm) 0.091 (2.300mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
59202-S34-06-150LF

59202-S34-06-150LF

CONN HDR STACK SMD

Amphenol ICC (FCI)
2,283 -

RFQ

Bag * Active - - - - - - - - - - - -
76745-1CU-20LF

76745-1CU-20LF

CONN HDR 20POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,079 -

RFQ

76745-1CU-20LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 20 0.100 (2.54mm) 2 0.100 (2.54mm) 1.280 (32.500mm) 0.384 (9.754mm) 0.512 (13.000mm) 0.384 (9.754mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
Total 1780 Record«Prev1... 5556575859606162...89Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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