Conectores Retangulares - Espaçadores de Placa, Empilhadores (Placa a Placa)

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus NumberofPositions Pitch NumberofRows RowSpacing Length-OverallPin Length-Post(Mating) Length-StackHeight Length-Tail MountingType Termination ContactFinish-Post(Mating) ContactFinishThickness-Post(Mating)
54112-112401850LF

54112-112401850LF

CONN HDR 40POS 0.100 STACK T/H

Amphenol ICC (FCI)
3,133 -

RFQ

54112-112401850LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 40 0.100 (2.54mm) 2 0.100 (2.54mm) 1.325 (33.660mm) 0.502 (12.750mm) 0.728 (18.500mm) 0.095 (2.413mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
75970-582-09LF

75970-582-09LF

CONN HDR 9POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,537 -

RFQ

Bag BERGSTIK®, MezzSelect™, Basics+ Active 9 0.100 (2.54mm) 1 - - - - - Through Hole Solder Gold Flash
59202-G40-25-174LF

59202-G40-25-174LF

CONN HDR STACK SMD

Amphenol ICC (FCI)
3,031 -

RFQ

Bag * Active - - - - - - - - - - - -
59202-G40-25-155LF

59202-G40-25-155LF

CONN HDR STACK SMD

Amphenol ICC (FCI)
2,152 -

RFQ

Bag * Active - - - - - - - - - - - -
54122-108501100LF

54122-108501100LF

CONN HDR 50POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,389 -

RFQ

Bag BERGSTIK®, MezzSelect™, Basics+ Active 50 0.100 (2.54mm) 2 0.100 (2.54mm) 0.925 (23.500mm) 0.372 (9.440mm) 0.433 (11.000mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
54122-807601150LF

54122-807601150LF

CONN HDR 60POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,595 -

RFQ

54122-807601150LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 60 0.100 (2.54mm) 2 0.100 (2.54mm) 0.825 (20.955mm) 0.252 (6.400mm) 0.453 (11.500mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 15.0µin (0.38µm)
54122-812722000LF

54122-812722000LF

CONN HDR 72POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,798 -

RFQ

54122-812722000LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 72 0.100 (2.54mm) 2 0.100 (2.54mm) 1.325 (33.660mm) 0.418 (10.617mm) 0.787 (20.000mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 15.0µin (0.38µm)
54122-111701800LF

54122-111701800LF

CONN HDR 70POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,649 -

RFQ

54122-111701800LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 70 0.100 (2.54mm) 2 0.100 (2.54mm) 1.225 (31.115mm) 0.396 (10.058mm) 0.709 (18.000mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
54242-106481050LF

54242-106481050LF

CONN HDR 48POS 0.100 STACK SMD

Amphenol ICC (FCI)
3,995 -

RFQ

54242-106481050LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 48 0.100 (2.54mm) 2 0.100 (2.54mm) 0.674 (17.120mm) 0.261 (6.629mm) 0.413 (10.500mm) - Surface Mount Solder Gold, GXT™ 30.0µin (0.76µm)
59202-G38-22-142LF

59202-G38-22-142LF

CONN HDR STACK SMD

Amphenol ICC (FCI)
2,225 -

RFQ

Bag * Active - - - - - - - - - - - -
54122-113402350RLF

54122-113402350RLF

CONN HDR 40POS 0.100 STACK T/H

Amphenol ICC (FCI)
3,916 -

RFQ

54122-113402350RLF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 40 0.100 (2.54mm) 2 0.100 (2.54mm) 1.339 (34.000mm) 0.293 (7.450mm) 0.925 (23.500mm) 0.120 (3.050mm) Through Hole Kinked Pin, Solder Gold, GXT™ 30.0µin (0.76µm)
76745-128-72LF

76745-128-72LF

CONN HDR 72POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,957 -

RFQ

76745-128-72LF

Ficha técnica

Box,Bag BERGSTIK®, MezzSelect™, Basics+ Active 72 0.100 (2.54mm) 2 0.100 (2.54mm) 0.695 (17.650mm) 0.260 (6.600mm) 0.325 (8.255mm) 0.110 (2.800mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
87690-304LF

87690-304LF

CONN HDR 0.100 STACK T/H TIN

Amphenol ICC (FCI)
3,888 -

RFQ

Bag BERGSTIK® II, MezzSelect™, Basics+ Active - 0.100 (2.54mm) 2 0.100 (2.54mm) - - - - Through Hole Solder Tin 78.7µin (2.00µm)
20021814-09580T4LF

20021814-09580T4LF

CONN HDR 80POS 0.050 STACK TH

Amphenol ICC (FCI)
3,834 -

RFQ

Tube Minitek127® 20021814 Active 80 0.050 (1.27mm) 2 0.050 (1.27mm) 0.630 (16.000mm) 0.157 (4.000mm) 0.374 (9.500mm) 0.098 (2.500mm) Through Hole Solder Gold 10.0µin (0.25µm)
54122-107721150LF

54122-107721150LF

CONN HDR 72POS 0.100 STACK T/H

Amphenol ICC (FCI)
3,263 -

RFQ

54122-107721150LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 72 0.100 (2.54mm) 2 0.100 (2.54mm) 0.825 (20.955mm) 0.252 (6.400mm) 0.453 (11.500mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
54112-106661000LF

54112-106661000LF

CONN HDR STACK

Amphenol ICC (FCI)
2,703 -

RFQ

Bulk * Active - - - - - - - - - - - -
59202-G36-25-125LF

59202-G36-25-125LF

CONN HDR STACK SMD

Amphenol ICC (FCI)
2,137 -

RFQ

Bag * Active - - - - - - - - - - - -
76745-1CU-50LF

76745-1CU-50LF

CONN HDR 50POS 0.100 STACK T/H

Amphenol ICC (FCI)
3,138 -

RFQ

76745-1CU-50LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 50 0.100 (2.54mm) 2 0.100 (2.54mm) 1.280 (32.500mm) 0.384 (9.754mm) 0.512 (13.000mm) 0.384 (9.754mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
54122-107641300LF

54122-107641300LF

CONN HDR STACK

Amphenol ICC (FCI)
2,954 -

RFQ

Bulk * Active - - - - - - - - - - - -
54122-108721300LF

54122-108721300LF

CONN HDR 72POS 0.100 STACK T/H

Amphenol ICC (FCI)
3,233 -

RFQ

54122-108721300LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 72 0.100 (2.54mm) 2 0.100 (2.54mm) 0.925 (23.500mm) 0.293 (7.450mm) 0.512 (13.000mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
Total 1780 Record«Prev1... 848586878889Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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