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Conectores Retangulares - Cabeçalhos, Pinos Machos

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus ConnectorType ContactType Pitch-Mating NumberofPositions NumberofRows RowSpacing-Mating NumberofPositionsLoaded Style Shrouding MountingType Termination FasteningType ContactLength-Mating ContactLength-Post OverallContactLength InsulationHeight ContactShape ContactFinish-Mating ContactFinishThickness-Mating ContactFinish-Post ContactMaterial
TSM-106-03-T-SV-P

TSM-106-03-T-SV-P

CONN HEADER SMD 6POS 2.54MM

Samtec Inc. 		2,997 -

RFQ

Tube TSM Active Header Male Pin 0.100 (2.54mm) 6 1 - All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.420 (10.67mm) - - 0.100 (2.54mm) Square Tin - Tin Phosphor Bronze
MTSW-111-10-T-S-100-RA

MTSW-111-10-T-S-100-RA

CONN HEADER R/A 11POS 2.54MM

Samtec Inc. 		3,314 -

RFQ

MTSW-111-10-T-S-100-RA

Ficha técnica

 Bulk Flex Stack, MTSW Active Header, Cuttable Male Pin 0.100 (2.54mm) 11 1 - All Board to Board or Cable Unshrouded Through Hole, Right Angle Solder Push-Pull 0.100 (2.54mm) 0.090 (2.29mm) - 0.119 (3.02mm) Square Tin - Tin Phosphor Bronze
MTSW-111-10-T-S-420-RA

MTSW-111-10-T-S-420-RA

CONN HEADER R/A 11POS 2.54MM

Samtec Inc. 		3,577 -

RFQ

MTSW-111-10-T-S-420-RA

Ficha técnica

 Bulk Flex Stack, MTSW Active Header, Cuttable Male Pin 0.100 (2.54mm) 11 1 - All Board to Board or Cable Unshrouded Through Hole, Right Angle Solder Push-Pull 0.420 (10.67mm) 0.090 (2.29mm) - 0.119 (3.02mm) Square Tin - Tin Phosphor Bronze
HTSW-114-23-T-S

HTSW-114-23-T-S

CONN HEADER VERT 14POS 2.54MM

Samtec Inc. 		3,943 -

RFQ

Bag HTSW Active Header Male Pin 0.100 (2.54mm) 14 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.230 (5.84mm) 0.115 (2.92mm) 0.445 (11.30mm) 0.100 (2.54mm) Square Tin - Tin Phosphor Bronze
HTMS-108-02-L-S

HTMS-108-02-L-S

CONN HDR .050 10POS

Samtec Inc. 		2,986 -

RFQ

Tube HTMS Active Header Male Pin 0.050 (1.27mm) 8 1 - All Board to Board Unshrouded Through Hole Solder Push-Pull 0.100 (2.54mm) 0.120 (3.05mm) 0.320 (8.13mm) 0.100 (2.54mm) Square Gold 10.0µin (0.25µm) Tin Phosphor Bronze
MTSW-113-08-T-S-130-RA

MTSW-113-08-T-S-130-RA

CONN HEADER R/A 13POS 2.54MM

Samtec Inc. 		3,099 -

RFQ

MTSW-113-08-T-S-130-RA

Ficha técnica

 Bulk Flex Stack, MTSW Active Header, Cuttable Male Pin 0.100 (2.54mm) 13 1 - All Board to Board or Cable Unshrouded Through Hole, Right Angle Solder Push-Pull 0.130 (3.30mm) 0.090 (2.29mm) - 0.119 (3.02mm) Square Tin - Tin Phosphor Bronze
TSW-113-10-T-S-RE

TSW-113-10-T-S-RE

CONN HDR .100 13POS

Samtec Inc. 		2,539 -

RFQ

Bulk TSW Active Header Male Pin 0.100 (2.54mm) 13 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.230 (5.84mm) 0.500 (12.70mm) 0.830 (21.08mm) 0.100 (2.54mm) Square Tin - Tin Phosphor Bronze
TSW-114-16-T-S-RE

TSW-114-16-T-S-RE

CONN HDR .100 14POS

Samtec Inc. 		3,397 -

RFQ

Bulk TSW Active Header Male Pin 0.100 (2.54mm) 14 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.320 (8.13mm) 0.310 (7.87mm) 0.730 (18.54mm) 0.100 (2.54mm) Square Tin - Tin Phosphor Bronze
HTMS-108-02-T-D

HTMS-108-02-T-D

CONN HDR .050 20POS

Samtec Inc. 		3,370 -

RFQ

Tube HTMS Active Header Male Pin 0.050 (1.27mm) 16 2 0.100 (2.54mm) All Board to Board Unshrouded Through Hole Solder Push-Pull 0.100 (2.54mm) 0.120 (3.05mm) 0.320 (8.13mm) 0.100 (2.54mm) Square Tin - Tin Phosphor Bronze
TSM-104-02-T-DV-P-TR

TSM-104-02-T-DV-P-TR

CONN HEADER SMD 8POS 2.54MM

Samtec Inc. 		2,658 -

RFQ

TSM-104-02-T-DV-P-TR

Ficha técnica

 Tape & Reel (TR),Cut Tape (CT) TSM Active Header Male Pin 0.100 (2.54mm) 8 2 0.100 (2.54mm) All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.320 (8.13mm) - - 0.100 (2.54mm) Square Tin - Tin Phosphor Bronze
ESMC-M-20-SGS-SMT-C-PP-T/R

ESMC-M-20-SGS-SMT-C-PP-T/R

CONN HEADER VERT SMT 20POS 1.27M

Adam Tech 		300 -

RFQ

ESMC-M-20-SGS-SMT-C-PP-T/R

Ficha técnica

 Tape & Reel (TR),Cut Tape (CT) ESMC Active Header Male Pin 0.050 (1.27mm) 20 2 0.050 (1.27mm) All Board to Board Shrouded - 4 Wall Surface Mount Solder Push-Pull 0.157 (4.00mm) - - 0.388 (9.86mm) Square Gold Flash Tin Phosphor Bronze
0717640006

0717640006

CONN HEADER R/A 6POS 2.54MM

Molex 		1,307 -

RFQ

0717640006

Ficha técnica

 Tube C-Grid 71764 Active Header, Breakaway Male Pin 0.100 (2.54mm) 6 2 0.100 (2.54mm) All Board to Board or Cable Unshrouded Through Hole, Right Angle Solder Push-Pull 0.240 (6.10mm) 0.110 (2.79mm) - 0.200 (5.08mm) Square Tin 150.0µin (3.81µm) Tin Copper Alloy
PBC20SFAN

PBC20SFAN

CONN HEADER VERT 20POS 2.54MM

Sullins Connector Solutions 		823 -

RFQ

PBC20SFAN

Ficha técnica

 Bulk - Active Header, Breakaway Male Pin 0.100 (2.54mm) 20 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.318 (8.08mm) 0.120 (3.05mm) 0.538 (13.67mm) 0.100 (2.54mm) Square Gold 10.0µin (0.25µm) Tin Phosphor Bronze
BBL-103-G-E

BBL-103-G-E

CONN HEADER VERT 3POS 2.54MM

Samtec Inc. 		909 -

RFQ

BBL-103-G-E

Ficha técnica

 Bulk BBL Active Header Male Pin 0.100 (2.54mm) 3 1 - All Board to Board Unshrouded Through Hole Solder Push-Pull 0.105 (2.67mm) 0.125 (3.18mm) 0.300 (7.62mm) 0.070 (1.78mm) Circular Gold 20.0µin (0.51µm) Nickel -
2-1586039-0

2-1586039-0

CONN HEADER VERT 20POS 4.2MM

TE Connectivity AMP Connectors 		915 -

RFQ

2-1586039-0

Ficha técnica

 Bulk,Box VAL-U-LOK Active Header Male Pin 0.165 (4.20mm) 20 2 0.165 (4.20mm) All Board to Cable/Wire Shrouded - 4 Wall Through Hole Solder Locking Ramp - 0.138 (3.50mm) - 0.504 (12.80mm) Square Tin 80.0µin (2.03µm) Tin Brass Alloy
TSW-106-17-G-D

TSW-106-17-G-D

CONN HEADER VERT 12POS 2.54MM

Samtec Inc. 		476 -

RFQ

TSW-106-17-G-D

Ficha técnica

 Bulk TSW Active Header Male Pin 0.100 (2.54mm) 12 2 0.100 (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.620 (15.75mm) 0.110 (2.79mm) 0.830 (21.08mm) 0.100 (2.54mm) Square Gold 10.0µin (0.25µm) Gold Phosphor Bronze
TSW-107-23-G-D

TSW-107-23-G-D

CONN HEADER VERT 14POS 2.54MM

Samtec Inc. 		336 -

RFQ

TSW-107-23-G-D

Ficha técnica

 Bulk TSW Active Header Male Pin 0.100 (2.54mm) 14 2 0.100 (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.230 (5.84mm) 0.115 (2.92mm) 0.445 (11.30mm) 0.100 (2.54mm) Square Gold 10.0µin (0.25µm) Gold Phosphor Bronze
929835-01-20

929835-01-20

CONN HEADER R/A 20POS 2.54MM

3M 		261 -

RFQ

929835-01-20

Ficha técnica

 Bulk 929 Active Header, Breakaway Male Pin 0.100 (2.54mm) 20 1 - All Board to Board Unshrouded Through Hole, Right Angle Solder Push-Pull 0.235 (5.97mm) 0.110 (2.79mm) - 0.115 (2.92mm) Square Tin-Lead 100.0µin (2.54µm) - Copper Alloy
TSW-101-26-S-S

TSW-101-26-S-S

CONN HEADER VERT 1POS

Samtec Inc. 		227 -

RFQ

TSW-101-26-S-S

Ficha técnica

 Bulk TSW Discontinued at Mosen Header Male Pin - 1 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.230 (5.84mm) 0.126 (3.20mm) 0.456 (11.58mm) 0.100 (2.54mm) Square Gold 30.0µin (0.76µm) Tin Phosphor Bronze
2-1445054-4

2-1445054-4

CONN HEADER R/A 4POS 3MM

TE Connectivity AMP Connectors 		205 -

RFQ

2-1445054-4

Ficha técnica

 Tray Micro MATE-N-LOK Active Header Male Pin 0.118 (3.00mm) 4 1 - All Board to Cable/Wire Shrouded - 4 Wall Through Hole, Right Angle Solder Locking Ramp - 0.114 (2.90mm) - 0.152 (3.85mm) Square Tin 100.0µin (2.54µm) Tin Brass
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

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