Conectores Retangulares - Cabeçalhos, Receptáculos, Soquetes Fêmeas

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
ESQT-112-03-L-S-350

ESQT-112-03-L-S-350

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc.
3,396 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.350 (8.89mm) 0.108 (2.75mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-104-03-M-D-310

ESQT-104-03-M-D-310

CONN SOCKET 8POS 0.079 GOLD PCB

Samtec Inc.
2,308 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 8 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.310 (7.87mm) 0.148 (3.76mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-104-03-M-D-326

ESQT-104-03-M-D-326

CONN SOCKET 8POS 0.079 GOLD PCB

Samtec Inc.
3,351 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 8 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.326 (8.27mm) 0.132 (3.35mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-104-03-M-D-330

ESQT-104-03-M-D-330

CONN SOCKET 8POS 0.079 GOLD PCB

Samtec Inc.
3,832 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 8 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.330 (8.38mm) 0.128 (3.25mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-104-03-M-D-350

ESQT-104-03-M-D-350

CONN SOCKET 8POS 0.079 GOLD PCB

Samtec Inc.
3,108 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 8 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.350 (8.89mm) 0.108 (2.75mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-104-03-M-D-360

ESQT-104-03-M-D-360

CONN SOCKET 8POS 0.079 GOLD PCB

Samtec Inc.
2,045 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 8 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.360 (9.14mm) 0.098 (2.50mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-104-03-M-D-365

ESQT-104-03-M-D-365

CONN SOCKET 8POS 0.079 GOLD PCB

Samtec Inc.
2,898 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 8 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.365 (9.27mm) 0.093 (2.35mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-104-03-M-D-368

ESQT-104-03-M-D-368

CONN SOCKET 8POS 0.079 GOLD PCB

Samtec Inc.
2,356 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 8 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.368 (9.35mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-104-03-M-D-370

ESQT-104-03-M-D-370

CONN SOCKET 8POS 0.079 GOLD PCB

Samtec Inc.
3,087 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 8 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.370 (9.40mm) 0.088 (2.23mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-104-03-M-D-390

ESQT-104-03-M-D-390

CONN SOCKET 8POS 0.079 GOLD PCB

Samtec Inc.
2,368 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 8 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.390 (9.91mm) 0.068 (1.73mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-112-03-L-S-310

ESQT-112-03-L-S-310

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc.
2,577 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.310 (7.87mm) 0.148 (3.76mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-115-03-F-S-310

ESQT-115-03-F-S-310

CONN SOCKET 15POS 0.079 GOLD PCB

Samtec Inc.
3,781 -

RFQ

Tube ESQT Active Elevated Socket Forked Board to Board or Cable 15 All 0.079 (2.00mm) 1 - Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.310 (7.87mm) 0.148 (3.76mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-115-03-F-S-375

ESQT-115-03-F-S-375

CONN SOCKET 15POS 0.079 GOLD PCB

Samtec Inc.
3,175 -

RFQ

Tube ESQT Active Elevated Socket Forked Board to Board or Cable 15 All 0.079 (2.00mm) 1 - Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.375 (9.53mm) 0.083 (2.11mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-115-03-F-S-390

ESQT-115-03-F-S-390

CONN SOCKET 15POS 0.079 GOLD PCB

Samtec Inc.
2,529 -

RFQ

Tube ESQT Active Elevated Socket Forked Board to Board or Cable 15 All 0.079 (2.00mm) 1 - Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.390 (9.91mm) 0.068 (1.73mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESS-115-TT-06

ESS-115-TT-06

CONN SOCKET 15POS 0.1 TIN PCB

Samtec Inc.
3,124 -

RFQ

Bulk ESS Active Elevated Socket Female Socket Board to Board 15 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.300 (7.62mm) 0.215 (5.46mm) -55°C ~ 125°C UL94 V-0 Tin - -
SFM-108-02-L-S

SFM-108-02-L-S

CONN RCPT 8POS 0.05 GOLD SMD

Samtec Inc.
2,031 -

RFQ

Tube Tiger Eye™ SFM Active Receptacle Female Socket Board to Board or Cable 8 All 0.050 (1.27mm) 1 - Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.185 (4.70mm) - -55°C ~ 125°C UL94 V-0 Tin 6.15mm, 6.30mm, 7.92mm, 8.08mm, 9.70mm, 9.86mm, 11.61mm, 11.76mm -
SSM-107-F-DH-LC

SSM-107-F-DH-LC

CONN RCPT 14POS 0.1 GOLD SMD R/A

Samtec Inc.
2,783 -

RFQ

Tube SSM Active Receptacle Female Socket Board to Board or Cable 14 All 0.100 (2.54mm) 2 0.100 (2.54mm) Surface Mount, Right Angle Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.225 (5.72mm) - -55°C ~ 125°C - Tin - -
SSM-107-L-DV-BE-A

SSM-107-L-DV-BE-A

CONN RCPT 14POS 0.1 GOLD SMD

Samtec Inc.
3,821 -

RFQ

Tube SSM Active Receptacle, Bottom Entry Female Socket Board to Board or Cable 14 All 0.100 (2.54mm) 2 0.100 (2.54mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.290 (7.37mm) - -55°C ~ 125°C - Tin - -
SSM-125-T-SV-LC

SSM-125-T-SV-LC

CONN RCPT 25POS 0.1 TIN SMD

Samtec Inc.
2,758 -

RFQ

Tube SSM Active Receptacle, Pass Through Female Socket Board to Board or Cable 25 All 0.100 (2.54mm) 1 - Surface Mount Solder Push-Pull Tin - Black 0.290 (7.37mm) - -55°C ~ 125°C - Tin - -
SSW-104-22-G-T

SSW-104-22-G-T

CONN RCPT 12POS 0.1 GOLD PCB

Samtec Inc.
2,325 -

RFQ

Bulk SSW Active Receptacle Forked Board to Board or Cable 12 All 0.100 (2.54mm) 3 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.335 (8.51mm) 0.194 (4.93mm) -55°C ~ 125°C UL94 V-0 Gold - -
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Usuário