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Fudong Communication (Shenzhen) Grupo Co., Ltd.+86 075582561136 Fudong Communication (Shenzhen) Grupo Co., Ltd.[email protected]
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Conectores Retangulares - Cabeçalhos, Receptáculos, Soquetes Fêmeas

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
801-83-033-10-003101

801-83-033-10-003101

CONN SOCKET 33POS 0.1 GOLD PCB

Preci-Dip 		2,841 -

RFQ

801-83-033-10-003101

Ficha técnica

 Bulk 801 Active Socket Female Socket Board to Board 33 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.315 (8.00mm) 0.118 (3.00mm) -55°C ~ 125°C UL94 V-0 Tin - -
801-87-046-10-004101

801-87-046-10-004101

CONN SOCKET 46POS 0.1 GOLD PCB

Preci-Dip 		3,228 -

RFQ

801-87-046-10-004101

Ficha técnica

 Bulk 801 Active Socket Female Socket Board to Board 46 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold Flash Black 0.276 (7.00mm) 0.114 (2.90mm) -55°C ~ 125°C UL94 V-0 Tin - -
CLT-108-02-L-D-BE-A-P

CLT-108-02-L-D-BE-A-P

CONN RCPT 16POS 0.079 GOLD SMD

Samtec Inc. 		3,619 -

RFQ

CLT-108-02-L-D-BE-A-P

Ficha técnica

 Tube CLT Active Receptacle, Bottom Entry Female Socket Board to Board 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.083 (2.10mm) - -55°C ~ 125°C UL94 V-0 Tin - -
801-83-030-40-001101

801-83-030-40-001101

CONN SOCKET 30P 0.1 GOLD SMD R/A

Preci-Dip 		2,411 -

RFQ

801-83-030-40-001101

Ficha técnica

 Bulk 801 Active Socket Female Socket Board to Board 30 All 0.100 (2.54mm) 1 - Surface Mount, Right Angle Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.100 (2.54mm) - -55°C ~ 125°C UL94 V-0 Tin - -
ESW-119-44-T-S

ESW-119-44-T-S

CONN SOCKET 19POS 0.1 TIN PCB

Samtec Inc. 		3,196 -

RFQ

ESW-119-44-T-S

Ficha técnica

 Tube ESW Active Elevated Socket Forked Board to Board 19 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.735 (18.67mm) 0.180 (4.57mm) -55°C ~ 105°C UL94 V-0 Tin - -
SLW-131-01-G-S

SLW-131-01-G-S

CONN RCPT 31POS 0.1 GOLD PCB

Samtec Inc. 		2,746 -

RFQ

SLW-131-01-G-S

Ficha técnica

 Bulk SLW Active Receptacle Forked Board to Board 31 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.180 (4.57mm) 0.115 (2.92mm) -55°C ~ 125°C - Gold 6.09mm -
SSA-126-S-G

SSA-126-S-G

CONN RCPT 26POS 0.1 GOLD PCB

Samtec Inc. 		2,145 -

RFQ

SSA-126-S-G

Ficha técnica

 Bulk SSA Active Receptacle, Breakaway Female Socket Board to Board 26 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.230 (5.85mm) 0.151 (3.84mm) -55°C ~ 125°C UL94 V-0 - - -
SSQ-149-01-T-S

SSQ-149-01-T-S

CONN RCPT 49POS 0.1 TIN PCB

Samtec Inc. 		2,485 -

RFQ

SSQ-149-01-T-S

Ficha técnica

 Bulk SSQ Active Receptacle Forked Board to Board or Cable 49 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.335 (8.51mm) 0.104 (2.64mm) -55°C ~ 105°C UL94 V-0 Tin - -
SSW-130-01-G-S

SSW-130-01-G-S

CONN RCPT 30POS 0.1 GOLD PCB

Samtec Inc. 		3,993 -

RFQ

SSW-130-01-G-S

Ficha técnica

 Bulk SSW Active Receptacle Forked Board to Board or Cable 30 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.335 (8.51mm) 0.104 (2.64mm) -55°C ~ 125°C UL94 V-0 Gold - -
311-43-133-41-001000

311-43-133-41-001000

CONN RCPT 33POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp. 		2,507 -

RFQ

311-43-133-41-001000

Ficha técnica

 Bulk 311 Active Receptacle Female Socket Board to Board 33 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.110 (2.79mm) 0.170 (4.32mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-120-14-T-S

ESQ-120-14-T-S

CONN SOCKET 20POS 0.1 TIN PCB

Samtec Inc. 		2,557 -

RFQ

ESQ-120-14-T-S

Ficha técnica

 Tube ESQ Active Elevated Socket Forked Board to Board 20 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.435 (11.05mm) 0.480 (12.19mm) -55°C ~ 105°C UL94 V-0 Tin - -
ESQT-108-03-S-S-321

ESQT-108-03-S-S-321

CONN SOCKET 8POS 0.079 GOLD PCB

Samtec Inc. 		3,262 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 8 All 0.079 (2.00mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.321 (8.15mm) 0.137 (3.48mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESW-108-48-L-D

ESW-108-48-L-D

CONN SOCKET 16POS 0.1 GOLD PCB

Samtec Inc. 		2,640 -

RFQ

ESW-108-48-L-D

Ficha técnica

 Bulk ESW Active Elevated Socket Forked Board to Board 16 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.535 (13.60mm) 0.190 (4.83mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESW-122-33-T-S

ESW-122-33-T-S

CONN SOCKET 22POS 0.1 TIN PCB

Samtec Inc. 		3,415 -

RFQ

ESW-122-33-T-S

Ficha técnica

 Bulk ESW Active Elevated Socket Forked Board to Board 22 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.635 (16.13mm) 0.090 (2.29mm) -55°C ~ 105°C UL94 V-0 Tin - -
SFM-106-L2-L-D

SFM-106-L2-L-D

CONN RCPT 12POS 0.05 GOLD SMD

Samtec Inc. 		3,153 -

RFQ

Bulk Tiger Eye™ SFM Active Receptacle Female Socket Board to Board or Cable 12 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.185 (4.70mm) - -55°C ~ 125°C UL94 V-0 Tin 6.15mm, 6.30mm, 7.92mm, 8.08mm, 9.70mm, 9.86mm, 11.61mm, 11.76mm -
SFM-106-L2-L-D-A

SFM-106-L2-L-D-A

CONN RCPT 12POS 0.05 GOLD SMD

Samtec Inc. 		3,520 -

RFQ

SFM-106-L2-L-D-A

Ficha técnica

 Bulk Tiger Eye™ SFM Active Receptacle Female Socket Board to Board or Cable 12 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.185 (4.70mm) - -55°C ~ 125°C UL94 V-0 Tin 6.15mm, 6.30mm, 7.92mm, 8.08mm, 9.70mm, 9.86mm, 11.61mm, 11.76mm -
SSM-106-L-DV-BE-A-M

SSM-106-L-DV-BE-A-M

CONN RCPT 12POS 0.1 GOLD SMD

Samtec Inc. 		2,140 -

RFQ

Tube SSM Active Receptacle, Bottom Entry Female Socket Board to Board or Cable 12 All 0.100 (2.54mm) 2 0.100 (2.54mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.290 (7.37mm) - -55°C ~ 125°C - Tin - -
SSW-106-22-SM-D-VS-K

SSW-106-22-SM-D-VS-K

CONN RCPT 12POS 0.1 GOLD SMD

Samtec Inc. 		2,141 -

RFQ

Bulk SSW Active Receptacle Forked Board to Board or Cable 12 All 0.100 (2.54mm) 2 0.100 (2.54mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.335 (8.51mm) - -55°C ~ 125°C UL94 V-0 Tin - -
SSW-109-01-S-D-LL-014

SSW-109-01-S-D-LL-014

CONN RCPT 18POS 0.1 GOLD PCB

Samtec Inc. 		2,284 -

RFQ

Bulk SSW Active Receptacle Forked Board to Board or Cable 18 17 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Kinked Pin, Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.335 (8.51mm) 0.104 (2.64mm) -55°C ~ 125°C UL94 V-0 Tin - -
SSW-106-22-S-D-VS-K

SSW-106-22-S-D-VS-K

CONN RCPT 12POS 0.1 GOLD SMD

Samtec Inc. 		2,999 -

RFQ

SSW-106-22-S-D-VS-K

Ficha técnica

 Tube SSW Active Receptacle Forked Board to Board or Cable 12 All 0.100 (2.54mm) 2 0.100 (2.54mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.335 (8.51mm) - -55°C ~ 125°C UL94 V-0 Tin - -
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

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