Conectores Retangulares - Cabeçalhos, Receptáculos, Soquetes Fêmeas

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
ESQ-121-33-T-S

ESQ-121-33-T-S

CONN SOCKET 21POS 0.1 TIN PCB

Samtec Inc.
2,749 -

RFQ

ESQ-121-33-T-S

Ficha técnica

Tube ESQ Active Elevated Socket Forked Board to Board 21 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.635 (16.13mm) 0.090 (2.29mm) -55°C ~ 105°C UL94 V-0 Tin - -
801-93-026-10-001000

801-93-026-10-001000

CONN RCPT 26POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp.
3,368 -

RFQ

801-93-026-10-001000

Ficha técnica

Bulk 801 Active Receptacle Female Socket Board to Board 26 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.276 (7.00mm) 0.118 (3.00mm) -55°C ~ 125°C UL94 V-0 Tin-Lead - -
SDL-121-TT-11

SDL-121-TT-11

CONN RCPT 42POS 0.1 TIN PCB

Samtec Inc.
2,594 -

RFQ

SDL-121-TT-11

Ficha técnica

Bulk SDL Active Receptacle Female Socket Board to Board 42 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.132 (3.35mm) 0.108 (2.75mm) -55°C ~ 105°C - Tin - -
SSQ-127-02-G-S

SSQ-127-02-G-S

CONN RCPT 27POS 0.1 GOLD PCB

Samtec Inc.
2,867 -

RFQ

SSQ-127-02-G-S

Ficha técnica

Bulk SSQ Active Receptacle Forked Board to Board or Cable 27 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.335 (8.51mm) 0.194 (4.93mm) -55°C ~ 125°C UL94 V-0 Gold - -
SSW-134-01-T-D

SSW-134-01-T-D

CONN RCPT 68POS 0.1 TIN PCB

Samtec Inc.
2,552 -

RFQ

SSW-134-01-T-D

Ficha técnica

Bulk SSW Active Receptacle Forked Board to Board or Cable 68 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.335 (8.51mm) 0.104 (2.64mm) -55°C ~ 105°C UL94 V-0 Tin - -
801-43-026-10-001000

801-43-026-10-001000

CONN RCPT 26POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp.
2,157 -

RFQ

801-43-026-10-001000

Ficha técnica

Bulk 801 Active Receptacle Female Socket Board to Board 26 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.276 (7.00mm) 0.118 (3.00mm) -55°C ~ 125°C UL94 V-0 Tin - -
315-43-138-41-001000

315-43-138-41-001000

CONN RCPT 38POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp.
3,131 -

RFQ

315-43-138-41-001000

Ficha técnica

Bulk 315 Active Receptacle Female Socket Board to Board 38 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.110 (2.79mm) 0.108 (2.75mm) -55°C ~ 125°C UL94 V-0 Tin - -
315-43-140-41-003000

315-43-140-41-003000

CONN RCPT 40POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp.
3,185 -

RFQ

315-43-140-41-003000

Ficha técnica

Bulk 315 Active Receptacle Female Socket Board to Board 40 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.071 (1.80mm) 0.095 (2.41mm) -55°C ~ 125°C UL94 V-0 Tin - -
315-93-140-41-003000

315-93-140-41-003000

CONN RCPT 40POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp.
2,533 -

RFQ

315-93-140-41-003000

Ficha técnica

Bulk 315 Active Receptacle Female Socket Board to Board 40 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.071 (1.80mm) 0.095 (2.41mm) -55°C ~ 125°C UL94 V-0 Tin - -
801-43-028-10-002000

801-43-028-10-002000

CONN RCPT 28POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp.
3,107 -

RFQ

801-43-028-10-002000

Ficha técnica

Bulk 801 Active Receptacle Female Socket Board to Board 28 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.165 (4.20mm) 0.125 (3.18mm) -55°C ~ 125°C UL94 V-0 Tin - -
BSW-110-04-L-D

BSW-110-04-L-D

CONN RCPT 20POS 0.1 GOLD PCB

Samtec Inc.
3,939 -

RFQ

BSW-110-04-L-D

Ficha técnica

Bulk BSW Active Receptacle, Breakaway Female Socket Board to Board 20 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole, Bottom Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.350 (8.89mm) 0.165 (4.19mm) -55°C ~ 125°C UL94 V-0 Tin - -
BSW-117-04-L-S

BSW-117-04-L-S

CONN RCPT 17POS 0.1 GOLD PCB

Samtec Inc.
2,373 -

RFQ

BSW-117-04-L-S

Ficha técnica

Bulk BSW Active Receptacle, Breakaway Female Socket Board to Board 17 All 0.100 (2.54mm) 1 - Through Hole, Bottom Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.350 (8.89mm) 0.170 (4.32mm) -55°C ~ 125°C UL94 V-0 Tin - -
SMS-110-02-S-D

SMS-110-02-S-D

CONN RCPT 20POS 0.05 GOLD PCB

Samtec Inc.
2,049 -

RFQ

SMS-110-02-S-D

Ficha técnica

Tube SMS Active Receptacle Forked Board to Board 20 All 0.050 (1.27mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.335 (8.51mm) 0.190 (4.83mm) -55°C ~ 125°C - Tin - -
ESD-103-G-08

ESD-103-G-08

CONN SOCKET 6POS 0.1 GOLD PCB

Samtec Inc.
3,126 -

RFQ

Bulk ESD Active Elevated Socket Female Socket Board to Board 6 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.300 (7.62mm) 0.365 (9.27mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQ-109-13-L-D

ESQ-109-13-L-D

CONN SOCKET 18POS 0.1 GOLD PCB

Samtec Inc.
3,482 -

RFQ

ESQ-109-13-L-D

Ficha técnica

Bulk ESQ Active Elevated Socket Forked Board to Board 18 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.435 (11.05mm) 0.290 (7.37mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-119-34-T-S

ESQ-119-34-T-S

CONN SOCKET 19POS 0.1 TIN PCB

Samtec Inc.
2,034 -

RFQ

ESQ-119-34-T-S

Ficha técnica

Bulk ESQ Active Elevated Socket Forked Board to Board 19 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.635 (16.13mm) 0.280 (7.11mm) -55°C ~ 105°C UL94 V-0 Tin - -
ESQT-103-02-GF-D-310

ESQT-103-02-GF-D-310

CONN SOCKET 6POS 0.079 GOLD PCB

Samtec Inc.
3,722 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 6 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.310 (7.87mm) 0.540 (13.72mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQT-103-02-GF-D-523

ESQT-103-02-GF-D-523

CONN SOCKET 6POS 0.079 GOLD PCB

Samtec Inc.
2,510 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 6 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.523 (13.28mm) 0.327 (8.30mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQT-103-02-GF-D-500

ESQT-103-02-GF-D-500

CONN SOCKET 6POS 0.079 GOLD PCB

Samtec Inc.
3,383 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 6 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.500 (12.70mm) 0.350 (8.89mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQT-103-02-GF-D-535

ESQT-103-02-GF-D-535

CONN SOCKET 6POS 0.079 GOLD PCB

Samtec Inc.
3,383 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 6 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.535 (13.60mm) 0.315 (8.00mm) -55°C ~ 125°C UL94 V-0 Gold - -
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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