Conectores Retangulares - Cabeçalhos, Receptáculos, Soquetes Fêmeas

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
SFM-105-02-S-D-A-K

SFM-105-02-S-D-A-K

CONN RCPT 10POS 0.05 GOLD SMD

Samtec Inc.
2,417 -

RFQ

SFM-105-02-S-D-A-K

Ficha técnica

Tube Tiger Eye™ SFM Active Receptacle Female Socket Board to Board or Cable 10 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.185 (4.70mm) - -55°C ~ 125°C UL94 V-0 Tin 6.15mm, 6.30mm, 7.92mm, 8.08mm, 9.70mm, 9.86mm, 11.61mm, 11.76mm -
ESQ-112-24-T-D

ESQ-112-24-T-D

CONN SOCKET 24POS 0.1 TIN PCB

Samtec Inc.
3,144 -

RFQ

ESQ-112-24-T-D

Ficha técnica

Tube ESQ Active Elevated Socket Forked Board to Board 24 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.535 (13.60mm) 0.380 (9.65mm) -55°C ~ 105°C UL94 V-0 Tin - -
ESQT-113-03-L-S-309

ESQT-113-03-L-S-309

CONN SOCKET 13POS 0.079 GOLD PCB

Samtec Inc.
2,469 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 13 All 0.079 (2.00mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.309 (7.85mm) 0.149 (3.78mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-110-02-M-S-435

ESQT-110-02-M-S-435

CONN SOCKET 10POS 0.079 GOLD PCB

Samtec Inc.
2,911 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 10 All 0.079 (2.00mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.435 (11.05mm) 0.415 (10.54mm) -55°C ~ 125°C UL94 V-0 Tin - -
416-83-236-41-008101

416-83-236-41-008101

CONN SOCKET 36POS 0.1 GOLD PCB

Preci-Dip
3,149 -

RFQ

416-83-236-41-008101

Ficha técnica

Bulk 416 Active Socket Female Socket Board to Board 36 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.472 (12.00mm) 0.126 (3.20mm) -55°C ~ 125°C UL94 V-0 Tin - -
853-83-030-10-002101

853-83-030-10-002101

CONN SOCKET 30POS 0.05 GOLD PCB

Preci-Dip
3,012 -

RFQ

853-83-030-10-002101

Ficha técnica

Bulk 853 Active Socket Female Socket Board to Board 30 All 0.050 (1.27mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.157 (4.00mm) 0.094 (2.40mm) -55°C ~ 125°C UL94 V-0 Tin - -
803-83-032-20-001101

803-83-032-20-001101

CONN SOCKET 32P 0.1 GOLD PCB R/A

Preci-Dip
3,613 -

RFQ

803-83-032-20-001101

Ficha técnica

Bulk 803 Active Socket Female Socket Board to Board 32 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole, Right Angle Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.200 (5.08mm) 0.126 (3.20mm) -55°C ~ 125°C UL94 V-0 Tin - -
CLP-125-02-S-D-A-K-TR

CLP-125-02-S-D-A-K-TR

CONN RCPT 50POS 0.05 GOLD SMD

Samtec Inc.
3,028 -

RFQ

CLP-125-02-S-D-A-K-TR

Ficha técnica

Tape & Reel (TR) CLP Active Receptacle Female Socket Board to Board 50 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Tin - -
SSQ-131-01-T-D

SSQ-131-01-T-D

CONN RCPT 62POS 0.1 TIN PCB

Samtec Inc.
2,300 -

RFQ

SSQ-131-01-T-D

Ficha técnica

Bulk SSQ Active Receptacle Forked Board to Board or Cable 62 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.335 (8.51mm) 0.104 (2.64mm) -55°C ~ 105°C UL94 V-0 Tin - -
SSQ-130-02-T-D

SSQ-130-02-T-D

CONN RCPT 60POS 0.1 TIN PCB

Samtec Inc.
2,416 -

RFQ

SSQ-130-02-T-D

Ficha técnica

Bulk SSQ Active Receptacle Forked Board to Board or Cable 60 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.335 (8.51mm) 0.194 (4.93mm) -55°C ~ 105°C UL94 V-0 Tin - -
SSQ-148-03-T-S

SSQ-148-03-T-S

CONN RCPT 48POS 0.1 TIN PCB

Samtec Inc.
3,180 -

RFQ

SSQ-148-03-T-S

Ficha técnica

Bulk SSQ Active Receptacle Forked Board to Board or Cable 48 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.335 (8.51mm) 0.394 (10.00mm) -55°C ~ 105°C UL94 V-0 Tin - -
SSW-131-01-S-S

SSW-131-01-S-S

CONN RCPT 31POS 0.1 GOLD PCB

Samtec Inc.
2,653 -

RFQ

SSW-131-01-S-S

Ficha técnica

Bulk SSW Active Receptacle Forked Board to Board or Cable 31 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.335 (8.51mm) 0.104 (2.64mm) -55°C ~ 125°C UL94 V-0 Tin - -
416-87-236-41-011101

416-87-236-41-011101

CONN SOCKET 36POS 0.1 GOLD PCB

Preci-Dip
3,723 -

RFQ

416-87-236-41-011101

Ficha técnica

Bulk 416 Active Socket Female Socket Board to Board 36 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold Flash Black 0.709 (18.00mm) 0.126 (3.20mm) -55°C ~ 125°C UL94 V-0 Tin - -
801-83-034-65-001101

801-83-034-65-001101

CONN SOCKET 34POS 0.1 GOLD PCB

Preci-Dip
2,657 -

RFQ

801-83-034-65-001101

Ficha técnica

Bulk 801 Active Socket Female Socket Board to Board 34 All 0.100 (2.54mm) 1 - Through Hole Press-Fit, Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.276 (7.00mm) 0.110 (2.79mm) -55°C ~ 125°C UL94 V-0 Tin - -
801-87-032-66-001101

801-87-032-66-001101

CONN SOCKET 32POS 0.1 GOLD PCB

Preci-Dip
2,118 -

RFQ

801-87-032-66-001101

Ficha técnica

Bulk 801 Active Socket Female Socket Board to Board 32 All 0.100 (2.54mm) 1 - Through Hole Press-Fit, Solder Push-Pull Gold Flash Black 0.276 (7.00mm) 0.150 (3.81mm) -55°C ~ 125°C UL94 V-0 Tin - -
803-87-032-66-001101

803-87-032-66-001101

CONN SOCKET 32POS 0.1 GOLD PCB

Preci-Dip
2,617 -

RFQ

803-87-032-66-001101

Ficha técnica

Bulk 803 Active Socket Female Socket Board to Board 32 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Press-Fit, Solder Push-Pull Gold Flash Black 0.276 (7.00mm) 0.150 (3.81mm) -55°C ~ 125°C UL94 V-0 Tin - -
803-83-050-10-012101

803-83-050-10-012101

CONN SOCKET 50POS 0.1 GOLD PCB

Preci-Dip
2,731 -

RFQ

803-83-050-10-012101

Ficha técnica

Bulk 803 Active Socket Female Socket Board to Board 50 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.165 (4.20mm) 0.125 (3.18mm) -55°C ~ 125°C UL94 V-0 Tin - -
CLM-107-02-G-D-BE

CLM-107-02-G-D-BE

CONN RCPT 14POS 0.039 GOLD SMD

Samtec Inc.
3,806 -

RFQ

CLM-107-02-G-D-BE

Ficha técnica

Tube CLM Active Receptacle, Bottom Entry Female Socket Board to Board 14 All 0.039 (1.00mm) 2 0.039 (1.00mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Gold - -
CLP-111-02-F-D-BE-K

CLP-111-02-F-D-BE-K

CONN RCPT 22POS 0.05 GOLD SMD

Samtec Inc.
2,837 -

RFQ

CLP-111-02-F-D-BE-K

Ficha técnica

Tube CLP Active Receptacle, Bottom Entry Female Socket Board to Board 22 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Tin - -
310-83-158-41-001101

310-83-158-41-001101

CONN SOCKET 58POS 0.1 GOLD PCB

Preci-Dip
2,768 -

RFQ

310-83-158-41-001101

Ficha técnica

Bulk 310 Active Socket Female Socket Board to Board 58 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.165 (4.20mm) 0.125 (3.18mm) -55°C ~ 125°C UL94 V-0 Tin - -
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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