Conectores Retangulares - Cabeçalhos, Receptáculos, Soquetes Fêmeas

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
55508-128LF

55508-128LF

CONN RCPT 28POS 0.079 GOLD SMD

Amphenol ICC (FCI)
2,936 -

RFQ

55508-128LF

Ficha técnica

Tube Minitek® 2.00mm Active Receptacle Female Socket Board to Board 28 All 0.079 (2.00mm) 2 0.079 (2.00mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.091 (2.30mm) - -55°C ~ 125°C UL94 V-0 Tin - -
803-87-042-65-410101

803-87-042-65-410101

CONN SOCKET 42POS 0.1 GOLD PCB

Preci-Dip
3,784 -

RFQ

803-87-042-65-410101

Ficha técnica

Bulk 803 Active Socket Female Socket Board to Board 42 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Press-Fit, Solder Push-Pull Gold Flash Black 0.276 (7.00mm) 0.110 (2.79mm) -55°C ~ 125°C UL94 V-0 Tin - -
CLT-118-02-H-D-BE-P-TR

CLT-118-02-H-D-BE-P-TR

CONN RCPT 36POS 0.079 GOLD SMD

Samtec Inc.
2,113 -

RFQ

CLT-118-02-H-D-BE-P-TR

Ficha técnica

Tape & Reel (TR) CLT Active Receptacle, Bottom Entry Female Socket Board to Board 36 All 0.079 (2.00mm) 2 0.079 (2.00mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.083 (2.10mm) - -55°C ~ 125°C UL94 V-0 Gold - -
71607-334LF

71607-334LF

CONN RCPT 34POS 0.1 GOLD SMD R/A

Amphenol ICC (FCI)
3,212 -

RFQ

71607-334LF

Ficha técnica

Tube Dubox™ Active Receptacle Female Socket Board to Board 34 All 0.100 (2.54mm) 1 - Surface Mount, Right Angle Solder Push-Pull Gold 30.0µin (0.76µm) Gray 0.129 (3.28mm) - - UL94 V-0 Tin - -
91618-324ALF

91618-324ALF

CONN RCPT 48POS 0.1 GOLD SMD

Amphenol ICC (FCI)
3,722 -

RFQ

91618-324ALF

Ficha técnica

Tape & Reel (TR) Dubox™ Active Receptacle, Bottom or Top Entry Female Socket Board to Board 48 All 0.100 (2.54mm) 2 0.100 (2.54mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Gray 0.275 (6.99mm) - - UL94 V-0 Tin 10.81mm -
91618-425ALF

91618-425ALF

CONN RCPT 50POS 0.1 TIN SMD

Amphenol ICC (FCI)
2,972 -

RFQ

91618-425ALF

Ficha técnica

Tape & Reel (TR) Dubox™ Active Receptacle, Bottom or Top Entry Female Socket Board to Board 50 All 0.100 (2.54mm) 2 0.100 (2.54mm) Surface Mount Solder Push-Pull Tin 78.7µin (2.00µm) Gray 0.275 (6.99mm) - - UL94 V-0 Tin 10.81mm -
803-83-042-10-005101

803-83-042-10-005101

CONN SOCKET 42POS 0.1 GOLD PCB

Preci-Dip
3,694 -

RFQ

803-83-042-10-005101

Ficha técnica

Bulk 803 Active Socket Female Socket Board to Board 42 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.335 (8.51mm) 0.118 (3.00mm) -55°C ~ 125°C UL94 V-0 Tin - -
929852-01-27-RA

929852-01-27-RA

CONN RCPT 54POS 0.1 GOLD PCB

3M
3,556 -

RFQ

929852-01-27-RA

Ficha técnica

Bulk 929 Active Receptacle Forked Board to Board 54 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.325 (8.25mm) 0.125 (3.18mm) -40°C ~ 105°C UL94 V-0 Tin - -
BCS-127-L-S-HE

BCS-127-L-S-HE

CONN RCPT 27POS 0.1 GOLD PCB R/A

Samtec Inc.
2,699 -

RFQ

BCS-127-L-S-HE

Ficha técnica

Tube Tiger Claw™ BCS Active Receptacle Female Socket Board to Board 27 All 0.100 (2.54mm) 1 - Through Hole, Right Angle Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.110 (2.79mm) 0.125 (3.18mm) -55°C ~ 125°C UL94 V-0 Tin - -
310-43-125-41-105000

310-43-125-41-105000

CONN RCPT 25POS 0.1 GOLD SMD

Mill-Max Manufacturing Corp.
2,824 -

RFQ

310-43-125-41-105000

Ficha técnica

Bulk 310 Active Receptacle Female Socket Board to Board 25 All 0.100 (2.54mm) 1 - Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.220 (5.60mm) - -55°C ~ 125°C UL94 V-0 Tin - -
BSW-116-24-L-S

BSW-116-24-L-S

CONN RCPT 16POS 0.1 GOLD PCB

Samtec Inc.
2,023 -

RFQ

BSW-116-24-L-S

Ficha técnica

Bulk BSW Active Receptacle, Breakaway Female Socket Board to Board 16 All 0.100 (2.54mm) 1 - Through Hole, Bottom Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.350 (8.89mm) 0.170 (4.32mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-111-44-T-D

ESQ-111-44-T-D

CONN SOCKET 22POS 0.1 TIN PCB

Samtec Inc.
3,644 -

RFQ

ESQ-111-44-T-D

Ficha técnica

Tube ESQ Active Elevated Socket Forked Board to Board 22 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.735 (18.67mm) 0.180 (4.57mm) -55°C ~ 105°C UL94 V-0 Tin - -
ESQT-107-03-L-D-310

ESQT-107-03-L-D-310

CONN SOCKET 14POS 0.079 GOLD PCB

Samtec Inc.
2,152 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 14 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.310 (7.87mm) 0.148 (3.76mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-107-03-L-D-314

ESQT-107-03-L-D-314

CONN SOCKET 14POS 0.079 GOLD PCB

Samtec Inc.
3,826 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 14 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.314 (7.98mm) 0.144 (3.66mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-107-03-L-D-315

ESQT-107-03-L-D-315

CONN SOCKET 14POS 0.079 GOLD PCB

Samtec Inc.
2,674 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 14 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.315 (8.00mm) 0.143 (3.63mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-107-03-L-D-325

ESQT-107-03-L-D-325

CONN SOCKET 14POS 0.079 GOLD PCB

Samtec Inc.
3,894 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 14 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.325 (8.25mm) 0.133 (3.38mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-107-03-L-D-330

ESQT-107-03-L-D-330

CONN SOCKET 14POS 0.079 GOLD PCB

Samtec Inc.
3,449 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 14 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.330 (8.38mm) 0.128 (3.25mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-107-03-L-D-335

ESQT-107-03-L-D-335

CONN SOCKET 14POS 0.079 GOLD PCB

Samtec Inc.
3,562 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 14 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.335 (8.51mm) 0.123 (3.12mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-107-03-L-D-350

ESQT-107-03-L-D-350

CONN SOCKET 14POS 0.079 GOLD PCB

Samtec Inc.
3,461 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 14 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.350 (8.89mm) 0.108 (2.75mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-107-03-L-D-355

ESQT-107-03-L-D-355

CONN SOCKET 14POS 0.079 GOLD PCB

Samtec Inc.
2,619 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 14 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.355 (9.02mm) 0.103 (2.62mm) -55°C ~ 125°C UL94 V-0 Tin - -
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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