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Fudong Communication (Shenzhen) Grupo Co., Ltd.+86 075582561136 Fudong Communication (Shenzhen) Grupo Co., Ltd.[email protected]
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Conectores Retangulares - Cabeçalhos, Receptáculos, Soquetes Fêmeas

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
805-83-048-10-012101

805-83-048-10-012101

CONN SOCKET 48POS 0.1 GOLD PCB

Preci-Dip 		2,101 -

RFQ

805-83-048-10-012101

Ficha técnica

 Bulk 805 Active Socket Female Socket Board to Board 48 All 0.100 (2.54mm) 3 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.165 (4.20mm) 0.125 (3.18mm) -55°C ~ 125°C UL94 V-0 Tin - -
316-87-150-41-008101

316-87-150-41-008101

CONN SOCKET 50POS 0.1 GOLD PCB

Preci-Dip 		3,598 -

RFQ

316-87-150-41-008101

Ficha técnica

 Bulk 316 Active Socket Female Socket Board to Board 50 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold Flash Black 0.472 (12.00mm) 0.126 (3.20mm) -55°C ~ 125°C UL94 V-0 Tin - -
416-87-250-41-008101

416-87-250-41-008101

CONN SOCKET 50POS 0.1 GOLD PCB

Preci-Dip 		3,685 -

RFQ

416-87-250-41-008101

Ficha técnica

 Bulk 416 Active Socket Female Socket Board to Board 50 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold Flash Black 0.472 (12.00mm) 0.126 (3.20mm) -55°C ~ 125°C UL94 V-0 Tin - -
SSQ-119-01-G-D

SSQ-119-01-G-D

CONN RCPT 38POS 0.1 GOLD PCB

Samtec Inc. 		2,379 -

RFQ

SSQ-119-01-G-D

Ficha técnica

 Bulk SSQ Active Receptacle Forked Board to Board or Cable 38 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.335 (8.51mm) 0.104 (2.64mm) -55°C ~ 125°C UL94 V-0 Gold - -
CLE-116-01-G-DV

CLE-116-01-G-DV

CONN RCPT 32POS 0.031 GOLD SMD

Samtec Inc. 		3,631 -

RFQ

CLE-116-01-G-DV

Ficha técnica

 Bulk CLE Active Receptacle, Pass Through Female Socket Board to Board 32 All 0.031 (0.80mm) 2 0.047 (1.20mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.130 (3.30mm) - -55°C ~ 125°C UL94 V-0 Gold - -
BCS-133-L-S-PE

BCS-133-L-S-PE

CONN RCPT 33POS 0.1 GOLD PCB

Samtec Inc. 		3,102 -

RFQ

BCS-133-L-S-PE

Ficha técnica

 Tube Tiger Claw™ BCS Active Receptacle, Pass Through Female Socket Board to Board 33 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.290 (7.37mm) 0.128 (3.25mm) -55°C ~ 125°C UL94 V-0 Tin - -
BCS-133-L-S-TE

BCS-133-L-S-TE

CONN RCPT 33POS 0.1 GOLD PCB

Samtec Inc. 		2,615 -

RFQ

BCS-133-L-S-TE

Ficha técnica

 Tube Tiger Claw™ BCS Active Receptacle Female Socket Board to Board 33 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.290 (7.37mm) 0.122 (3.10mm) -55°C ~ 125°C UL94 V-0 Tin - -
SL-119-G-11

SL-119-G-11

CONN RCPT 19POS 0.1 GOLD PCB

Samtec Inc. 		3,771 -

RFQ

SL-119-G-11

Ficha técnica

 Bulk SL Active Receptacle Female Socket Board to Board 19 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.132 (3.35mm) 0.108 (2.75mm) -55°C ~ 125°C - - - -
SSQ-131-01-S-S

SSQ-131-01-S-S

CONN RCPT 31POS 0.1 GOLD PCB

Samtec Inc. 		3,007 -

RFQ

SSQ-131-01-S-S

Ficha técnica

 Bulk SSQ Active Receptacle Forked Board to Board or Cable 31 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.335 (8.51mm) 0.104 (2.64mm) -55°C ~ 125°C UL94 V-0 Tin - -
SSW-138-01-T-D

SSW-138-01-T-D

CONN RCPT 76POS 0.1 TIN PCB

Samtec Inc. 		3,725 -

RFQ

SSW-138-01-T-D

Ficha técnica

 Bulk SSW Active Receptacle Forked Board to Board or Cable 76 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.335 (8.51mm) 0.104 (2.64mm) -55°C ~ 105°C UL94 V-0 Tin - -
BSW-119-04-L-S

BSW-119-04-L-S

CONN RCPT 19POS 0.1 GOLD PCB

Samtec Inc. 		3,601 -

RFQ

BSW-119-04-L-S

Ficha técnica

 Bulk BSW Active Receptacle, Breakaway Female Socket Board to Board 19 All 0.100 (2.54mm) 1 - Through Hole, Bottom Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.350 (8.89mm) 0.170 (4.32mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESD-105-T-24

ESD-105-T-24

CONN SOCKET 10POS 0.1 GOLD PCB

Samtec Inc. 		2,831 -

RFQ

Bulk ESD Active Elevated Socket Female Socket Board to Board 10 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.400 (10.16mm) 0.115 (2.92mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-105-37-L-T

ESQ-105-37-L-T

CONN SOCKET 15POS 0.1 GOLD PCB

Samtec Inc. 		3,352 -

RFQ

ESQ-105-37-L-T

Ficha técnica

 Bulk ESQ Active Elevated Socket Forked Board to Board 15 All 0.100 (2.54mm) 3 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.435 (11.05mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-104-02-S-D-470

ESQT-104-02-S-D-470

CONN SOCKET 8POS 0.079 GOLD PCB

Samtec Inc. 		2,266 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 8 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.470 (11.94mm) 0.380 (9.65mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-104-02-SM-D-309

ESQT-104-02-SM-D-309

CONN SOCKET 8POS 0.079 GOLD PCB

Samtec Inc. 		3,276 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 8 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.309 (7.85mm) 0.541 (13.74mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-103-02-L-T-653

ESQT-103-02-L-T-653

CONN SOCKET 9POS 0.079 GOLD PCB

Samtec Inc. 		3,582 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 9 All 0.079 (2.00mm) 3 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.653 (16.59mm) 0.197 (5.00mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-104-02-S-D-512

ESQT-104-02-S-D-512

CONN SOCKET 8POS 0.079 GOLD PCB

Samtec Inc. 		2,082 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 8 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.512 (13.00mm) 0.338 (8.59mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-104-02-S-D-790

ESQT-104-02-S-D-790

CONN SOCKET 8POS 0.079 GOLD PCB

Samtec Inc. 		3,663 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 8 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.790 (20.07mm) 0.060 (1.52mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-104-02-SM-D-550

ESQT-104-02-SM-D-550

CONN SOCKET 8POS 0.079 GOLD PCB

Samtec Inc. 		2,069 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 8 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.550 (13.97mm) 0.300 (7.62mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESS-106-G-27

ESS-106-G-27

CONN SOCKET 6POS 0.1 GOLD PCB

Samtec Inc. 		3,356 -

RFQ

Bulk ESS Active Elevated Socket Female Socket Board to Board 6 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.400 (10.16mm) 0.273 (6.93mm) -55°C ~ 125°C UL94 V-0 Gold - -
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1500+
1500+ Média diária de RFQ
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20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
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15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

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