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Fudong Communication (Shenzhen) Grupo Co., Ltd.+86 075582561136 Fudong Communication (Shenzhen) Grupo Co., Ltd.[email protected]
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Conectores Retangulares - Cabeçalhos, Receptáculos, Soquetes Fêmeas

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
315-43-145-41-003000

315-43-145-41-003000

CONN RCPT 45POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp. 		3,116 -

RFQ

315-43-145-41-003000

Ficha técnica

 Bulk 315 Active Receptacle Female Socket Board to Board 45 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.071 (1.80mm) 0.095 (2.41mm) -55°C ~ 125°C UL94 V-0 Tin - -
315-93-145-41-003000

315-93-145-41-003000

CONN RCPT 45POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp. 		3,995 -

RFQ

315-93-145-41-003000

Ficha técnica

 Bulk 315 Active Receptacle Female Socket Board to Board 45 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.071 (1.80mm) 0.095 (2.41mm) -55°C ~ 125°C UL94 V-0 Tin - -
CLM-121-02-L-D-A-P-TR

CLM-121-02-L-D-A-P-TR

CONN RCPT 42POS 0.039 GOLD SMD

Samtec Inc. 		2,628 -

RFQ

CLM-121-02-L-D-A-P-TR

Ficha técnica

 Tape & Reel (TR) CLM Active Receptacle Female Socket Board to Board 42 All 0.039 (1.00mm) 2 0.039 (1.00mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Tin - -
CLM-107-02-L-D-PA

CLM-107-02-L-D-PA

CONN RCPT 14POS 0.039 GOLD SMD

Samtec Inc. 		3,153 -

RFQ

CLM-107-02-L-D-PA

Ficha técnica

 Tray CLM Active Receptacle Female Socket Board to Board 14 All 0.039 (1.00mm) 2 0.039 (1.00mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Tin - -
CLM-110-02-F-D-BE-A-K

CLM-110-02-F-D-BE-A-K

CONN RCPT 20POS 0.039 GOLD SMD

Samtec Inc. 		3,880 -

RFQ

CLM-110-02-F-D-BE-A-K

Ficha técnica

 Tube CLM Active Receptacle, Bottom Entry Female Socket Board to Board 20 All 0.039 (1.00mm) 2 0.039 (1.00mm) Surface Mount Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Tin - -
CLP-111-02-L-D-A-K

CLP-111-02-L-D-A-K

CONN RCPT 22POS 0.05 GOLD SMD

Samtec Inc. 		3,944 -

RFQ

CLP-111-02-L-D-A-K

Ficha técnica

 Tube CLP Active Receptacle Female Socket Board to Board 22 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Tin - -
CLP-111-02-L-D-BE-K

CLP-111-02-L-D-BE-K

CONN RCPT 22POS 0.05 GOLD SMD

Samtec Inc. 		2,080 -

RFQ

CLP-111-02-L-D-BE-K

Ficha técnica

 Tube CLP Active Receptacle, Bottom Entry Female Socket Board to Board 22 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Tin - -
CLP-109-02-L-D-A

CLP-109-02-L-D-A

CONN RCPT 18POS 0.05 GOLD SMD

Samtec Inc. 		2,568 -

RFQ

CLP-109-02-L-D-A

Ficha técnica

 Tube CLP Active Receptacle Female Socket Board to Board 18 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Tin - -
CLP-110-02-L-D-BE-A-K

CLP-110-02-L-D-BE-A-K

CONN RCPT 20POS 0.05 GOLD SMD

Samtec Inc. 		2,599 -

RFQ

CLP-110-02-L-D-BE-A-K

Ficha técnica

 Tube CLP Active Receptacle, Bottom Entry Female Socket Board to Board 20 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Tin - -
CLT-114-02-F-D-K

CLT-114-02-F-D-K

CONN RCPT 28POS 0.079 GOLD SMD

Samtec Inc. 		3,290 -

RFQ

CLT-114-02-F-D-K

Ficha técnica

 Bulk CLT Active Receptacle Female Socket Board to Board 28 All 0.079 (2.00mm) 2 0.079 (2.00mm) Surface Mount Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.083 (2.10mm) - -55°C ~ 125°C UL94 V-0 Tin - -
ESD-105-T-05

ESD-105-T-05

CONN SOCKET 10POS 0.1 GOLD PCB

Samtec Inc. 		2,653 -

RFQ

Bulk ESD Active Elevated Socket Female Socket Board to Board 10 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.500 (12.70mm) 0.165 (4.19mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-03-L-D-309

ESQT-108-03-L-D-309

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		3,395 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.309 (7.85mm) 0.149 (3.78mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-03-L-D-320

ESQT-108-03-L-D-320

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		3,015 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.320 (8.13mm) 0.138 (3.50mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-03-L-D-325

ESQT-108-03-L-D-325

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		2,890 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.325 (8.25mm) 0.133 (3.38mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-03-L-D-340

ESQT-108-03-L-D-340

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		3,407 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.340 (8.64mm) 0.118 (3.00mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-03-L-D-345

ESQT-108-03-L-D-345

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		2,365 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.345 (8.76mm) 0.113 (2.87mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-03-L-D-350

ESQT-108-03-L-D-350

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		3,604 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.350 (8.89mm) 0.108 (2.75mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-03-L-D-365

ESQT-108-03-L-D-365

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		2,925 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.365 (9.27mm) 0.093 (2.35mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-03-L-D-310

ESQT-108-03-L-D-310

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		3,813 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.310 (7.87mm) 0.148 (3.76mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-03-L-D-315

ESQT-108-03-L-D-315

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		2,290 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.315 (8.00mm) 0.143 (3.63mm) -55°C ~ 125°C UL94 V-0 Tin - -
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1500+ Média diária de RFQ
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20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

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