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Fudong Communication (Shenzhen) Grupo Co., Ltd.+86 075582561136 Fudong Communication (Shenzhen) Grupo Co., Ltd.[email protected]
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Conectores Retangulares - Cabeçalhos, Receptáculos, Soquetes Fêmeas

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
HLE-122-02-F-DV-K-TR

HLE-122-02-F-DV-K-TR

CONN RCPT 44POS 0.1 GOLD SMD

Samtec Inc. 		2,156 -

RFQ

Tape & Reel (TR) HLE Active Receptacle Female Socket Board to Board 44 All 0.100 (2.54mm) 2 0.100 (2.54mm) Surface Mount Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.144 (3.66mm) - -55°C ~ 125°C - Tin - -
ESW-126-33-T-S

ESW-126-33-T-S

CONN SOCKET 26POS 0.1 TIN PCB

Samtec Inc. 		2,388 -

RFQ

ESW-126-33-T-S

Ficha técnica

 Tube ESW Active Elevated Socket Forked Board to Board 26 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.635 (16.13mm) 0.090 (2.29mm) -55°C ~ 105°C UL94 V-0 Tin - -
929852-01-31-RA

929852-01-31-RA

CONN RCPT 62POS 0.1 GOLD PCB

3M 		3,469 -

RFQ

929852-01-31-RA

Ficha técnica

 Bulk 929 Active Receptacle Forked Board to Board 62 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.325 (8.25mm) 0.125 (3.18mm) -40°C ~ 105°C UL94 V-0 Tin - -
BCS-131-L-S-HE

BCS-131-L-S-HE

CONN RCPT 31POS 0.1 GOLD PCB R/A

Samtec Inc. 		2,181 -

RFQ

BCS-131-L-S-HE

Ficha técnica

 Tube Tiger Claw™ BCS Active Receptacle Female Socket Board to Board 31 All 0.100 (2.54mm) 1 - Through Hole, Right Angle Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.110 (2.79mm) 0.125 (3.18mm) -55°C ~ 125°C UL94 V-0 Tin - -
CES-136-01-T-D

CES-136-01-T-D

CONN RCPT 72POS 0.1 TIN PCB

Samtec Inc. 		2,498 -

RFQ

CES-136-01-T-D

Ficha técnica

 Bulk CES Active Receptacle Female Socket Board to Board 72 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.200 (5.08mm) 0.128 (3.25mm) -55°C ~ 105°C UL94 V-0 Tin - -
SSQ-133-02-T-D

SSQ-133-02-T-D

CONN RCPT 66POS 0.1 TIN PCB

Samtec Inc. 		3,947 -

RFQ

SSQ-133-02-T-D

Ficha técnica

 Bulk SSQ Active Receptacle Forked Board to Board or Cable 66 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.335 (8.51mm) 0.194 (4.93mm) -55°C ~ 105°C UL94 V-0 Tin - -
SSQ-130-02-T-D-RA

SSQ-130-02-T-D-RA

CONN RCPT 60POS 0.1 TIN PCB R/A

Samtec Inc. 		2,239 -

RFQ

SSQ-130-02-T-D-RA

Ficha técnica

 Bulk SSQ Active Receptacle Forked Board to Board or Cable 60 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole, Right Angle Solder Push-Pull Tin - Black 0.195 (4.95mm) 0.100 (2.54mm) -55°C ~ 105°C UL94 V-0 Tin - -
SSQ-131-03-T-D

SSQ-131-03-T-D

CONN RCPT 62POS 0.1 TIN PCB

Samtec Inc. 		3,357 -

RFQ

SSQ-131-03-T-D

Ficha técnica

 Bulk SSQ Active Receptacle Forked Board to Board or Cable 62 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.335 (8.51mm) 0.394 (10.00mm) -55°C ~ 105°C UL94 V-0 Tin - -
SSW-137-01-G-S

SSW-137-01-G-S

CONN RCPT 37POS 0.1 GOLD PCB

Samtec Inc. 		2,067 -

RFQ

SSW-137-01-G-S

Ficha técnica

 Bulk SSW Active Receptacle Forked Board to Board or Cable 37 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.335 (8.51mm) 0.104 (2.64mm) -55°C ~ 125°C UL94 V-0 Gold - -
310-41-115-41-001000

310-41-115-41-001000

CONN RCPT 15POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp. 		2,262 -

RFQ

310-41-115-41-001000

Ficha técnica

 Tube 310 Active Receptacle Female Socket Board to Board 15 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.110 (2.79mm) 0.125 (3.18mm) -55°C ~ 125°C UL94 V-0 Tin - -
315-43-143-41-001000

315-43-143-41-001000

CONN RCPT 43POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp. 		3,111 -

RFQ

315-43-143-41-001000

Ficha técnica

 Bulk 315 Active Receptacle Female Socket Board to Board 43 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.110 (2.79mm) 0.108 (2.75mm) -55°C ~ 125°C UL94 V-0 Tin - -
316-43-130-41-003000

316-43-130-41-003000

CONN SOCKET 30POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp. 		2,769 -

RFQ

316-43-130-41-003000

Ficha técnica

 Bulk 316 Active Elevated Socket Female Socket Board to Board 30 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.315 (8.00mm) 0.118 (3.00mm) -55°C ~ 125°C UL94 V-0 Tin - -
399-43-126-10-003000

399-43-126-10-003000

CONN RCPT 26POS 0.1 GOLD PCB R/A

Mill-Max Manufacturing Corp. 		2,513 -

RFQ

399-43-126-10-003000

Ficha técnica

 Tube 399 Active Receptacle Female Socket Board to Board 26 All 0.100 (2.54mm) 1 - Through Hole, Right Angle Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.100 (2.54mm) 0.126 (3.20mm) -55°C ~ 125°C UL94 V-0 Tin - -
801-43-033-10-002000

801-43-033-10-002000

CONN RCPT 33POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp. 		2,259 -

RFQ

801-43-033-10-002000

Ficha técnica

 Bulk 801 Active Receptacle Female Socket Board to Board 33 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.165 (4.20mm) 0.125 (3.18mm) -55°C ~ 125°C UL94 V-0 Tin - -
SSQ-116-23-G-S

SSQ-116-23-G-S

CONN RCPT 16POS 0.1 GOLD PCB

Samtec Inc. 		3,754 -

RFQ

SSQ-116-23-G-S

Ficha técnica

 Bulk SSQ Active Receptacle Forked Board to Board or Cable 16 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.335 (8.51mm) 0.394 (10.00mm) -55°C ~ 125°C UL94 V-0 Gold - -
CES-122-02-T-D

CES-122-02-T-D

CONN RCPT 44POS 0.1 TIN PCB

Samtec Inc. 		3,995 -

RFQ

CES-122-02-T-D

Ficha técnica

 Tube CES Active Receptacle Female Socket Board to Board 44 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.200 (5.08mm) 0.223 (5.66mm) -55°C ~ 105°C UL94 V-0 Tin - -
ESQ-108-24-T-T

ESQ-108-24-T-T

CONN SOCKET 24POS 0.1 TIN PCB

Samtec Inc. 		2,710 -

RFQ

ESQ-108-24-T-T

Ficha técnica

 Tube ESQ Active Elevated Socket Forked Board to Board 24 All 0.100 (2.54mm) 3 0.100 (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.535 (13.60mm) 0.380 (9.65mm) -55°C ~ 105°C UL94 V-0 Tin - -
ESQT-105-02-M-D-310

ESQT-105-02-M-D-310

CONN SOCKET 10POS 0.079 GOLD PCB

Samtec Inc. 		3,568 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 10 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.310 (7.87mm) 0.540 (13.72mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-105-02-M-D-400

ESQT-105-02-M-D-400

CONN SOCKET 10POS 0.079 GOLD PCB

Samtec Inc. 		3,707 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 10 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.400 (10.16mm) 0.450 (11.43mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-105-02-M-D-532

ESQT-105-02-M-D-532

CONN SOCKET 10POS 0.079 GOLD PCB

Samtec Inc. 		3,833 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 10 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.532 (13.51mm) 0.318 (8.08mm) -55°C ~ 125°C UL94 V-0 Tin - -
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

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