Sobre nós
Fudong Communication (Shenzhen) Grupo Co., Ltd.+86 075582561136 Fudong Communication (Shenzhen) Grupo Co., Ltd.[email protected]
Idioma
Carregar BOM
Cart
Todas as categorias

Conectores Retangulares - Cabeçalhos, Receptáculos, Soquetes Fêmeas

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
91618-322ALF

91618-322ALF

CONN RCPT 44POS 0.1 GOLD SMD

Amphenol ICC (FCI) 		3,963 -

RFQ

91618-322ALF

Ficha técnica

 Tape & Reel (TR) Dubox™ Active Receptacle, Bottom or Top Entry Female Socket Board to Board 44 All 0.100 (2.54mm) 2 0.100 (2.54mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Gray 0.275 (6.99mm) - - UL94 V-0 Tin 10.81mm -
851-83-045-20-001101

851-83-045-20-001101

CONN SOCKET 45P 0.05 GOLD PCB RA

Preci-Dip 		3,821 -

RFQ

851-83-045-20-001101

Ficha técnica

 Bulk 851 Active Socket Female Socket Board to Board 45 All 0.050 (1.27mm) 1 - Through Hole, Right Angle Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.087 (2.20mm) 0.118 (3.00mm) -55°C ~ 125°C UL94 V-0 Tin - -
805-87-078-10-012101

805-87-078-10-012101

CONN SOCKET 78POS 0.1 GOLD PCB

Preci-Dip 		3,216 -

RFQ

805-87-078-10-012101

Ficha técnica

 Bulk 805 Active Socket Female Socket Board to Board 78 All 0.100 (2.54mm) 3 0.100 (2.54mm) Through Hole Solder Push-Pull Gold Flash Black 0.165 (4.20mm) 0.125 (3.18mm) -55°C ~ 125°C UL94 V-0 Tin - -
SSQ-132-02-T-D-RA

SSQ-132-02-T-D-RA

CONN RCPT 64POS 0.1 TIN PCB R/A

Samtec Inc. 		2,616 -

RFQ

SSQ-132-02-T-D-RA

Ficha técnica

 Bulk SSQ Active Receptacle Forked Board to Board or Cable 64 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole, Right Angle Solder Push-Pull Tin - Black 0.195 (4.95mm) 0.100 (2.54mm) -55°C ~ 105°C UL94 V-0 Tin - -
ESQT-103-03-G-D-346

ESQT-103-03-G-D-346

CONN SOCKET 6POS 0.079 GOLD PCB

Samtec Inc. 		3,434 -

RFQ

ESQT-103-03-G-D-346

Ficha técnica

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 6 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.346 (8.80mm) 0.112 (2.84mm) -55°C ~ 125°C UL94 V-0 Gold - -
BSW-118-24-L-S

BSW-118-24-L-S

CONN RCPT 18POS 0.1 GOLD PCB

Samtec Inc. 		3,322 -

RFQ

BSW-118-24-L-S

Ficha técnica

 Bulk BSW Active Receptacle, Breakaway Female Socket Board to Board 18 All 0.100 (2.54mm) 1 - Through Hole, Bottom Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.350 (8.89mm) 0.170 (4.32mm) -55°C ~ 125°C UL94 V-0 Tin - -
CLP-106-02-S-D-BE-A

CLP-106-02-S-D-BE-A

CONN RCPT 12POS 0.05 GOLD SMD

Samtec Inc. 		2,307 -

RFQ

CLP-106-02-S-D-BE-A

Ficha técnica

 Tube CLP Active Receptacle, Bottom Entry Female Socket Board to Board 12 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-105-33-L-T

ESQ-105-33-L-T

CONN SOCKET 15POS 0.1 GOLD PCB

Samtec Inc. 		3,568 -

RFQ

ESQ-105-33-L-T

Ficha técnica

 Bulk ESQ Active Elevated Socket Forked Board to Board 15 All 0.100 (2.54mm) 3 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.635 (16.13mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-122-34-T-S

ESQ-122-34-T-S

CONN SOCKET 22POS 0.1 TIN PCB

Samtec Inc. 		2,920 -

RFQ

ESQ-122-34-T-S

Ficha técnica

 Tube ESQ Active Elevated Socket Forked Board to Board 22 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.635 (16.13mm) 0.280 (7.11mm) -55°C ~ 105°C UL94 V-0 Tin - -
ESQT-103-03-G-D-370

ESQT-103-03-G-D-370

CONN SOCKET 6POS 0.079 GOLD PCB

Samtec Inc. 		3,894 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 6 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.370 (9.40mm) 0.088 (2.23mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQT-108-02-L-D-368

ESQT-108-02-L-D-368

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		2,711 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.368 (9.35mm) 0.482 (12.24mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-L-D-391

ESQT-108-02-L-D-391

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		3,873 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.391 (9.93mm) 0.459 (11.66mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-L-D-552

ESQT-108-02-L-D-552

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		3,232 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.552 (14.02mm) 0.298 (7.57mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-L-D-675

ESQT-108-02-L-D-675

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		2,540 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.675 (17.14mm) 0.175 (4.45mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-L-D-680

ESQT-108-02-L-D-680

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		3,005 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.680 (17.27mm) 0.170 (4.32mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-L-D-710

ESQT-108-02-L-D-710

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		3,405 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.710 (18.03mm) 0.140 (3.56mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-L-D-720

ESQT-108-02-L-D-720

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		2,009 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.720 (18.30mm) 0.130 (3.30mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-L-D-760

ESQT-108-02-L-D-760

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		3,832 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.760 (19.30mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-L-D-770

ESQT-108-02-L-D-770

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		3,132 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.770 (19.56mm) 0.080 (2.03mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-103-03-G-D-310

ESQT-103-03-G-D-310

CONN SOCKET 6POS 0.079 GOLD PCB

Samtec Inc. 		2,165 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 6 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.310 (7.87mm) 0.148 (3.76mm) -55°C ~ 125°C UL94 V-0 Gold - -
Total 65534 Record«Prev1... 29542955295629572958295929602961...3277Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Usuário