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Fudong Communication (Shenzhen) Grupo Co., Ltd.+86 075582561136 Fudong Communication (Shenzhen) Grupo Co., Ltd.[email protected]
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Conectores Retangulares - Cabeçalhos, Receptáculos, Soquetes Fêmeas

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
801-43-034-10-002000

801-43-034-10-002000

CONN RCPT 34POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp. 		3,580 -

RFQ

801-43-034-10-002000

Ficha técnica

 Bulk 801 Active Receptacle Female Socket Board to Board 34 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.165 (4.20mm) 0.125 (3.18mm) -55°C ~ 125°C UL94 V-0 Tin - -
SSM-112-L-DV-A

SSM-112-L-DV-A

CONN RCPT 24POS 0.1 GOLD SMD

Samtec Inc. 		3,338 -

RFQ

SSM-112-L-DV-A

Ficha técnica

 Tube SSM Active Receptacle, Pass Through Female Socket Board to Board or Cable 24 All 0.100 (2.54mm) 2 0.100 (2.54mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.290 (7.37mm) - -55°C ~ 125°C - Tin - -
CLM-111-02-F-D-A-P

CLM-111-02-F-D-A-P

CONN RCPT 22POS 0.039 GOLD SMD

Samtec Inc. 		3,946 -

RFQ

CLM-111-02-F-D-A-P

Ficha técnica

 Tube CLM Active Receptacle Female Socket Board to Board 22 All 0.039 (1.00mm) 2 0.039 (1.00mm) Surface Mount Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Tin - -
CLT-107-02-S-D-BE

CLT-107-02-S-D-BE

CONN RCPT 14POS 0.079 GOLD SMD

Samtec Inc. 		3,718 -

RFQ

CLT-107-02-S-D-BE

Ficha técnica

 Bulk CLT Active Receptacle, Bottom Entry Female Socket Board to Board 14 All 0.079 (2.00mm) 2 0.079 (2.00mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.083 (2.10mm) - -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-114-44-L-S

ESQ-114-44-L-S

CONN SOCKET 14POS 0.1 GOLD PCB

Samtec Inc. 		2,753 -

RFQ

ESQ-114-44-L-S

Ficha técnica

 Bulk ESQ Active Elevated Socket Forked Board to Board 14 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.735 (18.67mm) 0.180 (4.57mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-117-23-L-S

ESQ-117-23-L-S

CONN SOCKET 17POS 0.1 GOLD PCB

Samtec Inc. 		2,610 -

RFQ

ESQ-117-23-L-S

Ficha técnica

 Bulk ESQ Active Elevated Socket Forked Board to Board 17 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.535 (13.60mm) 0.190 (4.83mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-113-34-T-D

ESQ-113-34-T-D

CONN SOCKET 26POS 0.1 TIN PCB

Samtec Inc. 		2,791 -

RFQ

ESQ-113-34-T-D

Ficha técnica

 Tube ESQ Active Elevated Socket Forked Board to Board 26 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.635 (16.13mm) 0.280 (7.11mm) -55°C ~ 105°C UL94 V-0 Tin - -
ESQT-111-02-F-D-309

ESQT-111-02-F-D-309

CONN SOCKET 22POS 0.079 GOLD PCB

Samtec Inc. 		2,125 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 22 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.309 (7.85mm) 0.541 (13.74mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-111-02-F-D-660

ESQT-111-02-F-D-660

CONN SOCKET 22POS 0.079 GOLD PCB

Samtec Inc. 		2,252 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 22 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.660 (16.76mm) 0.190 (4.83mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-111-02-F-D-310

ESQT-111-02-F-D-310

CONN SOCKET 22POS 0.079 GOLD PCB

Samtec Inc. 		2,883 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 22 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.310 (7.87mm) 0.540 (13.72mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-111-02-F-D-315

ESQT-111-02-F-D-315

CONN SOCKET 22POS 0.079 GOLD PCB

Samtec Inc. 		3,661 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 22 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.315 (8.00mm) 0.535 (13.59mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-111-02-F-D-350

ESQT-111-02-F-D-350

CONN SOCKET 22POS 0.079 GOLD PCB

Samtec Inc. 		3,656 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 22 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.350 (8.89mm) 0.500 (12.70mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-111-02-F-D-380

ESQT-111-02-F-D-380

CONN SOCKET 22POS 0.079 GOLD PCB

Samtec Inc. 		3,296 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 22 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.380 (9.65mm) 0.470 (11.94mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-111-02-F-D-390

ESQT-111-02-F-D-390

CONN SOCKET 22POS 0.079 GOLD PCB

Samtec Inc. 		3,513 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 22 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.390 (9.91mm) 0.460 (11.68mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-111-02-F-D-425

ESQT-111-02-F-D-425

CONN SOCKET 22POS 0.079 GOLD PCB

Samtec Inc. 		3,676 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 22 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.425 (10.80mm) 0.425 (10.80mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-111-02-F-D-520

ESQT-111-02-F-D-520

CONN SOCKET 22POS 0.079 GOLD PCB

Samtec Inc. 		3,843 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 22 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.520 (13.20mm) 0.330 (8.38mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-111-02-F-D-525

ESQT-111-02-F-D-525

CONN SOCKET 22POS 0.079 GOLD PCB

Samtec Inc. 		2,186 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 22 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.525 (13.34mm) 0.325 (8.25mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-111-02-F-D-535

ESQT-111-02-F-D-535

CONN SOCKET 22POS 0.079 GOLD PCB

Samtec Inc. 		3,399 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 22 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.535 (13.60mm) 0.315 (8.00mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-111-02-F-D-600

ESQT-111-02-F-D-600

CONN SOCKET 22POS 0.079 GOLD PCB

Samtec Inc. 		2,438 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 22 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.600 (15.24mm) 0.250 (6.35mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-111-02-F-D-650

ESQT-111-02-F-D-650

CONN SOCKET 22POS 0.079 GOLD PCB

Samtec Inc. 		3,995 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 22 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.650 (16.50mm) 0.200 (5.08mm) -55°C ~ 125°C UL94 V-0 Tin - -
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1500+
1500+ Média diária de RFQ
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20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

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