Conectores Retangulares - Cabeçalhos, Receptáculos, Soquetes Fêmeas

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
CLM-112-02-F-D-BE-PA

CLM-112-02-F-D-BE-PA

CONN RCPT 24POS 0.039 GOLD SMD

Samtec Inc.
2,733 -

RFQ

CLM-112-02-F-D-BE-PA

Ficha técnica

Tray CLM Active Receptacle, Bottom Entry Female Socket Board to Board 24 All 0.039 (1.00mm) 2 0.039 (1.00mm) Surface Mount Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Tin - -
IPS1-110-01-S-D-VS-LC-K-TR

IPS1-110-01-S-D-VS-LC-K-TR

CONN RCPT 20POS 0.1 GOLD SMD

Samtec Inc.
3,889 -

RFQ

Tape & Reel (TR) Mini Mate® IPS1 Active Receptacle Female Socket Board to Board 20 All 0.100 (2.54mm) 2 0.100 (2.54mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.335 (8.51mm) - -55°C ~ 125°C - Tin - -
SEM-105-02-03.0-H-D

SEM-105-02-03.0-H-D

.8MM TIGER EYE MICRO SOCKET

Samtec Inc.
3,247 -

RFQ

Tray Tiger Eye™ SEM Active Receptacle Female Socket Board to Board 10 All 0.031 (0.80mm) 2 0.125 (3.18mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.177 (4.50mm) - -55°C ~ 125°C - Gold 6mm, 7mm, 10mm -
SEM-105-02-03.0-H-D-A

SEM-105-02-03.0-H-D-A

.8MM TIGER EYE MICRO SOCKET

Samtec Inc.
2,568 -

RFQ

Tray Tiger Eye™ SEM Active Receptacle Female Socket Board to Board 10 All 0.031 (0.80mm) 2 0.125 (3.18mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.177 (4.50mm) - -55°C ~ 125°C - Gold 6mm, 7mm, 10mm -
5-147378-3

5-147378-3

CONN RCPT 30POS 0.05 GOLD SMD

TE Connectivity AMP Connectors
3,100 -

RFQ

5-147378-3

Ficha técnica

Tape & Reel (TR) AMPMODU System 50 Active Receptacle Female Socket Board to Board 30 All 0.050 (1.27mm) 2 0.100 (2.54mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.370 (9.40mm) - -65°C ~ 105°C UL94 V-0 Tin 11.94mm, 13.08mm -
801-83-044-10-132101

801-83-044-10-132101

CONN SOCKET 44POS 0.1 GOLD PCB

Preci-Dip
3,794 -

RFQ

801-83-044-10-132101

Ficha técnica

Bulk 801 Active Socket Female Socket Board to Board 44 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.276 (7.00mm) 0.118 (3.00mm) -55°C ~ 125°C UL94 V-0 Tin - -
805-87-081-10-012101

805-87-081-10-012101

CONN SOCKET 81POS 0.1 GOLD PCB

Preci-Dip
3,672 -

RFQ

805-87-081-10-012101

Ficha técnica

Bulk 805 Active Socket Female Socket Board to Board 81 All 0.100 (2.54mm) 3 0.100 (2.54mm) Through Hole Solder Push-Pull Gold Flash Black 0.165 (4.20mm) 0.125 (3.18mm) -55°C ~ 125°C UL94 V-0 Tin - -
833-87-050-10-287101

833-87-050-10-287101

CONN SOCKET 50POS 0.079 GOLD PCB

Preci-Dip
2,977 -

RFQ

833-87-050-10-287101

Ficha técnica

Bulk 833 Active Socket Female Socket Board to Board 50 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold Flash Black 0.453 (11.50mm) 0.125 (3.18mm) -55°C ~ 125°C UL94 V-0 Tin - -
801-83-031-53-001101

801-83-031-53-001101

CONN SOCKET 31POS 0.1 GOLD PCB

Preci-Dip
3,868 -

RFQ

801-83-031-53-001101

Ficha técnica

Bulk 801 Active Socket Female Socket Board to Board 31 All 0.100 (2.54mm) 1 - Through Hole Wire Wrap Push-Pull Gold 29.5µin (0.75µm) Black 0.276 (7.00mm) 0.503 (12.78mm) -55°C ~ 125°C UL94 V-0 Tin - -
316-83-145-41-007101

316-83-145-41-007101

CONN SOCKET 45POS 0.1 GOLD PCB

Preci-Dip
2,409 -

RFQ

316-83-145-41-007101

Ficha técnica

Bulk 316 Active Socket Female Socket Board to Board 45 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.394 (10.00mm) 0.126 (3.20mm) -55°C ~ 125°C UL94 V-0 Tin - -
801-83-042-10-004101

801-83-042-10-004101

CONN SOCKET 42POS 0.1 GOLD PCB

Preci-Dip
2,441 -

RFQ

801-83-042-10-004101

Ficha técnica

Bulk 801 Active Socket Female Socket Board to Board 42 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.276 (7.00mm) 0.114 (2.90mm) -55°C ~ 125°C UL94 V-0 Tin - -
801-83-012-10-216101

801-83-012-10-216101

CONN SOCKET 12POS 0.1 GOLD PCB

Preci-Dip
2,980 -

RFQ

801-83-012-10-216101

Ficha técnica

Bulk 801 Active Socket Female Socket Board to Board 12 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 29.5µin (0.75µm) Black 1.476 (37.50mm) 0.118 (3.00mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESW-125-34-T-S

ESW-125-34-T-S

CONN SOCKET 25POS 0.1 TIN PCB

Samtec Inc.
3,574 -

RFQ

ESW-125-34-T-S

Ficha técnica

Tube ESW Active Elevated Socket Forked Board to Board 25 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.635 (16.13mm) 0.280 (7.11mm) -55°C ~ 105°C UL94 V-0 Tin - -
CES-117-01-S-D

CES-117-01-S-D

CONN RCPT 34POS 0.1 GOLD PCB

Samtec Inc.
2,932 -

RFQ

CES-117-01-S-D

Ficha técnica

Bulk CES Active Receptacle Female Socket Board to Board 34 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.200 (5.08mm) 0.128 (3.25mm) -55°C ~ 125°C UL94 V-0 Tin - -
CES-129-01-S-S

CES-129-01-S-S

CONN RCPT 29POS 0.1 GOLD PCB

Samtec Inc.
3,936 -

RFQ

CES-129-01-S-S

Ficha técnica

Bulk CES Active Receptacle Female Socket Board to Board 29 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.200 (5.08mm) 0.128 (3.25mm) -55°C ~ 125°C UL94 V-0 Tin - -
801-43-020-62-001000

801-43-020-62-001000

CONN RCPT 20POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp.
2,885 -

RFQ

801-43-020-62-001000

Ficha técnica

Tube 801 Active Receptacle Female Socket Board to Board 20 All 0.100 (2.54mm) 1 - Through Hole Press-Fit, Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.276 (7.00mm) 0.143 (3.63mm) -55°C ~ 125°C UL94 V-0 Tin - -
BSW-111-24-L-D

BSW-111-24-L-D

CONN RCPT 22POS 0.1 GOLD PCB

Samtec Inc.
2,618 -

RFQ

BSW-111-24-L-D

Ficha técnica

Bulk BSW Active Receptacle, Breakaway Female Socket Board to Board 22 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole, Bottom Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.350 (8.89mm) 0.165 (4.19mm) -55°C ~ 125°C UL94 V-0 Tin - -
CLM-103-02-H-D-A

CLM-103-02-H-D-A

CONN RCPT 6POS 0.039 GOLD SMD

Samtec Inc.
2,434 -

RFQ

CLM-103-02-H-D-A

Ficha técnica

Bulk CLM Active Receptacle Female Socket Board to Board 6 All 0.039 (1.00mm) 2 0.039 (1.00mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Gold - -
CLP-120-02-SM-D-PA-TR

CLP-120-02-SM-D-PA-TR

CONN RCPT 40POS 0.05 GOLD SMD

Samtec Inc.
2,316 -

RFQ

Tape & Reel (TR) CLP Active Receptacle Female Socket Board to Board 40 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Tin - -
CLP-108-02-S-D-BE-A

CLP-108-02-S-D-BE-A

CONN RCPT 16POS 0.05 GOLD SMD

Samtec Inc.
2,278 -

RFQ

CLP-108-02-S-D-BE-A

Ficha técnica

Tube CLP Active Receptacle, Bottom Entry Female Socket Board to Board 16 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Tin - -
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Usuário