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Fudong Communication (Shenzhen) Grupo Co., Ltd.+86 075582561136 Fudong Communication (Shenzhen) Grupo Co., Ltd.[email protected]
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Conectores Retangulares - Cabeçalhos, Receptáculos, Soquetes Fêmeas

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
SEM-115-02-03.0-G-D

SEM-115-02-03.0-G-D

.8MM TIGER EYE MICRO SOCKET

Samtec Inc. 		3,055 -

RFQ

Tray Tiger Eye™ SEM Active Receptacle Female Socket Board to Board 30 All 0.031 (0.80mm) 2 0.125 (3.18mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.177 (4.50mm) - -55°C ~ 125°C - Gold 6mm, 7mm, 10mm -
CLT-128-02-L-D-BE-A-TR

CLT-128-02-L-D-BE-A-TR

CONN RCPT 56POS 0.079 GOLD SMD

Samtec Inc. 		2,745 -

RFQ

CLT-128-02-L-D-BE-A-TR

Ficha técnica

 Tape & Reel (TR) CLT Active Receptacle, Bottom Entry Female Socket Board to Board 56 All 0.079 (2.00mm) 2 0.079 (2.00mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.083 (2.10mm) - -55°C ~ 125°C UL94 V-0 Tin - -
833-83-056-10-001101

833-83-056-10-001101

CONN SOCKET 56POS 0.079 GOLD PCB

Preci-Dip 		2,557 -

RFQ

833-83-056-10-001101

Ficha técnica

 Bulk 833 Active Socket Female Socket Board to Board 56 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.165 (4.20mm) 0.125 (3.18mm) -55°C ~ 125°C UL94 V-0 Tin - -
803-87-062-10-132101

803-87-062-10-132101

CONN SOCKET 62POS 0.1 GOLD PCB

Preci-Dip 		2,550 -

RFQ

803-87-062-10-132101

Ficha técnica

 Bulk 803 Active Socket Female Socket Board to Board 62 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold Flash Black 0.276 (7.00mm) 0.118 (3.00mm) -55°C ~ 125°C UL94 V-0 Tin - -
534267-7

534267-7

CONN RCPT 40POS 0.1 GOLD PCB

TE Connectivity AMP Connectors 		3,081 -

RFQ

534267-7

Ficha técnica

 Tube,Box AMPMODU Mod IV Active Receptacle, Bottom or Top Entry Female Socket Board to Board 40 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.265 (6.73mm) 0.125 (3.18mm) - - Tin-Lead - -
410-83-260-01-640101

410-83-260-01-640101

CONN SOCKET 60POS 0.1 GOLD PCB

Preci-Dip 		3,754 -

RFQ

410-83-260-01-640101

Ficha técnica

 Bulk 410 Active Socket Female Socket Board to Board 60 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.165 (4.20mm) 0.125 (3.18mm) -55°C ~ 125°C UL94 V-0 Tin - -
MMS-131-01-T-SV

MMS-131-01-T-SV

CONN RCPT 31POS 0.079 TIN PCB

Samtec Inc. 		3,528 -

RFQ

MMS-131-01-T-SV

Ficha técnica

 Tube MMS Active Receptacle Female Socket Board to Board or Cable 31 All 0.079 (2.00mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.175 (4.45mm) 0.115 (2.92mm) -55°C ~ 105°C - Tin - -
316-43-123-41-001000

316-43-123-41-001000

CONN SOCKET 23POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp. 		2,376 -

RFQ

316-43-123-41-001000

Ficha técnica

 Bulk 316 Active Elevated Socket Female Socket Board to Board 23 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.594 (15.09mm) 0.118 (3.00mm) -55°C ~ 125°C UL94 V-0 Tin - -
CLM-120-02-H-D-K-TR

CLM-120-02-H-D-K-TR

CONN RCPT 40POS 0.039 GOLD SMD

Samtec Inc. 		3,298 -

RFQ

CLM-120-02-H-D-K-TR

Ficha técnica

 Tape & Reel (TR) CLM Active Receptacle Female Socket Board to Board 40 All 0.039 (1.00mm) 2 0.039 (1.00mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Gold - -
ESD-104-G-03

ESD-104-G-03

CONN SOCKET 8POS 0.1 GOLD PCB

Samtec Inc. 		3,361 -

RFQ

Bulk ESD Active Elevated Socket Female Socket Board to Board 8 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.300 (7.62mm) 0.153 (3.89mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQ-123-44-T-S

ESQ-123-44-T-S

CONN SOCKET 23POS 0.1 TIN PCB

Samtec Inc. 		2,910 -

RFQ

ESQ-123-44-T-S

Ficha técnica

 Tube ESQ Active Elevated Socket Forked Board to Board 23 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.735 (18.67mm) 0.180 (4.57mm) -55°C ~ 105°C UL94 V-0 Tin - -
ESQT-109-03-L-D-309

ESQT-109-03-L-D-309

CONN SOCKET 18POS 0.079 GOLD PCB

Samtec Inc. 		2,467 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 18 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.309 (7.85mm) 0.149 (3.78mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-109-03-L-D-310

ESQT-109-03-L-D-310

CONN SOCKET 18POS 0.079 GOLD PCB

Samtec Inc. 		3,607 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 18 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.310 (7.87mm) 0.148 (3.76mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-109-03-L-D-350

ESQT-109-03-L-D-350

CONN SOCKET 18POS 0.079 GOLD PCB

Samtec Inc. 		2,632 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 18 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.350 (8.89mm) 0.108 (2.75mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-109-03-L-D-355

ESQT-109-03-L-D-355

CONN SOCKET 18POS 0.079 GOLD PCB

Samtec Inc. 		2,341 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 18 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.355 (9.02mm) 0.103 (2.62mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-109-03-L-D-360

ESQT-109-03-L-D-360

CONN SOCKET 18POS 0.079 GOLD PCB

Samtec Inc. 		3,807 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 18 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.360 (9.14mm) 0.098 (2.50mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-109-03-L-D-401

ESQT-109-03-L-D-401

CONN SOCKET 18POS 0.079 GOLD PCB

Samtec Inc. 		2,011 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 18 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.401 (10.19mm) 0.057 (1.45mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESS-108-G-03

ESS-108-G-03

CONN SOCKET 8POS 0.1 GOLD PCB

Samtec Inc. 		2,636 -

RFQ

Bulk ESS Active Elevated Socket Female Socket Board to Board 8 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.300 (7.62mm) 0.123 (3.12mm) -55°C ~ 125°C UL94 V-0 Gold - -
SFM-106-02-S-D-A-P

SFM-106-02-S-D-A-P

CONN RCPT 12POS 0.05 GOLD SMD

Samtec Inc. 		3,146 -

RFQ

SFM-106-02-S-D-A-P

Ficha técnica

 Tube Tiger Eye™ SFM Active Receptacle Female Socket Board to Board or Cable 12 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.185 (4.70mm) - -55°C ~ 125°C UL94 V-0 Tin 6.15mm, 6.30mm, 7.92mm, 8.08mm, 9.70mm, 9.86mm, 11.61mm, 11.76mm -
SFM-106-02-S-D-P

SFM-106-02-S-D-P

CONN RCPT 12POS 0.05 GOLD SMD

Samtec Inc. 		3,824 -

RFQ

SFM-106-02-S-D-P

Ficha técnica

 Tube Tiger Eye™ SFM Active Receptacle Female Socket Board to Board or Cable 12 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.185 (4.70mm) - -55°C ~ 125°C UL94 V-0 Tin 6.15mm, 6.30mm, 7.92mm, 8.08mm, 9.70mm, 9.86mm, 11.61mm, 11.76mm -
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

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