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Fudong Communication (Shenzhen) Grupo Co., Ltd.+86 075582561136 Fudong Communication (Shenzhen) Grupo Co., Ltd.[email protected]
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Conectores Retangulares - Cabeçalhos, Receptáculos, Soquetes Fêmeas

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
68046-225LF

68046-225LF

CONN RCPT 50POS 0.1 GOLD SMD

Amphenol ICC (FCI) 		3,494 -

RFQ

68046-225LF

Ficha técnica

 Tube Dubox™ Active Receptacle Female Socket Board to Board 50 All 0.100 (2.54mm) 2 0.100 (2.54mm) Surface Mount Solder Push-Pull Gold or Gold, GXT™ 15.0µin (0.38µm) Black 0.310 (7.87mm) - -65°C ~ 125°C UL94 V-0 Tin - -
831-83-044-10-273101

831-83-044-10-273101

CONN SOCKET 44POS 0.079 GOLD PCB

Preci-Dip 		3,134 -

RFQ

831-83-044-10-273101

Ficha técnica

 Bulk 831 Active Socket Female Socket Board to Board 44 All 0.079 (2.00mm) 1 - Through Hole Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.110 (2.79mm) 0.122 (3.10mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-127-33-T-S

ESQ-127-33-T-S

CONN SOCKET 27POS 0.1 TIN PCB

Samtec Inc. 		3,190 -

RFQ

ESQ-127-33-T-S

Ficha técnica

 Tube ESQ Active Elevated Socket Forked Board to Board 27 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.635 (16.13mm) 0.090 (2.29mm) -55°C ~ 105°C UL94 V-0 Tin - -
310-13-136-41-001000

310-13-136-41-001000

CONN RCPT 36POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp. 		2,548 -

RFQ

310-13-136-41-001000

Ficha técnica

 Bulk 310 Active Receptacle Female Socket Board to Board 36 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.110 (2.79mm) 0.125 (3.18mm) -55°C ~ 125°C UL94 V-0 Gold - -
SSM-118-L-DV

SSM-118-L-DV

CONN RCPT 36POS 0.1 GOLD SMD

Samtec Inc. 		3,170 -

RFQ

SSM-118-L-DV

Ficha técnica

 Bulk SSM Active Receptacle, Pass Through Female Socket Board to Board or Cable 36 All 0.100 (2.54mm) 2 0.100 (2.54mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.290 (7.37mm) - -55°C ~ 125°C - Tin - -
FLE-120-01-G-DV

FLE-120-01-G-DV

CONN RCPT 40POS 0.05 GOLD SMD

Samtec Inc. 		2,205 -

RFQ

FLE-120-01-G-DV

Ficha técnica

 Bulk FLE Active Receptacle Female Socket Board to Board or Cable 40 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.172 (4.37mm) - -55°C ~ 125°C - Gold - -
316-43-130-41-007000

316-43-130-41-007000

CONN SOCKET 30POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp. 		3,517 -

RFQ

316-43-130-41-007000

Ficha técnica

 Bulk 316 Active Elevated Socket Female Socket Board to Board 30 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.402 (10.20mm) 0.118 (3.00mm) -55°C ~ 125°C UL94 V-0 Tin - -
CES-125-02-T-D

CES-125-02-T-D

CONN RCPT 50POS 0.1 TIN PCB

Samtec Inc. 		2,970 -

RFQ

CES-125-02-T-D

Ficha técnica

 Tube CES Active Receptacle Female Socket Board to Board 50 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.200 (5.08mm) 0.223 (5.66mm) -55°C ~ 105°C UL94 V-0 Tin - -
ESQ-106-24-L-T

ESQ-106-24-L-T

CONN SOCKET 18POS 0.1 GOLD PCB

Samtec Inc. 		2,298 -

RFQ

ESQ-106-24-L-T

Ficha técnica

 Bulk ESQ Active Elevated Socket Forked Board to Board 18 All 0.100 (2.54mm) 3 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.535 (13.60mm) 0.380 (9.65mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-110-48-L-D

ESQ-110-48-L-D

CONN SOCKET 20POS 0.1 GOLD PCB

Samtec Inc. 		2,582 -

RFQ

ESQ-110-48-L-D

Ficha técnica

 Bulk ESQ Active Elevated Socket Forked Board to Board 20 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.535 (13.60mm) 0.190 (4.83mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-111-23-L-D

ESQ-111-23-L-D

CONN SOCKET 22POS 0.1 GOLD PCB

Samtec Inc. 		2,013 -

RFQ

ESQ-111-23-L-D

Ficha técnica

 Bulk ESQ Active Elevated Socket Forked Board to Board 22 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.535 (13.60mm) 0.190 (4.83mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-115-24-T-D

ESQ-115-24-T-D

CONN SOCKET 30POS 0.1 TIN PCB

Samtec Inc. 		2,320 -

RFQ

ESQ-115-24-T-D

Ficha técnica

 Tube ESQ Active Elevated Socket Forked Board to Board 30 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.535 (13.60mm) 0.380 (9.65mm) -55°C ~ 105°C UL94 V-0 Tin - -
ESS-107-G-05

ESS-107-G-05

CONN SOCKET 7POS 0.1 GOLD PCB

Samtec Inc. 		3,560 -

RFQ

Bulk ESS Active Elevated Socket Female Socket Board to Board 7 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.500 (12.70mm) 0.173 (4.40mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESW-117-37-G-S

ESW-117-37-G-S

CONN SOCKET 17POS 0.1 GOLD PCB

Samtec Inc. 		2,840 -

RFQ

ESW-117-37-G-S

Ficha técnica

 Tube ESW Active Elevated Socket Forked Board to Board 17 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.435 (11.05mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Gold - -
FLE-114-01-GF-DV-A

FLE-114-01-GF-DV-A

CONN RCPT 28POS 0.05 GOLD SMD

Samtec Inc. 		3,521 -

RFQ

Tube FLE Active Receptacle Female Socket Board to Board or Cable 28 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.172 (4.37mm) - -55°C ~ 125°C - Gold - -
SFM-106-L2-S-D-LC

SFM-106-L2-S-D-LC

CONN RCPT 12POS 0.05 GOLD SMD

Samtec Inc. 		3,086 -

RFQ

SFM-106-L2-S-D-LC

Ficha técnica

 Bulk Tiger Eye™ SFM Active Receptacle Female Socket Board to Board or Cable 12 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.185 (4.70mm) - -55°C ~ 125°C UL94 V-0 Tin 6.15mm, 6.30mm, 7.92mm, 8.08mm, 9.70mm, 9.86mm, 11.61mm, 11.76mm -
SFM-109-01-S-S

SFM-109-01-S-S

CONN RCPT 9POS 0.05 GOLD PCB

Samtec Inc. 		2,866 -

RFQ

Tube Tiger Eye™ SFM Active Receptacle Female Socket Board to Board or Cable 9 All 0.050 (1.27mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.180 (4.57mm) 0.120 (3.05mm) -55°C ~ 125°C UL94 V-0 Tin 6.02mm, 6.17mm, 7.80mm, 7.95mm, 9.58mm, 9.73mm, 11.48mm, 11.63mm -
SSW-112-22-S-D

SSW-112-22-S-D

CONN RCPT 24POS 0.1 GOLD PCB

Samtec Inc. 		3,071 -

RFQ

Bulk SSW Active Receptacle Forked Board to Board or Cable 24 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.335 (8.51mm) 0.194 (4.93mm) -55°C ~ 125°C UL94 V-0 Tin - -
SSW-119-04-S-S

SSW-119-04-S-S

CONN RCPT 19POS 0.1 GOLD PCB

Samtec Inc. 		2,759 -

RFQ

Bulk SSW Active Receptacle Forked Board to Board or Cable 19 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.335 (8.51mm) 0.584 (14.83mm) -55°C ~ 125°C UL94 V-0 Tin - -
SSW-119-23-S-S

SSW-119-23-S-S

CONN RCPT 19POS 0.1 GOLD PCB

Samtec Inc. 		2,581 -

RFQ

Bulk SSW Active Receptacle Forked Board to Board or Cable 19 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.335 (8.51mm) 0.394 (10.00mm) -55°C ~ 125°C UL94 V-0 Tin - -
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1500+
1500+ Média diária de RFQ
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20,000.000 Unidade padrão do produto
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1800+ Fabricantes em todo o mundo
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

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