Conectores Retangulares - Cabeçalhos, Receptáculos, Soquetes Fêmeas

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
MMS-122-02-L-DV-TR

MMS-122-02-L-DV-TR

CONN RCPT 44POS 0.079 GOLD SMD

Samtec Inc.
2,210 -

RFQ

Tape & Reel (TR) MMS Active Receptacle Female Socket Board to Board or Cable 44 All 0.079 (2.00mm) 2 0.079 (2.00mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.177 (4.50mm) - -55°C ~ 125°C - Tin - -
RSM-122-02-L-D-K-TR

RSM-122-02-L-D-K-TR

CONN RCPT 44POS 0.05 GOLD SMD

Samtec Inc.
2,051 -

RFQ

RSM-122-02-L-D-K-TR

Ficha técnica

Tape & Reel (TR) RSM Active Receptacle Female Socket Board to Board 44 All 0.050 (1.27mm) 2 0.100 (2.54mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.240 (6.10mm) - -55°C ~ 125°C UL94 V-0 Tin - -
801-83-031-65-410101

801-83-031-65-410101

CONN SOCKET 31POS 0.1 GOLD PCB

Preci-Dip
3,628 -

RFQ

801-83-031-65-410101

Ficha técnica

Bulk 801 Active Socket Female Socket Board to Board 31 All 0.100 (2.54mm) 1 - Through Hole Press-Fit, Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.276 (7.00mm) 0.110 (2.79mm) -55°C ~ 125°C UL94 V-0 Tin - -
803-83-042-66-001101

803-83-042-66-001101

CONN SOCKET 42POS 0.1 GOLD PCB

Preci-Dip
3,984 -

RFQ

803-83-042-66-001101

Ficha técnica

Bulk 803 Active Socket Female Socket Board to Board 42 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Press-Fit, Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.276 (7.00mm) 0.150 (3.81mm) -55°C ~ 125°C UL94 V-0 Tin - -
861-83-029-40-001101

861-83-029-40-001101

CONN SCKT 29P 0.039 GOLD SMD RA

Preci-Dip
3,036 -

RFQ

861-83-029-40-001101

Ficha técnica

Bulk 861 Active Socket Female Socket Board to Board 29 All 0.039 (1.00mm) 1 - Surface Mount, Right Angle Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.087 (2.20mm) - -55°C ~ 125°C UL94 V-0 Tin - -
SFM210-LPPE-D49-ST-BK

SFM210-LPPE-D49-ST-BK

CONN HDR 98POS 0.039 GOLD PCB

Sullins Connector Solutions
3,231 -

RFQ

SFM210-LPPE-D49-ST-BK

Ficha técnica

Bulk SFM210 Active Header Female Socket Board to Board 98 All 0.039 (1.00mm) 2 0.039 (1.00mm) Through Hole Solder Push-Pull Gold Flash Black 0.083 (2.10mm) 0.094 (2.40mm) -40°C ~ 125°C UL94 V-0 Gold - -
831-83-042-20-001101

831-83-042-20-001101

CONN SCKT 42P 0.079 GOLD PCB RA

Preci-Dip
3,044 -

RFQ

831-83-042-20-001101

Ficha técnica

Bulk 831 Active Socket Female Socket Board to Board 42 All 0.079 (2.00mm) 1 - Through Hole, Right Angle Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.087 (2.20mm) 0.126 (3.20mm) -55°C ~ 125°C UL94 V-0 Tin - -
831-83-042-40-001101

831-83-042-40-001101

CONN SCKT 42P 0.079 GOLD SMD RA

Preci-Dip
3,529 -

RFQ

831-83-042-40-001101

Ficha técnica

Bulk 831 Active Socket Female Socket Board to Board 42 All 0.079 (2.00mm) 1 - Surface Mount, Right Angle Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.087 (2.20mm) - -55°C ~ 125°C UL94 V-0 Tin - -
ESW-120-33-L-S

ESW-120-33-L-S

CONN SOCKET 20POS 0.1 GOLD PCB

Samtec Inc.
2,514 -

RFQ

ESW-120-33-L-S

Ficha técnica

Tube ESW Active Elevated Socket Forked Board to Board 20 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.635 (16.13mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESW-136-24-T-S

ESW-136-24-T-S

CONN SOCKET 36POS 0.1 TIN PCB

Samtec Inc.
3,981 -

RFQ

ESW-136-24-T-S

Ficha técnica

Tube ESW Active Elevated Socket Forked Board to Board 36 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.535 (13.60mm) 0.380 (9.65mm) -55°C ~ 105°C UL94 V-0 Tin - -
SS-127-G-2

SS-127-G-2

CONN RCPT 27POS 0.1 GOLD PCB

Samtec Inc.
2,364 -

RFQ

SS-127-G-2

Ficha técnica

Tube SS Active Receptacle Female Socket Board to Board 27 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.100 (2.54mm) 0.125 (3.18mm) -55°C ~ 125°C - Gold - -
FHP-12-01-T-S

FHP-12-01-T-S

CONN RCPT 12POS 0.156 TIN PCB

Samtec Inc.
3,876 -

RFQ

FHP-12-01-T-S

Ficha técnica

Tube FHP Active Receptacle Female Socket Board to Board 12 All 0.156 (3.96mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.350 (8.89mm) 0.102 (2.60mm) -55°C ~ 105°C - Tin - -
ESQT-112-02-F-D-390

ESQT-112-02-F-D-390

CONN SOCKET 24POS 0.079 GOLD PCB

Samtec Inc.
2,287 -

RFQ

ESQT-112-02-F-D-390

Ficha técnica

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 24 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.390 (9.91mm) 0.460 (11.68mm) -55°C ~ 125°C UL94 V-0 Tin - -
315-93-150-41-001000

315-93-150-41-001000

CONN RCPT 50POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp.
3,807 -

RFQ

315-93-150-41-001000

Ficha técnica

Bulk 315 Active Receptacle Female Socket Board to Board 50 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.110 (2.79mm) 0.108 (2.75mm) -55°C ~ 125°C UL94 V-0 Tin-Lead - -
BSW-110-24-G-D

BSW-110-24-G-D

CONN RCPT 20POS 0.1 GOLD PCB

Samtec Inc.
2,174 -

RFQ

BSW-110-24-G-D

Ficha técnica

Bulk BSW Active Receptacle, Breakaway Female Socket Board to Board 20 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole, Bottom Mount Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.350 (8.89mm) 0.165 (4.19mm) -55°C ~ 125°C UL94 V-0 Tin - -
BSW-117-24-G-S

BSW-117-24-G-S

CONN RCPT 17POS 0.1 GOLD PCB

Samtec Inc.
3,449 -

RFQ

BSW-117-24-G-S

Ficha técnica

Bulk BSW Active Receptacle, Breakaway Female Socket Board to Board 17 All 0.100 (2.54mm) 1 - Through Hole, Bottom Mount Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.350 (8.89mm) 0.170 (4.32mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESD-110-TT-04

ESD-110-TT-04

CONN SOCKET 20POS 0.1 TIN PCB

Samtec Inc.
2,725 -

RFQ

Bulk ESD Active Elevated Socket Female Socket Board to Board 20 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.400 (10.16mm) 0.253 (6.43mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-112-02-F-D-309

ESQT-112-02-F-D-309

CONN SOCKET 24POS 0.079 GOLD PCB

Samtec Inc.
3,277 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 24 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.309 (7.85mm) 0.541 (13.74mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-112-02-F-D-380

ESQT-112-02-F-D-380

CONN SOCKET 24POS 0.079 GOLD PCB

Samtec Inc.
2,211 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 24 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.380 (9.65mm) 0.470 (11.94mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-112-02-F-D-400

ESQT-112-02-F-D-400

CONN SOCKET 24POS 0.079 GOLD PCB

Samtec Inc.
3,223 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 24 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.400 (10.16mm) 0.450 (11.43mm) -55°C ~ 125°C UL94 V-0 Tin - -
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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