Conectores Retangulares - Cabeçalhos, Receptáculos, Soquetes Fêmeas

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
801-87-060-10-268101

801-87-060-10-268101

CONN SOCKET 60POS 0.1 GOLD PCB

Preci-Dip
2,486 -

RFQ

801-87-060-10-268101

Ficha técnica

Bulk 801 Active Socket Female Socket Board to Board 60 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold Flash Black 0.116 (2.95mm) 0.108 (2.75mm) -55°C ~ 125°C UL94 V-0 Tin - -
803-87-060-10-268101

803-87-060-10-268101

CONN SOCKET 60POS 0.1 GOLD PCB

Preci-Dip
3,285 -

RFQ

803-87-060-10-268101

Ficha técnica

Bulk 803 Active Socket Female Socket Board to Board 60 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold Flash Black 0.116 (2.95mm) 0.108 (2.75mm) -55°C ~ 125°C UL94 V-0 Tin - -
851-83-024-30-136101

851-83-024-30-136101

CONN SOCKET 24POS 0.05 GOLD SMD

Preci-Dip
2,968 -

RFQ

851-83-024-30-136101

Ficha técnica

Bulk 851 Active Socket Female Socket Board to Board 24 All 0.050 (1.27mm) 1 - Surface Mount Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.203 (5.16mm) - -55°C ~ 125°C UL94 V-0 Tin - -
SDL-128-TT-11

SDL-128-TT-11

CONN RCPT 56POS 0.1 TIN PCB

Samtec Inc.
2,983 -

RFQ

SDL-128-TT-11

Ficha técnica

Bulk SDL Active Receptacle Female Socket Board to Board 56 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.132 (3.35mm) 0.108 (2.75mm) -55°C ~ 105°C - Tin - -
316-87-146-41-011101

316-87-146-41-011101

CONN SOCKET 46POS 0.1 GOLD PCB

Preci-Dip
2,012 -

RFQ

316-87-146-41-011101

Ficha técnica

Bulk 316 Active Socket Female Socket Board to Board 46 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold Flash Black 0.709 (18.00mm) 0.126 (3.20mm) -55°C ~ 125°C UL94 V-0 Tin - -
416-87-246-41-011101

416-87-246-41-011101

CONN SOCKET 46POS 0.1 GOLD PCB

Preci-Dip
3,110 -

RFQ

416-87-246-41-011101

Ficha técnica

Bulk 416 Active Socket Female Socket Board to Board 46 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold Flash Black 0.709 (18.00mm) 0.126 (3.20mm) -55°C ~ 125°C UL94 V-0 Tin - -
803-87-092-10-001101

803-87-092-10-001101

CONN SOCKET 92POS 0.1 GOLD PCB

Preci-Dip
3,514 -

RFQ

803-87-092-10-001101

Ficha técnica

Bulk 803 Active Socket Female Socket Board to Board 92 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold Flash Black 0.276 (7.00mm) 0.118 (3.00mm) -55°C ~ 125°C UL94 V-0 Tin - -
SSW-107-22-H-D-VS-P-TR

SSW-107-22-H-D-VS-P-TR

CONN RCPT 14POS 0.1 GOLD SMD

Samtec Inc.
2,241 -

RFQ

SSW-107-22-H-D-VS-P-TR

Ficha técnica

Tape & Reel (TR) SSW Active Receptacle Forked Board to Board or Cable 14 All 0.100 (2.54mm) 2 0.100 (2.54mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.335 (8.51mm) - -55°C ~ 125°C UL94 V-0 Gold - -
SSW-114-22-S-D-VS-P-TR

SSW-114-22-S-D-VS-P-TR

CONN RCPT 28POS 0.1 GOLD SMD

Samtec Inc.
2,665 -

RFQ

SSW-114-22-S-D-VS-P-TR

Ficha técnica

Tape & Reel (TR) SSW Active Receptacle Forked Board to Board or Cable 28 All 0.100 (2.54mm) 2 0.100 (2.54mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.335 (8.51mm) - -55°C ~ 125°C UL94 V-0 Tin - -
316-83-146-41-002101

316-83-146-41-002101

CONN SOCKET 46POS 0.1 GOLD PCB

Preci-Dip
2,599 -

RFQ

316-83-146-41-002101

Ficha técnica

Bulk 316 Active Socket Female Socket Board to Board 46 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.433 (11.00mm) 0.126 (3.20mm) -55°C ~ 125°C UL94 V-0 Tin - -
416-83-246-41-002101

416-83-246-41-002101

CONN SOCKET 46POS 0.1 GOLD PCB

Preci-Dip
2,999 -

RFQ

416-83-246-41-002101

Ficha técnica

Bulk 416 Active Socket Female Socket Board to Board 46 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.433 (11.00mm) 0.126 (3.20mm) -55°C ~ 125°C UL94 V-0 Tin - -
316-87-159-41-002101

316-87-159-41-002101

CONN SOCKET 59POS 0.1 GOLD PCB

Preci-Dip
3,199 -

RFQ

316-87-159-41-002101

Ficha técnica

Bulk 316 Active Socket Female Socket Board to Board 59 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold Flash Black 0.433 (11.00mm) 0.126 (3.20mm) -55°C ~ 125°C UL94 V-0 Tin - -
803-87-054-10-269101

803-87-054-10-269101

CONN SOCKET 54POS 0.1 GOLD PCB

Preci-Dip
3,000 -

RFQ

803-87-054-10-269101

Ficha técnica

Bulk 803 Active Socket Female Socket Board to Board 54 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold Flash Black 0.435 (11.05mm) 0.116 (2.95mm) -55°C ~ 125°C UL94 V-0 Tin - -
346-87-159-41-035101

346-87-159-41-035101

CONN SOCKET 59POS 0.1 GOLD PCB

Preci-Dip
3,401 -

RFQ

346-87-159-41-035101

Ficha técnica

Bulk 346 Active Socket Female Socket Board to Board 59 All 0.100 (2.54mm) 1 - Through Hole Press-Fit, Solder Push-Pull Gold Flash Black 0.173 (4.40mm) 0.150 (3.81mm) -55°C ~ 125°C UL94 V-0 Tin - -
346-87-159-41-036101

346-87-159-41-036101

CONN SOCKET 59POS 0.1 GOLD PCB

Preci-Dip
2,006 -

RFQ

346-87-159-41-036101

Ficha técnica

Bulk 346 Active Socket Female Socket Board to Board 59 All 0.100 (2.54mm) 1 - Through Hole Press-Fit, Solder Push-Pull Gold Flash Black 0.116 (2.95mm) 0.110 (2.79mm) -55°C ~ 125°C UL94 V-0 Tin - -
801-83-049-20-002101

801-83-049-20-002101

CONN SOCKET 49P 0.1 GOLD PCB R/A

Preci-Dip
3,825 -

RFQ

801-83-049-20-002101

Ficha técnica

Bulk 801 Active Socket Female Socket Board to Board 49 All 0.100 (2.54mm) 1 - Through Hole, Right Angle Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.100 (2.54mm) 0.126 (3.20mm) -55°C ~ 125°C UL94 V-0 Tin - -
803-87-044-53-001101

803-87-044-53-001101

CONN SOCKET 44POS 0.1 GOLD PCB

Preci-Dip
3,107 -

RFQ

803-87-044-53-001101

Ficha técnica

Bulk 803 Active Socket Female Socket Board to Board 44 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Wire Wrap Push-Pull Gold Flash Black 0.276 (7.00mm) 0.503 (12.78mm) -55°C ~ 125°C UL94 V-0 Tin - -
801-87-044-53-001101

801-87-044-53-001101

CONN SOCKET 44POS 0.1 GOLD PCB

Preci-Dip
2,062 -

RFQ

801-87-044-53-001101

Ficha técnica

Bulk 801 Active Socket Female Socket Board to Board 44 All 0.100 (2.54mm) 1 - Through Hole Wire Wrap Push-Pull Gold Flash Black 0.276 (7.00mm) 0.503 (12.78mm) -55°C ~ 125°C UL94 V-0 Tin - -
316-83-143-41-009101

316-83-143-41-009101

CONN SOCKET 43POS 0.1 GOLD PCB

Preci-Dip
2,988 -

RFQ

316-83-143-41-009101

Ficha técnica

Bulk 316 Active Socket Female Socket Board to Board 43 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.512 (13.00mm) 0.126 (3.20mm) -55°C ~ 125°C UL94 V-0 Tin - -
310-83-148-41-105101

310-83-148-41-105101

CONN SOCKET 48POS 0.1 GOLD SMD

Preci-Dip
2,754 -

RFQ

310-83-148-41-105101

Ficha técnica

Bulk 310 Active Socket Female Socket Board to Board 48 All 0.100 (2.54mm) 1 - Surface Mount Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.220 (5.60mm) - -55°C ~ 125°C UL94 V-0 Tin - -
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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