Conectores Retangulares - Cabeçalhos, Receptáculos, Soquetes Fêmeas

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
ESQT-106-03-S-D-310

ESQT-106-03-S-D-310

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc.
3,780 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.310 (7.87mm) 0.148 (3.76mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-03-F-D-310

ESQT-113-03-F-D-310

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
2,138 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.310 (7.87mm) 0.148 (3.76mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-03-F-D-315

ESQT-113-03-F-D-315

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
3,351 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.315 (8.00mm) 0.143 (3.63mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-03-F-D-320

ESQT-113-03-F-D-320

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
2,341 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.320 (8.13mm) 0.138 (3.50mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-03-F-D-321

ESQT-113-03-F-D-321

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
3,651 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.321 (8.15mm) 0.137 (3.48mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-03-F-D-335

ESQT-113-03-F-D-335

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
3,233 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.335 (8.51mm) 0.123 (3.12mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-03-F-D-338

ESQT-113-03-F-D-338

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
3,212 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.338 (8.59mm) 0.120 (3.05mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-03-F-D-340

ESQT-113-03-F-D-340

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
2,361 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.340 (8.64mm) 0.118 (3.00mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-03-F-D-346

ESQT-113-03-F-D-346

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
2,170 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.346 (8.80mm) 0.112 (2.84mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-03-F-D-350

ESQT-113-03-F-D-350

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
3,767 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.350 (8.89mm) 0.108 (2.75mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-03-F-D-354

ESQT-113-03-F-D-354

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
2,323 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.354 (9.00mm) 0.104 (2.64mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-03-F-D-355

ESQT-113-03-F-D-355

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
2,314 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.355 (9.02mm) 0.103 (2.62mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-03-F-D-358

ESQT-113-03-F-D-358

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
2,600 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.358 (9.10mm) 0.100 (2.54mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-03-F-D-365

ESQT-113-03-F-D-365

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
2,060 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.365 (9.27mm) 0.093 (2.35mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-03-F-D-368

ESQT-113-03-F-D-368

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
2,501 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.368 (9.35mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-03-F-D-375

ESQT-113-03-F-D-375

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
2,322 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.375 (9.53mm) 0.083 (2.11mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-03-F-D-380

ESQT-113-03-F-D-380

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
2,110 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.380 (9.65mm) 0.078 (1.98mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-03-F-D-408

ESQT-113-03-F-D-408

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
3,584 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.408 (10.36mm) 0.050 (1.27mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-03-FM-D-310

ESQT-113-03-FM-D-310

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc.
3,587 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.310 (7.87mm) 0.148 (3.76mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-114-03-M-S-310

ESQT-114-03-M-S-310

CONN SOCKET 14POS 0.079 GOLD PCB

Samtec Inc.
3,186 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 14 All 0.079 (2.00mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.310 (7.87mm) 0.148 (3.76mm) -55°C ~ 125°C UL94 V-0 Tin - -
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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