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Fudong Communication (Shenzhen) Grupo Co., Ltd.+86 075582561136 Fudong Communication (Shenzhen) Grupo Co., Ltd.[email protected]
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Conectores Retangulares - Cabeçalhos, Receptáculos, Soquetes Fêmeas

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
315-43-154-41-001000

315-43-154-41-001000

CONN RCPT 54POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp. 		3,180 -

RFQ

315-43-154-41-001000

Ficha técnica

 Bulk 315 Active Receptacle Female Socket Board to Board 54 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.110 (2.79mm) 0.108 (2.75mm) -55°C ~ 125°C UL94 V-0 Tin - -
316-93-136-41-003000

316-93-136-41-003000

CONN SOCKET 36POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp. 		3,671 -

RFQ

316-93-136-41-003000

Ficha técnica

 Bulk 316 Active Elevated Socket Female Socket Board to Board 36 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.315 (8.00mm) 0.118 (3.00mm) -55°C ~ 125°C UL94 V-0 Tin-Lead - -
BSW-113-24-L-D

BSW-113-24-L-D

CONN RCPT 26POS 0.1 GOLD PCB

Samtec Inc. 		2,815 -

RFQ

BSW-113-24-L-D

Ficha técnica

 Bulk BSW Active Receptacle, Breakaway Female Socket Board to Board 26 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole, Bottom Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.350 (8.89mm) 0.165 (4.19mm) -55°C ~ 125°C UL94 V-0 Tin - -
CLM-109-02-L-D-PA

CLM-109-02-L-D-PA

CONN RCPT 18POS 0.039 GOLD SMD

Samtec Inc. 		3,061 -

RFQ

CLM-109-02-L-D-PA

Ficha técnica

 Tray CLM Active Receptacle Female Socket Board to Board 18 All 0.039 (1.00mm) 2 0.039 (1.00mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Tin - -
CLM-109-02-L-D-P

CLM-109-02-L-D-P

CONN RCPT 18POS 0.039 GOLD SMD

Samtec Inc. 		2,860 -

RFQ

CLM-109-02-L-D-P

Ficha técnica

 Tube CLM Active Receptacle Female Socket Board to Board 18 All 0.039 (1.00mm) 2 0.039 (1.00mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-107-14-L-T

ESQ-107-14-L-T

CONN SOCKET 21POS 0.1 GOLD PCB

Samtec Inc. 		3,116 -

RFQ

ESQ-107-14-L-T

Ficha técnica

 Bulk ESQ Active Elevated Socket Forked Board to Board 21 All 0.100 (2.54mm) 3 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.435 (11.05mm) 0.480 (12.19mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-104-03-M-T-378

ESQT-104-03-M-T-378

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc. 		3,001 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 3 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.378 (9.60mm) 0.080 (2.03mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-03-M-D-375

ESQT-108-03-M-D-375

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		3,657 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.375 (9.53mm) 0.083 (2.11mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-03-M-D-380

ESQT-108-03-M-D-380

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		3,284 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.380 (9.65mm) 0.078 (1.98mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-03-M-D-310

ESQT-108-03-M-D-310

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		3,446 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.310 (7.87mm) 0.148 (3.76mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-03-M-D-320

ESQT-108-03-M-D-320

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		3,381 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.320 (8.13mm) 0.138 (3.50mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-03-M-D-325

ESQT-108-03-M-D-325

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		2,566 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.325 (8.25mm) 0.133 (3.38mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-03-M-D-340

ESQT-108-03-M-D-340

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		2,685 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.340 (8.64mm) 0.118 (3.00mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-03-M-D-350

ESQT-108-03-M-D-350

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		3,730 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.350 (8.89mm) 0.108 (2.75mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-03-M-D-351

ESQT-108-03-M-D-351

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		2,595 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.351 (8.92mm) 0.107 (2.71mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-03-M-D-368

ESQT-108-03-M-D-368

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		3,783 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.368 (9.35mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-03-M-D-400

ESQT-108-03-M-D-400

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		3,132 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.400 (10.16mm) 0.058 (1.47mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESS-120-TT-24

ESS-120-TT-24

CONN SOCKET 20POS 0.1 TIN PCB

Samtec Inc. 		2,310 -

RFQ

Bulk ESS Active Elevated Socket Female Socket Board to Board 20 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.400 (10.16mm) 0.123 (3.12mm) -55°C ~ 125°C UL94 V-0 Tin - -
FLE-108-01-H-DV-A

FLE-108-01-H-DV-A

CONN RCPT 16POS 0.05 GOLD SMD

Samtec Inc. 		2,155 -

RFQ

Tube FLE Active Receptacle Female Socket Board to Board or Cable 16 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.172 (4.37mm) - -55°C ~ 125°C - Gold - -
SFM-107-L3-S-D-LC

SFM-107-L3-S-D-LC

CONN RCPT 14POS 0.05 GOLD PCB

Samtec Inc. 		3,843 -

RFQ

SFM-107-L3-S-D-LC

Ficha técnica

 Tube Tiger Eye™ SFM Active Receptacle Female Socket Board to Board or Cable 14 All 0.050 (1.27mm) 2 0.050 (1.27mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.180 (4.57mm) 0.075 (1.91mm) -55°C ~ 125°C UL94 V-0 Tin 6.02mm, 6.17mm, 7.80mm, 7.95mm, 9.58mm, 9.73mm, 11.48mm, 11.63mm -
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1500+
1500+ Média diária de RFQ
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20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

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