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Conectores Retangulares - Cabeçalhos, Receptáculos, Soquetes Fêmeas

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
ESQT-105-02-F-Q-310

ESQT-105-02-F-Q-310

CONN SOCKET 20POS 0.079 GOLD PCB

Samtec Inc. 		3,061 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 20 All 0.079 (2.00mm) 4 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.310 (7.87mm) 0.540 (13.72mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-105-02-F-Q-800

ESQT-105-02-F-Q-800

CONN SOCKET 20POS 0.079 GOLD PCB

Samtec Inc. 		3,525 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 20 All 0.079 (2.00mm) 4 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.800 (20.32mm) 0.050 (1.27mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-S-D-500

ESQT-106-02-S-D-500

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc. 		2,441 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.500 (12.70mm) 0.350 (8.89mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-02-F-D-430

ESQT-113-02-F-D-430

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc. 		3,631 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.430 (10.92mm) 0.420 (10.67mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-02-F-D-433

ESQT-113-02-F-D-433

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc. 		2,832 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.433 (11.00mm) 0.417 (10.59mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-02-F-D-455

ESQT-113-02-F-D-455

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc. 		3,267 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.455 (11.56mm) 0.395 (10.03mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-02-F-D-490

ESQT-113-02-F-D-490

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc. 		3,838 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.490 (12.44mm) 0.360 (9.14mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-02-F-D-500

ESQT-113-02-F-D-500

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc. 		3,390 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.500 (12.70mm) 0.350 (8.89mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-02-F-D-509

ESQT-113-02-F-D-509

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc. 		3,437 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.509 (12.93mm) 0.341 (8.66mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-02-F-D-510

ESQT-113-02-F-D-510

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc. 		3,016 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.510 (12.95mm) 0.340 (8.64mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-02-F-D-512

ESQT-113-02-F-D-512

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc. 		2,767 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.512 (13.00mm) 0.338 (8.59mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-02-F-D-520

ESQT-113-02-F-D-520

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc. 		2,788 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.520 (13.20mm) 0.330 (8.38mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-02-F-D-550

ESQT-113-02-F-D-550

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc. 		3,640 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.550 (13.97mm) 0.300 (7.62mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-02-F-D-590

ESQT-113-02-F-D-590

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc. 		3,837 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.590 (14.99mm) 0.260 (6.60mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-02-F-D-600

ESQT-113-02-F-D-600

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc. 		2,263 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.600 (15.24mm) 0.250 (6.35mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-02-F-D-615

ESQT-113-02-F-D-615

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc. 		3,803 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.615 (15.62mm) 0.235 (5.97mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-02-F-D-625

ESQT-113-02-F-D-625

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc. 		2,227 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.625 (15.88mm) 0.225 (5.72mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-02-F-D-650

ESQT-113-02-F-D-650

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc. 		3,724 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.650 (16.50mm) 0.200 (5.08mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-02-F-D-677

ESQT-113-02-F-D-677

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc. 		3,942 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.677 (17.20mm) 0.173 (4.40mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-113-02-F-D-680

ESQT-113-02-F-D-680

CONN SOCKET 26POS 0.079 GOLD PCB

Samtec Inc. 		2,537 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.680 (17.27mm) 0.170 (4.32mm) -55°C ~ 125°C UL94 V-0 Tin - -
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1500+
1500+ Média diária de RFQ
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20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

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 Fudong Communication (Shenzhen) Grupo Co., Ltd.

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