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Fudong Communication (Shenzhen) Grupo Co., Ltd.+86 075582561136 Fudong Communication (Shenzhen) Grupo Co., Ltd.[email protected]
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Conectores Retangulares - Cabeçalhos, Receptáculos, Soquetes Fêmeas

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
CLM-125-02-H-D-TR

CLM-125-02-H-D-TR

CONN RCPT 50POS 0.039 GOLD SMD

Samtec Inc. 		2,556 -

RFQ

CLM-125-02-H-D-TR

Ficha técnica

 Tape & Reel (TR) CLM Active Receptacle Female Socket Board to Board 50 All 0.039 (1.00mm) 2 0.039 (1.00mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Gold - -
CLP-130-02-L-D-BE-A-P-TR

CLP-130-02-L-D-BE-A-P-TR

CONN RCPT 60POS 0.05 GOLD SMD

Samtec Inc. 		2,467 -

RFQ

CLP-130-02-L-D-BE-A-P-TR

Ficha técnica

 Tape & Reel (TR) CLP Active Receptacle, Bottom Entry Female Socket Board to Board 60 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Tin - -
CLE-121-01-G-DV-A-TR

CLE-121-01-G-DV-A-TR

CONN RCPT 42POS 0.031 GOLD SMD

Samtec Inc. 		3,817 -

RFQ

CLE-121-01-G-DV-A-TR

Ficha técnica

 Tape & Reel (TR) CLE Active Receptacle, Pass Through Female Socket Board to Board 42 All 0.031 (0.80mm) 2 0.047 (1.20mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.130 (3.30mm) - -55°C ~ 125°C UL94 V-0 Gold - -
BCS-125-T-S-PE-BE

BCS-125-T-S-PE-BE

CONN RCPT 25POS 0.1 TIN PCB

Samtec Inc. 		2,600 -

RFQ

BCS-125-T-S-PE-BE

Ficha técnica

 Tube Tiger Claw™ BCS Active Receptacle, Pass Through Female Socket Board to Board 25 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.290 (7.37mm) 0.128 (3.25mm) -55°C ~ 125°C UL94 V-0 Tin - -
CES-124-01-F-S

CES-124-01-F-S

CONN RCPT 24POS 0.1 GOLD PCB

Samtec Inc. 		3,549 -

RFQ

CES-124-01-F-S

Ficha técnica

 Bulk CES Active Receptacle Female Socket Board to Board 24 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.200 (5.08mm) 0.128 (3.25mm) -55°C ~ 125°C UL94 V-0 Tin - -
BCS-128-L-S-PE

BCS-128-L-S-PE

CONN RCPT 28POS 0.1 GOLD PCB

Samtec Inc. 		3,947 -

RFQ

BCS-128-L-S-PE

Ficha técnica

 Tube Tiger Claw™ BCS Active Receptacle, Pass Through Female Socket Board to Board 28 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.290 (7.37mm) 0.128 (3.25mm) -55°C ~ 125°C UL94 V-0 Tin - -
BCS-128-L-S-TE

BCS-128-L-S-TE

CONN RCPT 28POS 0.1 GOLD PCB

Samtec Inc. 		3,085 -

RFQ

BCS-128-L-S-TE

Ficha técnica

 Tube Tiger Claw™ BCS Active Receptacle Female Socket Board to Board 28 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.290 (7.37mm) 0.122 (3.10mm) -55°C ~ 125°C UL94 V-0 Tin - -
SSA-117-W-G

SSA-117-W-G

CONN RCPT 17POS 0.1 GOLD PCB

Samtec Inc. 		3,586 -

RFQ

SSA-117-W-G

Ficha técnica

 Bulk SSA Active Receptacle, Breakaway Female Socket Board to Board 17 All 0.100 (2.54mm) 1 - Through Hole Wire Wrap Push-Pull Gold 10.0µin (0.25µm) Black 0.230 (5.85mm) 0.656 (16.66mm) -55°C ~ 125°C UL94 V-0 - - -
CLP-119-02-F-D

CLP-119-02-F-D

CONN RCPT 38POS 0.05 GOLD SMD

Samtec Inc. 		2,674 -

RFQ

CLP-119-02-F-D

Ficha técnica

 Bulk CLP Active Receptacle Female Socket Board to Board 38 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 3.90µin (0.099µm) Black 0.090 (2.29mm) - -55°C ~ 125°C UL94 V-0 Tin - -
HLE-107-02-L-DV-BE

HLE-107-02-L-DV-BE

CONN RCPT 14POS 0.1 GOLD SMD

Samtec Inc. 		2,119 -

RFQ

HLE-107-02-L-DV-BE

Ficha técnica

 Tube HLE Active Receptacle, Bottom Entry Female Socket Board to Board 14 All 0.100 (2.54mm) 2 0.100 (2.54mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.144 (3.66mm) - -55°C ~ 125°C - Tin - -
ESQ-106-44-H-S

ESQ-106-44-H-S

CONN SOCKET 6POS 0.1 GOLD PCB

Samtec Inc. 		3,698 -

RFQ

ESQ-106-44-H-S

Ficha técnica

 Tube ESQ Active Elevated Socket Forked Board to Board 6 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.735 (18.67mm) 0.180 (4.57mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQ-118-34-T-S

ESQ-118-34-T-S

CONN SOCKET 18POS 0.1 TIN PCB

Samtec Inc. 		2,130 -

RFQ

ESQ-118-34-T-S

Ficha técnica

 Tube ESQ Active Elevated Socket Forked Board to Board 18 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.635 (16.13mm) 0.280 (7.11mm) -55°C ~ 105°C UL94 V-0 Tin - -
ESQT-104-03-M-D-314

ESQT-104-03-M-D-314

CONN SOCKET 8POS 0.079 GOLD PCB

Samtec Inc. 		3,557 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 8 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.314 (7.98mm) 0.144 (3.66mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-112-03-L-S-350

ESQT-112-03-L-S-350

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc. 		3,396 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.350 (8.89mm) 0.108 (2.75mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-104-03-M-D-310

ESQT-104-03-M-D-310

CONN SOCKET 8POS 0.079 GOLD PCB

Samtec Inc. 		2,308 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 8 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.310 (7.87mm) 0.148 (3.76mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-104-03-M-D-326

ESQT-104-03-M-D-326

CONN SOCKET 8POS 0.079 GOLD PCB

Samtec Inc. 		3,351 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 8 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.326 (8.27mm) 0.132 (3.35mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-104-03-M-D-330

ESQT-104-03-M-D-330

CONN SOCKET 8POS 0.079 GOLD PCB

Samtec Inc. 		3,832 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 8 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.330 (8.38mm) 0.128 (3.25mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-104-03-M-D-350

ESQT-104-03-M-D-350

CONN SOCKET 8POS 0.079 GOLD PCB

Samtec Inc. 		3,108 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 8 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.350 (8.89mm) 0.108 (2.75mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-104-03-M-D-360

ESQT-104-03-M-D-360

CONN SOCKET 8POS 0.079 GOLD PCB

Samtec Inc. 		2,045 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 8 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.360 (9.14mm) 0.098 (2.50mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-104-03-M-D-365

ESQT-104-03-M-D-365

CONN SOCKET 8POS 0.079 GOLD PCB

Samtec Inc. 		2,898 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 8 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.365 (9.27mm) 0.093 (2.35mm) -55°C ~ 125°C UL94 V-0 Tin - -
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

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