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Conectores Retangulares - Cabeçalhos, Receptáculos, Soquetes Fêmeas

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
ESQT-106-02-L-D-669

ESQT-106-02-L-D-669

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc. 		3,627 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.669 (17.00mm) 0.181 (4.60mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-L-D-690

ESQT-106-02-L-D-690

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc. 		3,290 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.690 (17.52mm) 0.160 (4.06mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-L-D-693

ESQT-106-02-L-D-693

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc. 		3,571 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.693 (17.60mm) 0.157 (4.00mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-L-D-700

ESQT-106-02-L-D-700

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc. 		3,985 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.700 (17.78mm) 0.150 (3.81mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-L-D-710

ESQT-106-02-L-D-710

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc. 		3,210 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.710 (18.03mm) 0.140 (3.56mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-L-D-712

ESQT-106-02-L-D-712

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc. 		2,096 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.712 (18.08mm) 0.138 (3.50mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-L-D-720

ESQT-106-02-L-D-720

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc. 		2,850 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.720 (18.30mm) 0.130 (3.30mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-L-D-730

ESQT-106-02-L-D-730

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc. 		3,962 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.730 (18.54mm) 0.120 (3.05mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-L-D-732

ESQT-106-02-L-D-732

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc. 		3,259 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.732 (18.59mm) 0.118 (3.00mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-L-D-740

ESQT-106-02-L-D-740

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc. 		2,409 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.740 (18.80mm) 0.110 (2.79mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-L-D-748

ESQT-106-02-L-D-748

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc. 		2,267 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.748 (19.00mm) 0.102 (2.60mm) -55°C ~ 125°C UL94 V-0 Tin - -
CLP-108-02-LM-DH

CLP-108-02-LM-DH

CONN RCPT 16P 0.05 GOLD SMD R/A

Samtec Inc. 		3,036 -

RFQ

Tube CLP Active Receptacle Female Socket Board to Board 16 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount, Right Angle Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.135 (3.43mm) - -55°C ~ 125°C UL94 V-0 Tin - -
CLP-108-02-S-D

CLP-108-02-S-D

CONN RCPT 16POS 0.05 GOLD SMD

Samtec Inc. 		2,597 -

RFQ

CLP-108-02-S-D

Ficha técnica

 Tube CLP Active Receptacle Female Socket Board to Board 16 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Tin - -
SLW-130-01-T-D

SLW-130-01-T-D

CONN RCPT 60POS 0.1 TIN PCB

Samtec Inc. 		3,878 -

RFQ

SLW-130-01-T-D

Ficha técnica

 Bulk SLW Active Receptacle Forked Board to Board 60 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.180 (4.57mm) 0.115 (2.92mm) -55°C ~ 105°C - Tin 6.09mm -
SSQ-128-01-G-S

SSQ-128-01-G-S

CONN RCPT 28POS 0.1 GOLD PCB

Samtec Inc. 		3,600 -

RFQ

SSQ-128-01-G-S

Ficha técnica

 Bulk SSQ Active Receptacle Forked Board to Board or Cable 28 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.335 (8.51mm) 0.104 (2.64mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQT-106-02-L-D-750

ESQT-106-02-L-D-750

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc. 		2,364 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.750 (19.05mm) 0.100 (2.54mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-L-D-755

ESQT-106-02-L-D-755

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc. 		3,022 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.755 (19.18mm) 0.095 (2.41mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-106-02-L-D-771

ESQT-106-02-L-D-771

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc. 		2,016 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.771 (19.58mm) 0.079 (2.00mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-110-03-M-S-324

ESQT-110-03-M-S-324

CONN SOCKET 10POS 0.079 GOLD PCB

Samtec Inc. 		3,016 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 10 All 0.079 (2.00mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.324 (8.23mm) 0.134 (3.40mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-110-03-M-S-328

ESQT-110-03-M-S-328

CONN SOCKET 10POS 0.079 GOLD PCB

Samtec Inc. 		3,031 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 10 All 0.079 (2.00mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.328 (8.33mm) 0.130 (3.30mm) -55°C ~ 125°C UL94 V-0 Tin - -
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1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

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 Fudong Communication (Shenzhen) Grupo Co., Ltd.

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 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

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