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Fudong Communication (Shenzhen) Grupo Co., Ltd.+86 075582561136 Fudong Communication (Shenzhen) Grupo Co., Ltd.[email protected]
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Conectores Retangulares - Cabeçalhos, Receptáculos, Soquetes Fêmeas

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
CLP-125-02-L-D-PA-TR

CLP-125-02-L-D-PA-TR

CONN RCPT 50POS 0.05 GOLD SMD

Samtec Inc. 		2,654 -

RFQ

CLP-125-02-L-D-PA-TR

Ficha técnica

 Tape & Reel (TR) CLP Active Receptacle Female Socket Board to Board 50 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Tin - -
CLP-125-02-LM-D-PA-TR

CLP-125-02-LM-D-PA-TR

CONN RCPT 50POS 0.05 GOLD SMD

Samtec Inc. 		3,088 -

RFQ

Tape & Reel (TR) CLP Active Receptacle Female Socket Board to Board 50 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Tin - -
CLT-106-02-SM-D-BE-A

CLT-106-02-SM-D-BE-A

CONN RCPT 12POS 0.079 GOLD SMD

Samtec Inc. 		3,477 -

RFQ

CLT-106-02-SM-D-BE-A

Ficha técnica

 Tube CLT Active Receptacle, Bottom Entry Female Socket Board to Board 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.083 (2.10mm) - -55°C ~ 125°C UL94 V-0 Tin - -
CLT-106-02-S-D-BE-A

CLT-106-02-S-D-BE-A

CONN RCPT 12POS 0.079 GOLD SMD

Samtec Inc. 		2,119 -

RFQ

CLT-106-02-S-D-BE-A

Ficha técnica

 Tube CLT Active Receptacle, Bottom Entry Female Socket Board to Board 12 All 0.079 (2.00mm) 2 0.079 (2.00mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.083 (2.10mm) - -55°C ~ 125°C UL94 V-0 Tin - -
BCS-117-T-D-HE

BCS-117-T-D-HE

CONN RCPT 34POS 0.1 TIN PCB R/A

Samtec Inc. 		2,168 -

RFQ

BCS-117-T-D-HE

Ficha técnica

 Tube Tiger Claw™ BCS Active Receptacle Female Socket Board to Board 34 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole, Right Angle Solder Push-Pull Tin - Black 0.210 (5.33mm) 0.125 (3.18mm) -55°C ~ 125°C UL94 V-0 Tin - -
CLP-120-02-L-S

CLP-120-02-L-S

CONN RCPT 20POS 0.05 GOLD SMD

Samtec Inc. 		2,628 -

RFQ

CLP-120-02-L-S

Ficha técnica

 Tube CLP Active Receptacle Female Socket Board to Board 20 All 0.050 (1.27mm) 1 - Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Tin - -
CLM-110-02-F-D-BE-PA

CLM-110-02-F-D-BE-PA

CONN RCPT 20POS 0.039 GOLD SMD

Samtec Inc. 		3,391 -

RFQ

CLM-110-02-F-D-BE-PA

Ficha técnica

 Tray CLM Active Receptacle, Bottom Entry Female Socket Board to Board 20 All 0.039 (1.00mm) 2 0.039 (1.00mm) Surface Mount Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Tin - -
SSM-125-L-SV-TR

SSM-125-L-SV-TR

CONN RCPT 25POS 0.1 GOLD SMD

Samtec Inc. 		2,990 -

RFQ

Tape & Reel (TR) SSM Active Receptacle, Pass Through Female Socket Board to Board or Cable 25 All 0.100 (2.54mm) 1 - Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.290 (7.37mm) - -55°C ~ 125°C - Tin - -
BCS-130-L-S-PE

BCS-130-L-S-PE

CONN RCPT 30POS 0.1 GOLD PCB

Samtec Inc. 		3,617 -

RFQ

BCS-130-L-S-PE

Ficha técnica

 Tube Tiger Claw™ BCS Active Receptacle, Pass Through Female Socket Board to Board 30 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.290 (7.37mm) 0.128 (3.25mm) -55°C ~ 125°C UL94 V-0 Tin - -
BCS-130-L-S-TE

BCS-130-L-S-TE

CONN RCPT 30POS 0.1 GOLD PCB

Samtec Inc. 		2,059 -

RFQ

BCS-130-L-S-TE

Ficha técnica

 Tube Tiger Claw™ BCS Active Receptacle Female Socket Board to Board 30 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.290 (7.37mm) 0.122 (3.10mm) -55°C ~ 125°C UL94 V-0 Tin - -
CES-131-01-T-D

CES-131-01-T-D

CONN RCPT 62POS 0.1 TIN PCB

Samtec Inc. 		3,443 -

RFQ

CES-131-01-T-D

Ficha técnica

 Bulk CES Active Receptacle Female Socket Board to Board 62 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.200 (5.08mm) 0.128 (3.25mm) -55°C ~ 105°C UL94 V-0 Tin - -
SQT-122-01-L-S

SQT-122-01-L-S

CONN RCPT 22POS 0.079 GOLD PCB

Samtec Inc. 		3,039 -

RFQ

SQT-122-01-L-S

Ficha técnica

 Bulk SQT Active Receptacle Forked Board to Board or Cable 22 All 0.079 (2.00mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.250 (6.35mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - -
SSQ-146-02-T-S-RA

SSQ-146-02-T-S-RA

CONN RCPT 46POS 0.1 TIN PCB R/A

Samtec Inc. 		2,867 -

RFQ

SSQ-146-02-T-S-RA

Ficha técnica

 Bulk SSQ Active Receptacle Forked Board to Board or Cable 46 All 0.100 (2.54mm) 1 - Through Hole, Right Angle Solder Push-Pull Tin - Black 0.095 (2.41mm) 0.100 (2.54mm) -55°C ~ 105°C UL94 V-0 Tin - -
BSW-113-24-G-S

BSW-113-24-G-S

CONN RCPT 13POS 0.1 GOLD PCB

Samtec Inc. 		3,779 -

RFQ

BSW-113-24-G-S

Ficha técnica

 Bulk BSW Active Receptacle, Breakaway Female Socket Board to Board 13 All 0.100 (2.54mm) 1 - Through Hole, Bottom Mount Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.350 (8.89mm) 0.170 (4.32mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-109-03-F-D-315

ESQT-109-03-F-D-315

CONN SOCKET 18POS 0.079 GOLD PCB

Samtec Inc. 		2,437 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 18 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.315 (8.00mm) 0.143 (3.63mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-109-03-F-D-335

ESQT-109-03-F-D-335

CONN SOCKET 18POS 0.079 GOLD PCB

Samtec Inc. 		2,849 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 18 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.335 (8.51mm) 0.123 (3.12mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-109-03-F-D-340

ESQT-109-03-F-D-340

CONN SOCKET 18POS 0.079 GOLD PCB

Samtec Inc. 		2,934 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 18 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.340 (8.64mm) 0.118 (3.00mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-109-03-F-D-355

ESQT-109-03-F-D-355

CONN SOCKET 18POS 0.079 GOLD PCB

Samtec Inc. 		2,122 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 18 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.355 (9.02mm) 0.103 (2.62mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-109-03-F-D-368

ESQT-109-03-F-D-368

CONN SOCKET 18POS 0.079 GOLD PCB

Samtec Inc. 		3,807 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 18 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.368 (9.35mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-109-03-F-D-370

ESQT-109-03-F-D-370

CONN SOCKET 18POS 0.079 GOLD PCB

Samtec Inc. 		2,668 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 18 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.370 (9.40mm) 0.088 (2.23mm) -55°C ~ 125°C UL94 V-0 Tin - -
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

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