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Fudong Communication (Shenzhen) Grupo Co., Ltd.+86 075582561136 Fudong Communication (Shenzhen) Grupo Co., Ltd.[email protected]
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Conectores Retangulares - Cabeçalhos, Receptáculos, Soquetes Fêmeas

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
SQW-112-01-S-D-VS-A-P-TR

SQW-112-01-S-D-VS-A-P-TR

CONN RCPT 24POS 0.079 GOLD SMD

Samtec Inc. 		2,669 -

RFQ

Tape & Reel (TR) SQW Active Receptacle Forked Board to Board or Cable 24 All 0.079 (2.00mm) 2 0.079 (2.00mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.300 (7.62mm) - -55°C ~ 125°C UL94 V-0 Tin - -
SSM-110-SM-DV-K-TR

SSM-110-SM-DV-K-TR

CONN RCPT 20POS 0.1 GOLD SMD

Samtec Inc. 		2,953 -

RFQ

Tape & Reel (TR) SSM Active Receptacle, Pass Through Female Socket Board to Board or Cable 20 All 0.100 (2.54mm) 2 0.100 (2.54mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.290 (7.37mm) - -55°C ~ 125°C - Tin - -
BCS-114-F-D-PE-BE

BCS-114-F-D-PE-BE

CONN RCPT 28POS 0.1 GOLD PCB

Samtec Inc. 		2,759 -

RFQ

BCS-114-F-D-PE-BE

Ficha técnica

 Tube Tiger Claw™ BCS Active Receptacle, Pass Through Female Socket Board to Board 28 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.290 (7.37mm) 0.128 (3.25mm) -55°C ~ 125°C UL94 V-0 Tin - -
CLP-130-02-F-D-BE-PA-TR

CLP-130-02-F-D-BE-PA-TR

CONN RCPT 60POS 0.05 GOLD SMD

Samtec Inc. 		2,408 -

RFQ

CLP-130-02-F-D-BE-PA-TR

Ficha técnica

 Tape & Reel (TR) CLP Active Receptacle, Bottom Entry Female Socket Board to Board 60 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Tin - -
FLE-130-01-G-DV-TR

FLE-130-01-G-DV-TR

CONN RCPT 60POS 0.05 GOLD SMD

Samtec Inc. 		3,632 -

RFQ

FLE-130-01-G-DV-TR

Ficha técnica

 Tape & Reel (TR) FLE Active Receptacle Female Socket Board to Board or Cable 60 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.172 (4.37mm) - -55°C ~ 125°C - Gold - -
CLT-118-02-H-D-BE-P-TR

CLT-118-02-H-D-BE-P-TR

CONN RCPT 36POS 0.079 GOLD SMD

Samtec Inc. 		2,113 -

RFQ

CLT-118-02-H-D-BE-P-TR

Ficha técnica

 Tape & Reel (TR) CLT Active Receptacle, Bottom Entry Female Socket Board to Board 36 All 0.079 (2.00mm) 2 0.079 (2.00mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.083 (2.10mm) - -55°C ~ 125°C UL94 V-0 Gold - -
BCS-127-L-S-HE

BCS-127-L-S-HE

CONN RCPT 27POS 0.1 GOLD PCB R/A

Samtec Inc. 		2,699 -

RFQ

BCS-127-L-S-HE

Ficha técnica

 Tube Tiger Claw™ BCS Active Receptacle Female Socket Board to Board 27 All 0.100 (2.54mm) 1 - Through Hole, Right Angle Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.110 (2.79mm) 0.125 (3.18mm) -55°C ~ 125°C UL94 V-0 Tin - -
BSW-116-24-L-S

BSW-116-24-L-S

CONN RCPT 16POS 0.1 GOLD PCB

Samtec Inc. 		2,023 -

RFQ

BSW-116-24-L-S

Ficha técnica

 Bulk BSW Active Receptacle, Breakaway Female Socket Board to Board 16 All 0.100 (2.54mm) 1 - Through Hole, Bottom Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.350 (8.89mm) 0.170 (4.32mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-111-44-T-D

ESQ-111-44-T-D

CONN SOCKET 22POS 0.1 TIN PCB

Samtec Inc. 		3,644 -

RFQ

ESQ-111-44-T-D

Ficha técnica

 Tube ESQ Active Elevated Socket Forked Board to Board 22 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.735 (18.67mm) 0.180 (4.57mm) -55°C ~ 105°C UL94 V-0 Tin - -
ESQT-107-03-L-D-310

ESQT-107-03-L-D-310

CONN SOCKET 14POS 0.079 GOLD PCB

Samtec Inc. 		2,152 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 14 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.310 (7.87mm) 0.148 (3.76mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-107-03-L-D-314

ESQT-107-03-L-D-314

CONN SOCKET 14POS 0.079 GOLD PCB

Samtec Inc. 		3,826 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 14 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.314 (7.98mm) 0.144 (3.66mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-107-03-L-D-315

ESQT-107-03-L-D-315

CONN SOCKET 14POS 0.079 GOLD PCB

Samtec Inc. 		2,674 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 14 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.315 (8.00mm) 0.143 (3.63mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-107-03-L-D-325

ESQT-107-03-L-D-325

CONN SOCKET 14POS 0.079 GOLD PCB

Samtec Inc. 		3,894 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 14 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.325 (8.25mm) 0.133 (3.38mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-107-03-L-D-330

ESQT-107-03-L-D-330

CONN SOCKET 14POS 0.079 GOLD PCB

Samtec Inc. 		3,449 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 14 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.330 (8.38mm) 0.128 (3.25mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-107-03-L-D-335

ESQT-107-03-L-D-335

CONN SOCKET 14POS 0.079 GOLD PCB

Samtec Inc. 		3,562 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 14 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.335 (8.51mm) 0.123 (3.12mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-107-03-L-D-350

ESQT-107-03-L-D-350

CONN SOCKET 14POS 0.079 GOLD PCB

Samtec Inc. 		3,461 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 14 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.350 (8.89mm) 0.108 (2.75mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-107-03-L-D-355

ESQT-107-03-L-D-355

CONN SOCKET 14POS 0.079 GOLD PCB

Samtec Inc. 		2,619 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 14 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.355 (9.02mm) 0.103 (2.62mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-107-03-L-D-363

ESQT-107-03-L-D-363

CONN SOCKET 14POS 0.079 GOLD PCB

Samtec Inc. 		2,715 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 14 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.363 (9.22mm) 0.095 (2.41mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-107-03-L-D-380

ESQT-107-03-L-D-380

CONN SOCKET 14POS 0.079 GOLD PCB

Samtec Inc. 		3,715 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 14 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.380 (9.65mm) 0.078 (1.98mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-107-03-L-D-390

ESQT-107-03-L-D-390

CONN SOCKET 14POS 0.079 GOLD PCB

Samtec Inc. 		2,431 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 14 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.390 (9.91mm) 0.068 (1.73mm) -55°C ~ 125°C UL94 V-0 Tin - -
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

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