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Fudong Communication (Shenzhen) Grupo Co., Ltd.+86 075582561136 Fudong Communication (Shenzhen) Grupo Co., Ltd.[email protected]
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Conectores Retangulares - Cabeçalhos, Receptáculos, Soquetes Fêmeas

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
SSM-116-SM-SV-P-TR

SSM-116-SM-SV-P-TR

CONN RCPT 16POS 0.1 GOLD SMD

Samtec Inc. 		2,849 -

RFQ

Tape & Reel (TR) SSM Active Receptacle, Pass Through Female Socket Board to Board or Cable 16 All 0.100 (2.54mm) 1 - Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.290 (7.37mm) - -55°C ~ 125°C - Tin - -
SSM-116-S-SV-BE-P-TR

SSM-116-S-SV-BE-P-TR

CONN RCPT 16POS 0.1 GOLD SMD

Samtec Inc. 		3,146 -

RFQ

Tape & Reel (TR) SSM Active Receptacle, Bottom Entry Female Socket Board to Board or Cable 16 All 0.100 (2.54mm) 1 - Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.290 (7.37mm) - -55°C ~ 125°C - Tin - -
CLP-128-02-L-D-BE-K-TR

CLP-128-02-L-D-BE-K-TR

CONN RCPT 56POS 0.05 GOLD SMD

Samtec Inc. 		3,404 -

RFQ

CLP-128-02-L-D-BE-K-TR

Ficha técnica

 Tape & Reel (TR) CLP Active Receptacle, Bottom Entry Female Socket Board to Board 56 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Tin - -
CLT-127-02-L-D-A-K-TR

CLT-127-02-L-D-A-K-TR

CONN RCPT 54POS 0.079 GOLD SMD

Samtec Inc. 		2,123 -

RFQ

CLT-127-02-L-D-A-K-TR

Ficha técnica

 Tape & Reel (TR) CLT Active Receptacle Female Socket Board to Board 54 All 0.079 (2.00mm) 2 0.079 (2.00mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.083 (2.10mm) - -55°C ~ 125°C UL94 V-0 Tin - -
HLE-118-02-G-DV-BE-A-K-TR

HLE-118-02-G-DV-BE-A-K-TR

CONN RCPT 36POS 0.1 GOLD SMD

Samtec Inc. 		2,563 -

RFQ

Tape & Reel (TR) HLE Active Receptacle, Bottom Entry Female Socket Board to Board 36 All 0.100 (2.54mm) 2 0.100 (2.54mm) Surface Mount Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.144 (3.66mm) - -55°C ~ 125°C - Gold - -
SSM-122-S-SH-TR

SSM-122-S-SH-TR

CONN RCPT 22POS 0.1 GOLD SMD R/A

Samtec Inc. 		3,763 -

RFQ

Tape & Reel (TR) SSM Active Receptacle Female Socket Board to Board or Cable 22 All 0.100 (2.54mm) 1 - Surface Mount, Right Angle Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.125 (3.18mm) - -55°C ~ 125°C - Tin - -
HLE-110-02-H-DV-BE-A-P-TR

HLE-110-02-H-DV-BE-A-P-TR

CONN RCPT 20POS 0.1 GOLD SMD

Samtec Inc. 		3,127 -

RFQ

Tape & Reel (TR) HLE Active Receptacle, Bottom Entry Female Socket Board to Board 20 All 0.100 (2.54mm) 2 0.100 (2.54mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.144 (3.66mm) - -55°C ~ 125°C - Gold - -
BCS-117-L-D-HE

BCS-117-L-D-HE

CONN RCPT 34POS 0.1 GOLD PCB R/A

Samtec Inc. 		3,227 -

RFQ

BCS-117-L-D-HE

Ficha técnica

 Tube Tiger Claw™ BCS Active Receptacle Female Socket Board to Board 34 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole, Right Angle Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.225 (5.72mm) 0.125 (3.18mm) -55°C ~ 125°C UL94 V-0 Tin - -
SL-118-G-11

SL-118-G-11

CONN RCPT 18POS 0.1 GOLD PCB

Samtec Inc. 		3,430 -

RFQ

SL-118-G-11

Ficha técnica

 Bulk SL Active Receptacle Female Socket Board to Board 18 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.132 (3.35mm) 0.108 (2.75mm) -55°C ~ 125°C - - - -
SSA-130-S-G

SSA-130-S-G

CONN RCPT 30POS 0.1 GOLD PCB

Samtec Inc. 		3,471 -

RFQ

SSA-130-S-G

Ficha técnica

 Bulk SSA Active Receptacle, Breakaway Female Socket Board to Board 30 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.230 (5.85mm) 0.151 (3.84mm) -55°C ~ 125°C UL94 V-0 - - -
SQT-114-01-L-D

SQT-114-01-L-D

CONN RCPT 28POS 0.079 GOLD PCB

Samtec Inc. 		3,066 -

RFQ

SQT-114-01-L-D

Ficha técnica

 Bulk SQT Active Receptacle Forked Board to Board or Cable 28 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.250 (6.35mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - -
SSQ-118-01-G-D

SSQ-118-01-G-D

CONN RCPT 36POS 0.1 GOLD PCB

Samtec Inc. 		2,915 -

RFQ

SSQ-118-01-G-D

Ficha técnica

 Bulk SSQ Active Receptacle Forked Board to Board or Cable 36 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.335 (8.51mm) 0.104 (2.64mm) -55°C ~ 125°C UL94 V-0 Gold - -
BSW-111-04-L-D

BSW-111-04-L-D

CONN RCPT 22POS 0.1 GOLD PCB

Samtec Inc. 		2,138 -

RFQ

BSW-111-04-L-D

Ficha técnica

 Bulk BSW Active Receptacle, Breakaway Female Socket Board to Board 22 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole, Bottom Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.350 (8.89mm) 0.165 (4.19mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESD-103-G-05

ESD-103-G-05

CONN SOCKET 6POS 0.1 GOLD PCB

Samtec Inc. 		2,559 -

RFQ

Bulk ESD Active Elevated Socket Female Socket Board to Board 6 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.500 (12.70mm) 0.165 (4.19mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQ-120-44-T-S

ESQ-120-44-T-S

CONN SOCKET 20POS 0.1 TIN PCB

Samtec Inc. 		2,381 -

RFQ

ESQ-120-44-T-S

Ficha técnica

 Tube ESQ Active Elevated Socket Forked Board to Board 20 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.735 (18.67mm) 0.180 (4.57mm) -55°C ~ 105°C UL94 V-0 Tin - -
ESQT-110-02-F-D-360

ESQT-110-02-F-D-360

CONN SOCKET 20POS 0.079 GOLD PCB

Samtec Inc. 		2,230 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 20 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.360 (9.14mm) 0.490 (12.45mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-110-02-F-D-430

ESQT-110-02-F-D-430

CONN SOCKET 20POS 0.079 GOLD PCB

Samtec Inc. 		2,005 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 20 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.430 (10.92mm) 0.420 (10.67mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-110-02-F-D-480

ESQT-110-02-F-D-480

CONN SOCKET 20POS 0.079 GOLD PCB

Samtec Inc. 		3,336 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 20 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.480 (12.20mm) 0.370 (9.40mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-110-02-F-D-512

ESQT-110-02-F-D-512

CONN SOCKET 20POS 0.079 GOLD PCB

Samtec Inc. 		2,664 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 20 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.512 (13.00mm) 0.338 (8.59mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-110-02-F-D-565

ESQT-110-02-F-D-565

CONN SOCKET 20POS 0.079 GOLD PCB

Samtec Inc. 		3,312 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 20 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.565 (14.35mm) 0.285 (7.24mm) -55°C ~ 125°C UL94 V-0 Tin - -
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

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