Sobre nós
Fudong Communication (Shenzhen) Grupo Co., Ltd.+86 075582561136 Fudong Communication (Shenzhen) Grupo Co., Ltd.[email protected]
Idioma
Carregar BOM
Cart
Todas as categorias

Conectores Retangulares - Cabeçalhos, Receptáculos, Soquetes Fêmeas

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
ESQT-108-02-L-D-368

ESQT-108-02-L-D-368

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		2,711 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.368 (9.35mm) 0.482 (12.24mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-L-D-391

ESQT-108-02-L-D-391

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		3,873 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.391 (9.93mm) 0.459 (11.66mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-L-D-552

ESQT-108-02-L-D-552

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		3,232 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.552 (14.02mm) 0.298 (7.57mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-L-D-675

ESQT-108-02-L-D-675

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		2,540 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.675 (17.14mm) 0.175 (4.45mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-L-D-680

ESQT-108-02-L-D-680

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		3,005 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.680 (17.27mm) 0.170 (4.32mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-L-D-710

ESQT-108-02-L-D-710

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		3,405 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.710 (18.03mm) 0.140 (3.56mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-L-D-720

ESQT-108-02-L-D-720

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		2,009 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.720 (18.30mm) 0.130 (3.30mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-L-D-760

ESQT-108-02-L-D-760

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		3,832 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.760 (19.30mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-L-D-770

ESQT-108-02-L-D-770

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc. 		3,132 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.770 (19.56mm) 0.080 (2.03mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-103-03-G-D-310

ESQT-103-03-G-D-310

CONN SOCKET 6POS 0.079 GOLD PCB

Samtec Inc. 		2,165 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 6 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.310 (7.87mm) 0.148 (3.76mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQT-103-03-G-D-330

ESQT-103-03-G-D-330

CONN SOCKET 6POS 0.079 GOLD PCB

Samtec Inc. 		3,428 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 6 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.330 (8.38mm) 0.128 (3.25mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQT-103-03-G-D-350

ESQT-103-03-G-D-350

CONN SOCKET 6POS 0.079 GOLD PCB

Samtec Inc. 		2,644 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 6 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.350 (8.89mm) 0.108 (2.75mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQT-103-03-G-D-354

ESQT-103-03-G-D-354

CONN SOCKET 6POS 0.079 GOLD PCB

Samtec Inc. 		2,938 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 6 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.354 (9.00mm) 0.104 (2.64mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQT-103-03-G-D-371

ESQT-103-03-G-D-371

CONN SOCKET 6POS 0.079 GOLD PCB

Samtec Inc. 		2,758 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 6 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.371 (9.42mm) 0.087 (2.20mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQT-103-03-G-D-379

ESQT-103-03-G-D-379

CONN SOCKET 6POS 0.079 GOLD PCB

Samtec Inc. 		2,974 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 6 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.379 (9.63mm) 0.079 (2.00mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQT-103-03-G-D-395

ESQT-103-03-G-D-395

CONN SOCKET 6POS 0.079 GOLD PCB

Samtec Inc. 		2,597 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 6 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.395 (10.03mm) 0.063 (1.60mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQT-103-03-G-D-400

ESQT-103-03-G-D-400

CONN SOCKET 6POS 0.079 GOLD PCB

Samtec Inc. 		2,064 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 6 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.400 (10.16mm) 0.058 (1.47mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQT-103-03-G-D-408

ESQT-103-03-G-D-408

CONN SOCKET 6POS 0.079 GOLD PCB

Samtec Inc. 		2,527 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 6 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.408 (10.36mm) 0.050 (1.27mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQT-104-02-L-T-500

ESQT-104-02-L-T-500

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc. 		2,446 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 3 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.500 (12.70mm) 0.350 (8.89mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-104-02-L-T-560

ESQT-104-02-L-T-560

CONN SOCKET 12POS 0.079 GOLD PCB

Samtec Inc. 		2,648 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 12 All 0.079 (2.00mm) 3 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.560 (14.22mm) 0.290 (7.37mm) -55°C ~ 125°C UL94 V-0 Tin - -
Total 38494 Record«Prev1... 16971698169917001701170217031704...1925Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Usuário