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Fudong Communication (Shenzhen) Grupo Co., Ltd.+86 075582561136 Fudong Communication (Shenzhen) Grupo Co., Ltd.[email protected]
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Conectores Retangulares - Cabeçalhos, Receptáculos, Soquetes Fêmeas

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
SSM-119-S-SV

SSM-119-S-SV

CONN RCPT 19POS 0.1 GOLD SMD

Samtec Inc. 		3,383 -

RFQ

SSM-119-S-SV

Ficha técnica

 Bulk SSM Active Receptacle, Pass Through Female Socket Board to Board or Cable 19 All 0.100 (2.54mm) 1 - Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.290 (7.37mm) - -55°C ~ 125°C - Tin - -
BSW-110-04-G-D

BSW-110-04-G-D

CONN RCPT 20POS 0.1 GOLD PCB

Samtec Inc. 		2,410 -

RFQ

BSW-110-04-G-D

Ficha técnica

 Bulk BSW Active Receptacle, Breakaway Female Socket Board to Board 20 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole, Bottom Mount Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.350 (8.89mm) 0.165 (4.19mm) -55°C ~ 125°C UL94 V-0 Tin - -
SFM-115-02-S-D-N-P-TR

SFM-115-02-S-D-N-P-TR

CONN RCPT 30POS 0.05 GOLD SMD

Samtec Inc. 		3,923 -

RFQ

SFM-115-02-S-D-N-P-TR

Ficha técnica

 Tape & Reel (TR) Tiger Eye™ SFM Active Receptacle Female Socket Board to Board or Cable 30 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.185 (4.70mm) - -55°C ~ 125°C UL94 V-0 Tin 6.15mm, 6.30mm, 7.92mm, 8.08mm, 9.70mm, 9.86mm, 11.61mm, 11.76mm -
SFM-115-02-SM-D-P-TR

SFM-115-02-SM-D-P-TR

CONN RCPT 30POS 0.05 GOLD SMD

Samtec Inc. 		3,205 -

RFQ

Tape & Reel (TR) Tiger Eye™ SFM Active Receptacle Female Socket Board to Board or Cable 30 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.185 (4.70mm) - -55°C ~ 125°C UL94 V-0 Tin 6.15mm, 6.30mm, 7.92mm, 8.08mm, 9.70mm, 9.86mm, 11.61mm, 11.76mm -
HLE-115-02-S-DV-LC-P-TR

HLE-115-02-S-DV-LC-P-TR

CONN RCPT 30POS 0.1 GOLD SMD

Samtec Inc. 		2,256 -

RFQ

Tape & Reel (TR) HLE Active Receptacle Female Socket Board to Board 30 All 0.100 (2.54mm) 2 0.100 (2.54mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.144 (3.66mm) - -55°C ~ 125°C - Tin - -
SFMC-120-02-L-D-TR

SFMC-120-02-L-D-TR

CONN RCPT 40POS 0.05 GOLD SMD

Samtec Inc. 		3,664 -

RFQ

SFMC-120-02-L-D-TR

Ficha técnica

 Tape & Reel (TR) Tiger Eye™ SFMC Active Receptacle Female Socket Board to Board or Cable 40 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.185 (4.70mm) - -55°C ~ 125°C UL94 V-0 Tin - -
SLW-119-01-S-D

SLW-119-01-S-D

CONN RCPT 38POS 0.1 GOLD PCB

Samtec Inc. 		3,844 -

RFQ

SLW-119-01-S-D

Ficha técnica

 Bulk SLW Active Receptacle Forked Board to Board 38 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.180 (4.57mm) 0.115 (2.92mm) -55°C ~ 125°C - Tin 6.09mm -
SLW-138-01-S-S

SLW-138-01-S-S

CONN RCPT 38POS 0.1 GOLD PCB

Samtec Inc. 		3,508 -

RFQ

SLW-138-01-S-S

Ficha técnica

 Bulk SLW Active Receptacle Forked Board to Board 38 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.180 (4.57mm) 0.115 (2.92mm) -55°C ~ 125°C - Tin 6.09mm -
FHP-11-01-T-S

FHP-11-01-T-S

CONN RCPT 11POS 0.156 TIN PCB

Samtec Inc. 		2,009 -

RFQ

FHP-11-01-T-S

Ficha técnica

 Tube FHP Active Receptacle Female Socket Board to Board 11 All 0.156 (3.96mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.350 (8.89mm) 0.102 (2.60mm) -55°C ~ 105°C - Tin - -
SMM-116-02-S-S

SMM-116-02-S-S

CONN RCPT 16POS 0.079 GOLD SMD

Samtec Inc. 		3,522 -

RFQ

SMM-116-02-S-S

Ficha técnica

 Bulk Tiger Eye™ SMM Active Receptacle Female Socket Board to Board or Cable 16 All 0.079 (2.00mm) 1 - Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.140 (3.56mm) - -55°C ~ 125°C UL94 V-0 Tin - -
SSM-112-L-DV-A

SSM-112-L-DV-A

CONN RCPT 24POS 0.1 GOLD SMD

Samtec Inc. 		3,338 -

RFQ

SSM-112-L-DV-A

Ficha técnica

 Tube SSM Active Receptacle, Pass Through Female Socket Board to Board or Cable 24 All 0.100 (2.54mm) 2 0.100 (2.54mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.290 (7.37mm) - -55°C ~ 125°C - Tin - -
CLM-111-02-F-D-A-P

CLM-111-02-F-D-A-P

CONN RCPT 22POS 0.039 GOLD SMD

Samtec Inc. 		3,946 -

RFQ

CLM-111-02-F-D-A-P

Ficha técnica

 Tube CLM Active Receptacle Female Socket Board to Board 22 All 0.039 (1.00mm) 2 0.039 (1.00mm) Surface Mount Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Tin - -
CLT-107-02-S-D-BE

CLT-107-02-S-D-BE

CONN RCPT 14POS 0.079 GOLD SMD

Samtec Inc. 		3,718 -

RFQ

CLT-107-02-S-D-BE

Ficha técnica

 Bulk CLT Active Receptacle, Bottom Entry Female Socket Board to Board 14 All 0.079 (2.00mm) 2 0.079 (2.00mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.083 (2.10mm) - -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-114-44-L-S

ESQ-114-44-L-S

CONN SOCKET 14POS 0.1 GOLD PCB

Samtec Inc. 		2,753 -

RFQ

ESQ-114-44-L-S

Ficha técnica

 Bulk ESQ Active Elevated Socket Forked Board to Board 14 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.735 (18.67mm) 0.180 (4.57mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-117-23-L-S

ESQ-117-23-L-S

CONN SOCKET 17POS 0.1 GOLD PCB

Samtec Inc. 		2,610 -

RFQ

ESQ-117-23-L-S

Ficha técnica

 Bulk ESQ Active Elevated Socket Forked Board to Board 17 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.535 (13.60mm) 0.190 (4.83mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-113-34-T-D

ESQ-113-34-T-D

CONN SOCKET 26POS 0.1 TIN PCB

Samtec Inc. 		2,791 -

RFQ

ESQ-113-34-T-D

Ficha técnica

 Tube ESQ Active Elevated Socket Forked Board to Board 26 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.635 (16.13mm) 0.280 (7.11mm) -55°C ~ 105°C UL94 V-0 Tin - -
ESQT-111-02-F-D-309

ESQT-111-02-F-D-309

CONN SOCKET 22POS 0.079 GOLD PCB

Samtec Inc. 		2,125 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 22 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.309 (7.85mm) 0.541 (13.74mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-111-02-F-D-660

ESQT-111-02-F-D-660

CONN SOCKET 22POS 0.079 GOLD PCB

Samtec Inc. 		2,252 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 22 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.660 (16.76mm) 0.190 (4.83mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-111-02-F-D-310

ESQT-111-02-F-D-310

CONN SOCKET 22POS 0.079 GOLD PCB

Samtec Inc. 		2,883 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 22 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.310 (7.87mm) 0.540 (13.72mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-111-02-F-D-315

ESQT-111-02-F-D-315

CONN SOCKET 22POS 0.079 GOLD PCB

Samtec Inc. 		3,661 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 22 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.315 (8.00mm) 0.535 (13.59mm) -55°C ~ 125°C UL94 V-0 Tin - -
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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 Fudong Communication (Shenzhen) Grupo Co., Ltd.

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 Fudong Communication (Shenzhen) Grupo Co., Ltd.

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 Fudong Communication (Shenzhen) Grupo Co., Ltd.

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