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Fudong Communication (Shenzhen) Grupo Co., Ltd.+86 075582561136 Fudong Communication (Shenzhen) Grupo Co., Ltd.[email protected]
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Conectores Retangulares - Cabeçalhos, Receptáculos, Soquetes Fêmeas

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
BCS-119-F-D-DE

BCS-119-F-D-DE

CONN RCPT 38POS 0.1 GOLD PCB

Samtec Inc. 		2,970 -

RFQ

BCS-119-F-D-DE

Ficha técnica

 Bulk Tiger Claw™ BCS Active Receptacle, Bottom or Top Entry Female Socket Board to Board 38 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.290 (7.37mm) 0.120 (3.05mm) -55°C ~ 125°C UL94 V-0 Tin - -
CLT-114-02-L-D-K

CLT-114-02-L-D-K

CONN RCPT 28POS 0.079 GOLD SMD

Samtec Inc. 		2,986 -

RFQ

CLT-114-02-L-D-K

Ficha técnica

 Tube CLT Active Receptacle Female Socket Board to Board 28 All 0.079 (2.00mm) 2 0.079 (2.00mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.083 (2.10mm) - -55°C ~ 125°C UL94 V-0 Tin - -
SSQ-138-01-T-D

SSQ-138-01-T-D

CONN RCPT 76POS 0.1 TIN PCB

Samtec Inc. 		2,023 -

RFQ

SSQ-138-01-T-D

Ficha técnica

 Bulk SSQ Active Receptacle Forked Board to Board or Cable 76 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.335 (8.51mm) 0.104 (2.64mm) -55°C ~ 105°C UL94 V-0 Tin - -
SSQ-134-02-G-S

SSQ-134-02-G-S

CONN RCPT 34POS 0.1 GOLD PCB

Samtec Inc. 		3,153 -

RFQ

SSQ-134-02-G-S

Ficha técnica

 Bulk SSQ Active Receptacle Forked Board to Board or Cable 34 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.335 (8.51mm) 0.194 (4.93mm) -55°C ~ 125°C UL94 V-0 Gold - -
SSW-138-01-S-S

SSW-138-01-S-S

CONN RCPT 38POS 0.1 GOLD PCB

Samtec Inc. 		3,700 -

RFQ

SSW-138-01-S-S

Ficha técnica

 Bulk SSW Active Receptacle Forked Board to Board or Cable 38 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.335 (8.51mm) 0.104 (2.64mm) -55°C ~ 125°C UL94 V-0 Tin - -
BSW-117-04-G-S

BSW-117-04-G-S

CONN RCPT 17POS 0.1 GOLD PCB

Samtec Inc. 		2,090 -

RFQ

BSW-117-04-G-S

Ficha técnica

 Bulk BSW Active Receptacle, Breakaway Female Socket Board to Board 17 All 0.100 (2.54mm) 1 - Through Hole, Bottom Mount Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.350 (8.89mm) 0.170 (4.32mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-107-44-G-D

ESQ-107-44-G-D

CONN SOCKET 14POS 0.1 GOLD PCB

Samtec Inc. 		3,336 -

RFQ

ESQ-107-44-G-D

Ficha técnica

 Tube ESQ Active Elevated Socket Forked Board to Board 14 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.735 (18.67mm) 0.180 (4.57mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQ-109-14-T-T

ESQ-109-14-T-T

CONN SOCKET 27POS 0.1 TIN PCB

Samtec Inc. 		2,409 -

RFQ

ESQ-109-14-T-T

Ficha técnica

 Tube ESQ Active Elevated Socket Forked Board to Board 27 All 0.100 (2.54mm) 3 0.100 (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.435 (11.05mm) 0.480 (12.19mm) -55°C ~ 105°C UL94 V-0 Tin - -
ESQ-122-44-T-S

ESQ-122-44-T-S

CONN SOCKET 22POS 0.1 TIN PCB

Samtec Inc. 		2,038 -

RFQ

ESQ-122-44-T-S

Ficha técnica

 Tube ESQ Active Elevated Socket Forked Board to Board 22 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.735 (18.67mm) 0.180 (4.57mm) -55°C ~ 105°C UL94 V-0 Tin - -
ESQ-123-34-T-S

ESQ-123-34-T-S

CONN SOCKET 23POS 0.1 TIN PCB

Samtec Inc. 		2,961 -

RFQ

ESQ-123-34-T-S

Ficha técnica

 Tube ESQ Active Elevated Socket Forked Board to Board 23 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.635 (16.13mm) 0.280 (7.11mm) -55°C ~ 105°C UL94 V-0 Tin - -
ESW-104-33-H-D-LL

ESW-104-33-H-D-LL

CONN SOCKET 8POS 0.1 GOLD PCB

Samtec Inc. 		2,694 -

RFQ

ESW-104-33-H-D-LL

Ficha técnica

 Bulk ESW Active Elevated Socket Forked Board to Board 8 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Kinked Pin, Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.635 (16.13mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESW-108-58-G-D

ESW-108-58-G-D

CONN SOCKET 16POS 0.1 GOLD PCB

Samtec Inc. 		2,587 -

RFQ

ESW-108-58-G-D

Ficha técnica

 Tube ESW Active Elevated Socket Forked Board to Board 16 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.635 (16.13mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Gold - -
SSM-108-L-DH-LC

SSM-108-L-DH-LC

CONN RCPT 16POS 0.1 GOLD SMD R/A

Samtec Inc. 		2,851 -

RFQ

Tube SSM Active Receptacle Female Socket Board to Board or Cable 16 All 0.100 (2.54mm) 2 0.100 (2.54mm) Surface Mount, Right Angle Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.225 (5.72mm) - -55°C ~ 125°C - Tin - -
SSM-114-F-DV-LC-001

SSM-114-F-DV-LC-001

CONN RCPT 28POS 0.1 GOLD SMD

Samtec Inc. 		2,494 -

RFQ

Tube SSM Active Receptacle, Pass Through Female Socket Board to Board or Cable 28 27 0.100 (2.54mm) 2 0.100 (2.54mm) Surface Mount Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.290 (7.37mm) - -55°C ~ 125°C - Tin - -
SSW-111-04-G-D

SSW-111-04-G-D

CONN RCPT 22POS 0.1 GOLD PCB

Samtec Inc. 		3,919 -

RFQ

Bulk SSW Active Receptacle Forked Board to Board or Cable 22 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.335 (8.51mm) 0.584 (14.83mm) -55°C ~ 125°C UL94 V-0 Gold - -
SSW-113-22-L-D-RA

SSW-113-22-L-D-RA

CONN RCPT 26POS 0.1 GOLD PCB R/A

Samtec Inc. 		2,111 -

RFQ

Bulk SSW Active Receptacle Forked Board to Board or Cable 26 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole, Right Angle Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.195 (4.95mm) 0.100 (2.54mm) -55°C ~ 125°C UL94 V-0 Tin - -
SSW-120-02-T-D-RA-LL-001

SSW-120-02-T-D-RA-LL-001

CONN RCPT 40POS 0.1 TIN PCB R/A

Samtec Inc. 		2,798 -

RFQ

Bulk SSW Active Receptacle Forked Board to Board or Cable 40 39 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole, Right Angle Kinked Pin, Solder Push-Pull Tin - Black 0.195 (4.95mm) 0.100 (2.54mm) -55°C ~ 105°C UL94 V-0 Tin - -
SSW-110-23-G-D-RA

SSW-110-23-G-D-RA

CONN RCPT 20POS 0.1 GOLD PCB R/A

Samtec Inc. 		3,655 -

RFQ

Tube SSW Active Receptacle Forked Board to Board or Cable 20 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole, Right Angle Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.195 (4.95mm) 0.300 (7.62mm) -55°C ~ 125°C UL94 V-0 Gold - -
SSW-111-22-F-D-VS-P

SSW-111-22-F-D-VS-P

CONN RCPT 22POS 0.1 GOLD SMD

Samtec Inc. 		3,885 -

RFQ

SSW-111-22-F-D-VS-P

Ficha técnica

 Tube SSW Active Receptacle Forked Board to Board or Cable 22 All 0.100 (2.54mm) 2 0.100 (2.54mm) Surface Mount Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.335 (8.51mm) - -55°C ~ 125°C UL94 V-0 Tin - -
SSW-118-02-T-Q-RA

SSW-118-02-T-Q-RA

CONN RCPT 54POS 0.1 TIN PCB R/A

Samtec Inc. 		2,457 -

RFQ

Tube SSW Active Receptacle Forked Board to Board or Cable 54 36 0.100 (2.54mm) 3 0.100 (2.54mm) Through Hole, Right Angle Solder Push-Pull Tin - Black 0.295 (7.50mm) 0.100 (2.54mm) -55°C ~ 105°C UL94 V-0 Tin - -
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1800+ Fabricantes em todo o mundo
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

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 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

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