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Fudong Communication (Shenzhen) Grupo Co., Ltd.+86 075582561136 Fudong Communication (Shenzhen) Grupo Co., Ltd.[email protected]
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Conectores Retangulares - Cabeçalhos, Receptáculos, Soquetes Fêmeas

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
CLM-115-02-G-D-PA

CLM-115-02-G-D-PA

CONN RCPT 30POS 0.039 GOLD SMD

Samtec Inc. 		2,559 -

RFQ

CLM-115-02-G-D-PA

Ficha técnica

 Tray CLM Active Receptacle Female Socket Board to Board 30 All 0.039 (1.00mm) 2 0.039 (1.00mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Gold - -
ESW-127-34-T-S

ESW-127-34-T-S

CONN SOCKET 27POS 0.1 TIN PCB

Samtec Inc. 		3,885 -

RFQ

ESW-127-34-T-S

Ficha técnica

 Tube ESW Active Elevated Socket Forked Board to Board 27 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.635 (16.13mm) 0.280 (7.11mm) -55°C ~ 105°C UL94 V-0 Tin - -
MMS-120-02-L-SV

MMS-120-02-L-SV

CONN RCPT 20POS 0.079 GOLD SMD

Samtec Inc. 		3,726 -

RFQ

MMS-120-02-L-SV

Ficha técnica

 Tube MMS Active Receptacle Female Socket Board to Board or Cable 20 All 0.079 (2.00mm) 1 - Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.177 (4.50mm) - -55°C ~ 125°C - Tin - -
BSW-113-04-L-D

BSW-113-04-L-D

CONN RCPT 26POS 0.1 GOLD PCB

Samtec Inc. 		3,707 -

RFQ

BSW-113-04-L-D

Ficha técnica

 Bulk BSW Active Receptacle, Breakaway Female Socket Board to Board 26 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole, Bottom Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.350 (8.89mm) 0.165 (4.19mm) -55°C ~ 125°C UL94 V-0 Tin - -
BSW-116-24-S-S

BSW-116-24-S-S

CONN RCPT 16POS 0.1 GOLD PCB

Samtec Inc. 		3,603 -

RFQ

BSW-116-24-S-S

Ficha técnica

 Bulk BSW Active Receptacle, Breakaway Female Socket Board to Board 16 All 0.100 (2.54mm) 1 - Through Hole, Bottom Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.350 (8.89mm) 0.170 (4.32mm) -55°C ~ 125°C UL94 V-0 Tin - -
SFM-107-01-S-D

SFM-107-01-S-D

CONN RCPT 14POS 0.05 GOLD PCB

Samtec Inc. 		2,893 -

RFQ

SFM-107-01-S-D

Ficha técnica

 Tube Tiger Eye™ SFM Active Receptacle Female Socket Board to Board or Cable 14 All 0.050 (1.27mm) 2 0.050 (1.27mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.180 (4.57mm) 0.120 (3.05mm) -55°C ~ 125°C UL94 V-0 Tin 6.02mm, 6.17mm, 7.80mm, 7.95mm, 9.58mm, 9.73mm, 11.48mm, 11.63mm -
ESQ-116-14-T-D

ESQ-116-14-T-D

CONN SOCKET 32POS 0.1 TIN PCB

Samtec Inc. 		3,655 -

RFQ

ESQ-116-14-T-D

Ficha técnica

 Tube ESQ Active Elevated Socket Forked Board to Board 32 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.435 (11.05mm) 0.480 (12.19mm) -55°C ~ 105°C UL94 V-0 Tin - -
ESQT-107-03-M-D-325

ESQT-107-03-M-D-325

CONN SOCKET 14POS 0.079 GOLD PCB

Samtec Inc. 		3,597 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 14 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.325 (8.25mm) 0.133 (3.38mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-109-02-L-D-309

ESQT-109-02-L-D-309

CONN SOCKET 18POS 0.079 GOLD PCB

Samtec Inc. 		3,022 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 18 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.309 (7.85mm) 0.541 (13.74mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-109-02-L-D-447

ESQT-109-02-L-D-447

CONN SOCKET 18POS 0.079 GOLD PCB

Samtec Inc. 		2,316 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 18 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.447 (11.35mm) 0.403 (10.24mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-109-02-L-D-475

ESQT-109-02-L-D-475

CONN SOCKET 18POS 0.079 GOLD PCB

Samtec Inc. 		2,516 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 18 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.475 (12.07mm) 0.375 (9.53mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-109-02-L-D-600

ESQT-109-02-L-D-600

CONN SOCKET 18POS 0.079 GOLD PCB

Samtec Inc. 		3,632 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 18 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.600 (15.24mm) 0.250 (6.35mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-109-02-L-D-660

ESQT-109-02-L-D-660

CONN SOCKET 18POS 0.079 GOLD PCB

Samtec Inc. 		2,610 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 18 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.660 (16.76mm) 0.190 (4.83mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-109-02-L-D-740

ESQT-109-02-L-D-740

CONN SOCKET 18POS 0.079 GOLD PCB

Samtec Inc. 		2,157 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 18 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.740 (18.80mm) 0.110 (2.79mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-110-02-G-S-408

ESQT-110-02-G-S-408

CONN SOCKET 10POS 0.079 GOLD PCB

Samtec Inc. 		2,954 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 10 All 0.079 (2.00mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.408 (10.36mm) 0.442 (11.23mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQT-107-03-M-D-310

ESQT-107-03-M-D-310

CONN SOCKET 14POS 0.079 GOLD PCB

Samtec Inc. 		2,299 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 14 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.310 (7.87mm) 0.148 (3.76mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-107-03-M-D-315

ESQT-107-03-M-D-315

CONN SOCKET 14POS 0.079 GOLD PCB

Samtec Inc. 		2,633 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 14 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.315 (8.00mm) 0.143 (3.63mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-107-03-M-D-330

ESQT-107-03-M-D-330

CONN SOCKET 14POS 0.079 GOLD PCB

Samtec Inc. 		2,270 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 14 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.330 (8.38mm) 0.128 (3.25mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-107-03-M-D-334

ESQT-107-03-M-D-334

CONN SOCKET 14POS 0.079 GOLD PCB

Samtec Inc. 		3,449 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 14 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.334 (8.48mm) 0.124 (3.15mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-107-03-M-D-350

ESQT-107-03-M-D-350

CONN SOCKET 14POS 0.079 GOLD PCB

Samtec Inc. 		2,435 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 14 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.350 (8.89mm) 0.108 (2.75mm) -55°C ~ 125°C UL94 V-0 Tin - -
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

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