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Fudong Communication (Shenzhen) Grupo Co., Ltd.+86 075582561136 Fudong Communication (Shenzhen) Grupo Co., Ltd.[email protected]
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Conectores Retangulares - Cabeçalhos, Receptáculos, Soquetes Fêmeas

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
CLP-136-02-L-DH-TR

CLP-136-02-L-DH-TR

CONN RCPT 72P 0.05 GOLD SMD R/A

Samtec Inc. 		2,367 -

RFQ

Tape & Reel (TR) CLP Active Receptacle Female Socket Board to Board 72 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount, Right Angle Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.135 (3.43mm) - -55°C ~ 125°C UL94 V-0 Tin - -
CLT-126-02-G-D-BE-A-TR

CLT-126-02-G-D-BE-A-TR

CONN RCPT 52POS 0.079 GOLD SMD

Samtec Inc. 		3,122 -

RFQ

CLT-126-02-G-D-BE-A-TR

Ficha técnica

 Tape & Reel (TR) CLT Active Receptacle, Bottom Entry Female Socket Board to Board 52 All 0.079 (2.00mm) 2 0.079 (2.00mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.083 (2.10mm) - -55°C ~ 125°C UL94 V-0 Gold - -
BKS-145-01-L-V-A-P-TR

BKS-145-01-L-V-A-P-TR

CONN SOCKET 45POS 0.039 GOLD SMD

Samtec Inc. 		2,510 -

RFQ

Tape & Reel (TR) BKS Active Socket Female Socket Board to Board 45 All 0.039 (1.00mm) 2 0.100 (2.54mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Tin 4.14mm, 4.5mm, 5mm, 6mm, 7mm -
CLP-123-02-S-D-PA-TR

CLP-123-02-S-D-PA-TR

CONN RCPT 46POS 0.05 GOLD SMD

Samtec Inc. 		3,183 -

RFQ

CLP-123-02-S-D-PA-TR

Ficha técnica

 Tape & Reel (TR) CLP Active Receptacle Female Socket Board to Board 46 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Tin - -
ESW-119-12-G-S-LL

ESW-119-12-G-S-LL

CONN SOCKET 19POS 0.1 GOLD PCB

Samtec Inc. 		2,131 -

RFQ

ESW-119-12-G-S-LL

Ficha técnica

 Bulk ESW Active Elevated Socket Forked Board to Board 19 All 0.100 (2.54mm) 1 - Through Hole Kinked Pin, Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.435 (11.05mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Gold - -
CES-131-01-S-S

CES-131-01-S-S

CONN RCPT 31POS 0.1 GOLD PCB

Samtec Inc. 		3,291 -

RFQ

CES-131-01-S-S

Ficha técnica

 Bulk CES Active Receptacle Female Socket Board to Board 31 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.200 (5.08mm) 0.128 (3.25mm) -55°C ~ 125°C UL94 V-0 Tin - -
SLW-140-01-T-D

SLW-140-01-T-D

CONN RCPT 80POS 0.1 TIN PCB

Samtec Inc. 		2,059 -

RFQ

SLW-140-01-T-D

Ficha técnica

 Bulk SLW Active Receptacle Forked Board to Board 80 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.180 (4.57mm) 0.115 (2.92mm) -55°C ~ 105°C - Tin 6.09mm -
SSM-121-S-SV

SSM-121-S-SV

CONN RCPT 21POS 0.1 GOLD SMD

Samtec Inc. 		2,423 -

RFQ

SSM-121-S-SV

Ficha técnica

 Bulk SSM Active Receptacle, Pass Through Female Socket Board to Board or Cable 21 All 0.100 (2.54mm) 1 - Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.290 (7.37mm) - -55°C ~ 125°C - Tin - -
SSQ-121-01-S-D

SSQ-121-01-S-D

CONN RCPT 42POS 0.1 GOLD PCB

Samtec Inc. 		3,940 -

RFQ

SSQ-121-01-S-D

Ficha técnica

 Bulk SSQ Active Receptacle Forked Board to Board or Cable 42 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.335 (8.51mm) 0.104 (2.64mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-105-14-H-D

ESQ-105-14-H-D

CONN SOCKET 10POS 0.1 GOLD PCB

Samtec Inc. 		2,324 -

RFQ

ESQ-105-14-H-D

Ficha técnica

 Bulk ESQ Active Elevated Socket Forked Board to Board 10 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.435 (11.05mm) 0.480 (12.19mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQ-115-34-T-D

ESQ-115-34-T-D

CONN SOCKET 30POS 0.1 TIN PCB

Samtec Inc. 		2,333 -

RFQ

ESQ-115-34-T-D

Ficha técnica

 Tube ESQ Active Elevated Socket Forked Board to Board 30 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.635 (16.13mm) 0.280 (7.11mm) -55°C ~ 105°C UL94 V-0 Tin - -
ESQ-128-14-T-S

ESQ-128-14-T-S

CONN SOCKET 28POS 0.1 TIN PCB

Samtec Inc. 		2,694 -

RFQ

ESQ-128-14-T-S

Ficha técnica

 Tube ESQ Active Elevated Socket Forked Board to Board 28 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.435 (11.05mm) 0.480 (12.19mm) -55°C ~ 105°C UL94 V-0 Tin - -
ESQT-107-02-M-D-309

ESQT-107-02-M-D-309

CONN SOCKET 14POS 0.079 GOLD PCB

Samtec Inc. 		2,472 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 14 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.309 (7.85mm) 0.541 (13.74mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-107-02-M-D-310

ESQT-107-02-M-D-310

CONN SOCKET 14POS 0.079 GOLD PCB

Samtec Inc. 		2,275 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 14 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.310 (7.87mm) 0.540 (13.72mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-110-03-L-D-309

ESQT-110-03-L-D-309

CONN SOCKET 20POS 0.079 GOLD PCB

Samtec Inc. 		3,961 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 20 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.309 (7.85mm) 0.149 (3.78mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-110-03-L-D-376

ESQT-110-03-L-D-376

CONN SOCKET 20POS 0.079 GOLD PCB

Samtec Inc. 		2,978 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 20 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.376 (9.55mm) 0.082 (2.08mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-110-03-L-D-380

ESQT-110-03-L-D-380

CONN SOCKET 20POS 0.079 GOLD PCB

Samtec Inc. 		3,009 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 20 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.380 (9.65mm) 0.078 (1.98mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-110-03-L-D-381

ESQT-110-03-L-D-381

CONN SOCKET 20POS 0.079 GOLD PCB

Samtec Inc. 		2,112 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 20 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.382 (9.70mm) 0.077 (1.95mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-107-02-M-D-470

ESQT-107-02-M-D-470

CONN SOCKET 14POS 0.079 GOLD PCB

Samtec Inc. 		3,532 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 14 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.470 (11.94mm) 0.380 (9.65mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-107-02-M-D-503

ESQT-107-02-M-D-503

CONN SOCKET 14POS 0.079 GOLD PCB

Samtec Inc. 		3,325 -

RFQ

Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 14 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.503 (12.78mm) 0.347 (8.81mm) -55°C ~ 125°C UL94 V-0 Tin - -
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

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