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Fudong Communication (Shenzhen) Grupo Co., Ltd.+86 075582561136 Fudong Communication (Shenzhen) Grupo Co., Ltd.[email protected]
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Conectores Retangulares - Cabeçalhos, Receptáculos, Soquetes Fêmeas

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
RSM-122-02-L-D-P-TR

RSM-122-02-L-D-P-TR

CONN RCPT 44POS 0.05 GOLD SMD

Samtec Inc. 		2,720 -

RFQ

RSM-122-02-L-D-P-TR

Ficha técnica

 Tape & Reel (TR) RSM Active Receptacle Female Socket Board to Board 44 All 0.050 (1.27mm) 2 0.100 (2.54mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.240 (6.10mm) - -55°C ~ 125°C UL94 V-0 Tin - -
SQW-114-01-H-D-VS-P-TR

SQW-114-01-H-D-VS-P-TR

CONN RCPT 28POS 0.079 GOLD SMD

Samtec Inc. 		2,300 -

RFQ

Tape & Reel (TR) SQW Active Receptacle Forked Board to Board or Cable 28 All 0.079 (2.00mm) 2 0.079 (2.00mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.300 (7.62mm) - -55°C ~ 125°C UL94 V-0 Gold - -
SQW-124-01-L-D-VS-A-K-TR

SQW-124-01-L-D-VS-A-K-TR

CONN RCPT 48POS 0.079 GOLD SMD

Samtec Inc. 		3,340 -

RFQ

Tape & Reel (TR) SQW Active Receptacle Forked Board to Board or Cable 48 All 0.079 (2.00mm) 2 0.079 (2.00mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.300 (7.62mm) - -55°C ~ 125°C UL94 V-0 Tin - -
CLE-145-01-G-DV-A-P-TR

CLE-145-01-G-DV-A-P-TR

CONN RCPT 90POS 0.031 GOLD SMD

Samtec Inc. 		3,520 -

RFQ

CLE-145-01-G-DV-A-P-TR

Ficha técnica

 Tape & Reel (TR) CLE Active Receptacle, Pass Through Female Socket Board to Board 90 All 0.031 (0.80mm) 2 0.047 (1.20mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.130 (3.30mm) - -55°C ~ 125°C UL94 V-0 Gold - -
CLT-122-02-H-D-BE-A-P-TR

CLT-122-02-H-D-BE-A-P-TR

CONN RCPT 44POS 0.079 GOLD SMD

Samtec Inc. 		2,646 -

RFQ

CLT-122-02-H-D-BE-A-P-TR

Ficha técnica

 Tape & Reel (TR) CLT Active Receptacle, Bottom Entry Female Socket Board to Board 44 All 0.079 (2.00mm) 2 0.079 (2.00mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.083 (2.10mm) - -55°C ~ 125°C UL94 V-0 Gold - -
BKS-117-01-L-V

BKS-117-01-L-V

CONN SOCKET 17POS 0.039 GOLD SMD

Samtec Inc. 		2,370 -

RFQ

Tube BKS Active Socket Female Socket Board to Board 17 All 0.039 (1.00mm) 2 0.100 (2.54mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Tin 4.14mm, 4.5mm, 5mm, 6mm, 7mm -
CLM-140-02-L-D-P-TR

CLM-140-02-L-D-P-TR

CONN RCPT 80POS 0.039 GOLD SMD

Samtec Inc. 		3,367 -

RFQ

CLM-140-02-L-D-P-TR

Ficha técnica

 Tape & Reel (TR) CLM Active Receptacle Female Socket Board to Board 80 All 0.039 (1.00mm) 2 0.039 (1.00mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Tin - -
CLM-140-02-LM-D-P-TR

CLM-140-02-LM-D-P-TR

CONN RCPT 80POS 0.039 GOLD SMD

Samtec Inc. 		3,347 -

RFQ

CLM-140-02-LM-D-P-TR

Ficha técnica

 Tape & Reel (TR) CLM Active Receptacle Female Socket Board to Board 80 All 0.039 (1.00mm) 2 0.039 (1.00mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Tin - -
CLP-150-02-L-D-BE-P-TR

CLP-150-02-L-D-BE-P-TR

CONN RCPT 100POS 0.05 GOLD SMD

Samtec Inc. 		2,633 -

RFQ

CLP-150-02-L-D-BE-P-TR

Ficha técnica

 Tape & Reel (TR) CLP Active Receptacle, Bottom Entry Female Socket Board to Board 100 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Tin - -
BCS-125-L-S-DE

BCS-125-L-S-DE

CONN RCPT 25POS 0.1 GOLD PCB

Samtec Inc. 		3,125 -

RFQ

BCS-125-L-S-DE

Ficha técnica

 Tube Tiger Claw™ BCS Active Receptacle, Bottom or Top Entry Female Socket Board to Board 25 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.290 (7.37mm) 0.120 (3.05mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESW-128-34-T-S

ESW-128-34-T-S

CONN SOCKET 28POS 0.1 TIN PCB

Samtec Inc. 		3,909 -

RFQ

ESW-128-34-T-S

Ficha técnica

 Tube ESW Active Elevated Socket Forked Board to Board 28 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.635 (16.13mm) 0.280 (7.11mm) -55°C ~ 105°C UL94 V-0 Tin - -
SSM-133-L-SV

SSM-133-L-SV

CONN RCPT 33POS 0.1 GOLD SMD

Samtec Inc. 		3,968 -

RFQ

SSM-133-L-SV

Ficha técnica

 Tube SSM Active Receptacle, Pass Through Female Socket Board to Board or Cable 33 All 0.100 (2.54mm) 1 - Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.290 (7.37mm) - -55°C ~ 125°C - Tin - -
MMS-133-01-T-SV

MMS-133-01-T-SV

CONN RCPT 33POS 0.079 TIN PCB

Samtec Inc. 		2,111 -

RFQ

MMS-133-01-T-SV

Ficha técnica

 Bulk MMS Active Receptacle Female Socket Board to Board or Cable 33 All 0.079 (2.00mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.175 (4.45mm) 0.115 (2.92mm) -55°C ~ 105°C - Tin - -
SSQ-136-01-S-S

SSQ-136-01-S-S

CONN RCPT 36POS 0.1 GOLD PCB

Samtec Inc. 		2,653 -

RFQ

SSQ-136-01-S-S

Ficha técnica

 Bulk SSQ Active Receptacle Forked Board to Board or Cable 36 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.335 (8.51mm) 0.104 (2.64mm) -55°C ~ 125°C UL94 V-0 Tin - -
SSQ-137-03-T-D

SSQ-137-03-T-D

CONN RCPT 74POS 0.1 TIN PCB

Samtec Inc. 		2,933 -

RFQ

SSQ-137-03-T-D

Ficha técnica

 Bulk SSQ Active Receptacle Forked Board to Board or Cable 74 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.335 (8.51mm) 0.394 (10.00mm) -55°C ~ 105°C UL94 V-0 Tin - -
BSW-119-04-G-S

BSW-119-04-G-S

CONN RCPT 19POS 0.1 GOLD PCB

Samtec Inc. 		2,311 -

RFQ

BSW-119-04-G-S

Ficha técnica

 Bulk BSW Active Receptacle, Breakaway Female Socket Board to Board 19 All 0.100 (2.54mm) 1 - Through Hole, Bottom Mount Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.350 (8.89mm) 0.170 (4.32mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESD-106-T-05

ESD-106-T-05

CONN SOCKET 12POS 0.1 GOLD PCB

Samtec Inc. 		3,453 -

RFQ

Bulk ESD Active Elevated Socket Female Socket Board to Board 12 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.500 (12.70mm) 0.165 (4.19mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-110-39-L-D

ESQ-110-39-L-D

CONN SOCKET 20POS 0.1 GOLD PCB

Samtec Inc. 		2,332 -

RFQ

ESQ-110-39-L-D

Ficha técnica

 Bulk ESQ Active Elevated Socket Forked Board to Board 20 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.435 (11.05mm) 0.480 (12.19mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESS-112-T-05

ESS-112-T-05

CONN SOCKET 12POS 0.1 GOLD PCB

Samtec Inc. 		3,302 -

RFQ

Bulk ESS Active Elevated Socket Female Socket Board to Board 12 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.500 (12.70mm) 0.173 (4.40mm) -55°C ~ 125°C UL94 V-0 Tin - -
FHP-08-02-T-S-LC-K

FHP-08-02-T-S-LC-K

CONN RCPT 8POS 0.156 TIN SMD

Samtec Inc. 		3,513 -

RFQ

Tube FHP Active Receptacle Female Socket Board to Board 8 All 0.156 (3.96mm) 1 - Surface Mount Solder Push-Pull Tin - Black 0.368 (9.35mm) - -55°C ~ 105°C - Tin - -
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

 Fudong Communication (Shenzhen) Grupo Co., Ltd.

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