RFI e EMI - Contatos, Fingerstock e juntas

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type Shape Width Length Height Material Plating Plating-Thickness AttachmentMethod
25-78FSV50-BD-24

25-78FSV50-BD-24

0.25 X 0.78 X 0.50 BD 24--FOLDED

Leader Tech Inc.
3,225 -

RFQ

25-78FSV50-BD-24

Ficha técnica

Bulk - Active Fingerstock - 0.780 (19.81mm) 24.000 (609.60mm) 0.250 (6.35mm) Beryllium Copper Unplated - Adhesive
6-34UT-070-DL-BD-16

6-34UT-070-DL-BD-16

0.07 X 0.22 X 070 BD 16--TWIST C

Leader Tech Inc.
2,193 -

RFQ

6-34UT-070-DL-BD-16

Ficha técnica

Bulk - Active Fingerstock - 0.220 (5.59mm) 16.000 (406.40mm) 0.060 (1.52mm) Beryllium Copper Unplated - Adhesive
0097053802

0097053802

GASKET BECU 19.81X609.6MM

Laird Technologies EMI
3,287 -

RFQ

0097053802

Ficha técnica

Bulk All-Purpose Active Fingerstock - 0.780 (19.81mm) 24.000 (609.60mm) 0.250 (6.35mm) Beryllium Copper - - Adhesive
4520PA51G09600

4520PA51G09600

GK NICU NRSG PU V0 SQ

Laird Technologies EMI
3,859 -

RFQ

4520PA51G09600

Ficha técnica

Bulk 51G Active Fabric Over Foam Square 2.000 (50.80mm) 96.000 (2.44m) 2.000 (50.80mm) - - - Adhesive
23-60FS-BD-24-NTP

23-60FS-BD-24-NTP

0.23 X 0.60 BD 24 NTP--FOLDED SE

Leader Tech Inc.
3,435 -

RFQ

23-60FS-BD-24-NTP

Ficha técnica

Bulk - Active Fingerstock - 0.600 (15.24mm) 24.000 (609.60mm) 0.230 (5.84mm) Beryllium Copper Unplated - Adhesive
4283PA51H03900

4283PA51H03900

GK,NICU,PTAFG,PU,V0,DSH .079X.15

Laird Technologies EMI
3,596 -

RFQ

Bulk 51H Active Fabric Over Foam D-Shape 0.157 (3.99mm) 39.000 (990.60mm) 0.080 (2.03mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
0C97044017

0C97044017

CSTR COIL SNB

Laird Technologies EMI
3,676 -

RFQ

0C97044017

Ficha técnica

Bulk Large Enclosure Active Fingerstock - 1.630 (41.40mm) 25.00' (7.60m) 0.410 (10.41mm) Beryllium Copper Tin 299.99µin (7.62µm) Hardware, Rivet, Solder
16-44UD-BD-16

16-44UD-BD-16

0.16 X 0.44 BD 16--16-44UD-BD-16

Leader Tech Inc.
3,592 -

RFQ

16-44UD-BD-16

Ficha técnica

Bulk - Active Fingerstock - 0.440 (11.18mm) 16.000 (406.40mm) 0.016 (0.41mm) Beryllium Copper Unplated - Adhesive
28-49U-BD-16

28-49U-BD-16

0.28 X 0.49 BD 16--28-49U-BD-16-

Leader Tech Inc.
2,933 -

RFQ

28-49U-BD-16

Ficha técnica

Bulk - Active Fingerstock - 0.490 (12.44mm) 16.000 (406.40mm) 0.280 (7.11mm) Beryllium Copper Unplated - Adhesive
4242PA51H06000

4242PA51H06000

GK,NICU,PTAFG,PU,V0,DSH .250X.25

Laird Technologies EMI
3,889 -

RFQ

Bulk 51H Active Fabric Over Foam D-Shape 0.250 (6.35mm) 5.00' (1.52m) 0.250 (6.35mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
23-S-60FSV50-BD-24

23-S-60FSV50-BD-24

0.23 X 0.60 BD 24--FOLDED SERIES

Leader Tech Inc.
2,644 -

RFQ

Bulk - Active Fingerstock - 0.600 (15.24mm) 24.000 (609.60mm) 0.230 (5.84mm) Beryllium Copper Unplated - Adhesive
4084PAX1R03937

4084PAX1R03937

GK,NICU,PTAFG,PU,V0,SQ .500X.500

Laird Technologies EMI
3,554 -

RFQ

Bulk EcoTemp™ 85 X1R Active Fabric Over Foam Square 0.500 (12.70mm) 39.370 (1.00m) 0.500 (12.70mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
0098097517

0098097517

LS,STR,SNB,USFT,PSA

Laird Technologies EMI
3,837 -

RFQ

Bulk Ultrasoft Longitudinal Grounding Active Fingerstock - - - - Beryllium Copper - - Slot
4240AB51K04800

4240AB51K04800

GK,NICU,NRS,PU,V0,DSH .100X.300X

Laird Technologies EMI
2,523 -

RFQ

Bulk 51K Active Fabric Over Foam D-Shape 0.300 (7.62mm) 4.00' (1.22m) 0.100 (2.54mm) Polyurethane Foam, Nickel-Copper Polyester (NI/CU) - - Adhesive
23-60FS-BD-24

23-60FS-BD-24

0.23 X 0.60 BD 24--FOLDED SERIES

Leader Tech Inc.
3,105 -

RFQ

23-60FS-BD-24

Ficha técnica

Bulk - Active Fingerstock - 0.600 (15.24mm) 24.000 (609.60mm) 0.230 (5.84mm) Beryllium Copper Unplated - Adhesive
25-S-78FSV50-BD-24

25-S-78FSV50-BD-24

0.25 X 0.78 X 0.50 BD 24--FOLDED

Leader Tech Inc.
3,956 -

RFQ

25-S-78FSV50-BD-24

Ficha técnica

Bulk - Active Fingerstock - 0.780 (19.81mm) 24.000 (609.60mm) 0.250 (6.35mm) Beryllium Copper Unplated - Adhesive
0097095117

0097095117

S3,STR,SNB,PSA .220X.620X.375X14

Laird Technologies EMI
2,465 -

RFQ

Bulk - Active Fingerstock - 0.760 (19.30mm) 15.000 (381.00mm) 0.220 (5.59mm) Beryllium Copper Tin 299.21µin (7.60µm) Slot
11-89RA-BD-16

11-89RA-BD-16

0.14 X 0.90 BD 16--11-89RA-BD-16

Leader Tech Inc.
2,456 -

RFQ

11-89RA-BD-16

Ficha técnica

Bulk - Active Fingerstock - 0.890 (22.61mm) 16.000 (406.40mm) 0.110 (2.79mm) Beryllium Copper Unplated - Adhesive
0C97053802

0C97053802

AP COIL BF PSA

Laird Technologies EMI
2,884 -

RFQ

0C97053802

Ficha técnica

Bulk All-Purpose Active Fingerstock - 0.780 (19.81mm) 24.000 (609.60mm) 0.250 (6.35mm) Beryllium Copper Unplated - Adhesive
4418AB51K08400

4418AB51K08400

GK NICU NRS PU V0 REC

Laird Technologies EMI
3,052 -

RFQ

4418AB51K08400

Ficha técnica

Bulk 51K Active Fabric Over Foam - - 7.00' (213.36cm) - Polyurethane Foam, Nickel-Copper Polyester (NI/CU) - - Adhesive
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1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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