RFI e EMI - Contatos, Fingerstock e juntas

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type Shape Width Length Height Material Plating Plating-Thickness AttachmentMethod
S9001-05R

S9001-05R

SMT PRESSURE CONTACT 1300/RL

Harwin Inc.
3,520 -

RFQ

S9001-05R

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) - Obsolete Shield Finger - 0.079 (2.00mm) 0.138 (3.50mm) 0.098 (2.50mm) - Gold Flash Solder
S9001-46R

S9001-46R

SMT PRESSURE CONTACT TIN 1300

Harwin Inc.
3,601 -

RFQ

S9001-46R

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) - Obsolete Shield Finger - 0.079 (2.00mm) 0.138 (3.50mm) 0.098 (2.50mm) - Tin Flash Solder
5369EBG1W00106

5369EBG1W00106

EMI GASKET CUSTOM

Laird Technologies EMI
3,445 -

RFQ

- - Obsolete - - - - - - - - -
5924EBG1W00046

5924EBG1W00046

EMI GASKET CUSTOM

Laird Technologies EMI
2,424 -

RFQ

- - Obsolete - - - - - - - - -
10128875-009RLF

10128875-009RLF

SPRING CONTACT GOLD

Amphenol ICC (FCI)
3,782 -

RFQ

10128875-009RLF

Ficha técnica

Tape & Reel (TR) - Obsolete Shield Finger, Pre-Loaded - 0.055 (1.40mm) 0.197 (5.00mm) 0.161 (4.10mm) Copper Alloy Gold Flash Solder
10129746-001RLF

10129746-001RLF

SPRING CONTACT GOLD

Amphenol ICC (FCI)
3,640 -

RFQ

10129746-001RLF

Ficha técnica

Tape & Reel (TR) - Obsolete Shield Finger - 0.071 (1.80mm) 0.110 (2.80mm) 0.036 (0.92mm) - - - Solder
10076432-009RLF

10076432-009RLF

SPRINT CONTACT GOLD

Amphenol ICC (FCI)
2,855 -

RFQ

10076432-009RLF

Ficha técnica

Tray - Obsolete Shield Finger, Pre-Loaded - 0.043 (1.10mm) 0.197 (5.00mm) 0.138 (3.50mm) Beryllium Copper Alloy Gold Flash Solder
10118534-003RLF

10118534-003RLF

SPRING CONTACT GOLD

Amphenol ICC (FCI)
3,354 -

RFQ

10118534-003RLF

Ficha técnica

Tape & Reel (TR) - Obsolete Shield Finger, Pre-Loaded - 0.059 (1.50mm) 0.137 (3.48mm) 0.061 (1.55mm) Beryllium Copper Alloy Gold Flash Solder
10123973-009RLF

10123973-009RLF

HEADER

Amphenol ICC (FCI)
2,206 -

RFQ

Tray - Obsolete - - - - - Stainless Steel Gold - -
8863-0130-72

8863-0130-72

O-STRIP .103

Laird Technologies EMI
2,969 -

RFQ

Bag Electroseal™ EcE72 Active - - - - - - - - -
8865-0105-89

8865-0105-89

GASKET 0.062X0.068 1' LENGTH

Laird Technologies EMI
2,224 -

RFQ

8865-0105-89

Ficha técnica

Bag Electroseal™ EcE89 Active - D-Shape 0.062 (1.57mm) - 0.068 (1.73mm) - - - Adhesive
8865-0105-81

8865-0105-81

GASKET 0.062X0.068 1' LENGTH

Laird Technologies EMI
2,215 -

RFQ

8865-0105-81

Ficha técnica

Bag Electroseal™ EcE81 Active - D-Shape 0.062 (1.57mm) - 0.068 (1.73mm) - - - Adhesive
1053840001

1053840001

SPRING CONTACT 0.40MM - 0.80MM H

Molex
2,402 -

RFQ

1053840001

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) - Obsolete Shield Finger, Pre-Loaded - 0.079 (2.00mm) 0.154 (3.90mm) 0.043 (1.10mm) Stainless Steel Gold 19.685µin (0.50µm) Solder
4199EF51G00090

4199EF51G00090

EMI GASKET RECTANGLE

Laird Technologies EMI
3,366 -

RFQ

4199EF51G00090

Ficha técnica

Bag 51G Active Fabric Over Foam Rectangle 0.649 (16.50mm) 0.900 (22.86mm) 0.071 (1.80mm) - - - -
4BP4KA51H00072GOG

4BP4KA51H00072GOG

51H SERIES CUSTOM

Laird Technologies EMI
3,624 -

RFQ

4BP4KA51H00072GOG

Ficha técnica

Bag 51H Active Fabric Over Foam - - 0.720 (18.29mm) - Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
67SLG040040025PI00

67SLG040040025PI00

METAL FILM OVER FOAM CONTACTS

Laird Technologies EMI
2,022 -

RFQ

67SLG040040025PI00

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) SMD Grounding Metallized Active Film Over Foam Rectangle 0.157 (4.00mm) 0.098 (2.50mm) 0.157 (4.00mm) Polyurethane Foam, Tin-Copper Polyester (SN/CU) - - Solder
67SLG050050030PI00

67SLG050050030PI00

METAL FILM OVER FOAM CONTACTS

Laird Technologies EMI
3,238 -

RFQ

67SLG050050030PI00

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) SMD Grounding Metallized Active Film Over Foam Rectangle 0.197 (5.00mm) 0.118 (3.00mm) 0.197 (5.00mm) Polyurethane Foam, Tin-Copper Polyester (SN/CU) - - Solder
67SLG100100100PI00

67SLG100100100PI00

METAL FILM OVER FOAM CONTACTS

Laird Technologies EMI
2,124 -

RFQ

67SLG100100100PI00

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) SMD Grounding Metallized Active Film Over Foam Rectangle 0.394 (10.00mm) 0.394 (10.00mm) 0.394 (10.00mm) Polyurethane Foam, Tin-Copper Polyester (SN/CU) - - Solder
67SLH050050025PI00

67SLH050050025PI00

METAL FILM OVER FOAM CONTACTS

Laird Technologies EMI
2,907 -

RFQ

67SLH050050025PI00

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) SMD Grounding Metallized Active Film Over Foam Hourglass 0.197 (5.00mm) 0.098 (2.50mm) 0.197 (5.00mm) Polyurethane Foam, Tin-Copper Polyester (SN/CU) - - Solder
67SLH050050030PI00

67SLH050050030PI00

METAL FILM OVER FOAM CONTACTS

Laird Technologies EMI
2,164 -

RFQ

67SLH050050030PI00

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) SMD Grounding Metallized Active Film Over Foam Hourglass 0.197 (5.00mm) 0.118 (3.00mm) 0.197 (5.00mm) Polyurethane Foam, Tin-Copper Polyester (SN/CU) - - Solder
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1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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