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RFI e EMI - Contatos, Fingerstock e juntas
| Foto: | Número da peça do fabricante | Disponibilidade | Preço | Quantidade | Ficha técnica | Packaging | Series | ProductStatus | Type | Shape | Width | Length | Height | Material | Plating | Plating-Thickness | AttachmentMethod |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
4584PA51G00300GK NICU NRSG PU V0 DSH Laird Technologies EMI |
2,028 | - |
RFQ |
Ficha técnica |
Bulk | 51G | Active | Fabric Over Foam | D-Shape | 0.150 (3.80mm) | 3.000 (76.20mm) | 0.039 (1.00mm) | - | - | - | Adhesive |
|
|
4692PA51G00200GK NICU NRSG PU V0 DSH Laird Technologies EMI |
3,407 | - |
RFQ |
Ficha técnica |
Bulk | 51G | Active | Fabric Over Foam | D-Shape | 0.252 (6.40mm) | 2.000 (50.80mm) | 0.142 (3.60mm) | - | - | - | Adhesive |
|
|
67B7G2504005010R00SP,CON,7,AU,TNR Laird Technologies EMI |
2,951 | - |
RFQ |
Bulk | - | Active | Fingerstock | - | 0.098 (2.50mm) | 0.157 (4.00mm) | 0.197 (5.00mm) | Beryllium Copper | Gold | - | Solder | |
|
|
67BCG2503004010R00SP,CON,C,AU,TNR Laird Technologies EMI |
2,536 | - |
RFQ |
Bulk | BCG | Active | - | - | - | - | - | - | - | - | - | |
|
|
67BCG2504504810R00SP,CON,C,AU,TNR Laird Technologies EMI |
3,825 | - |
RFQ |
Bulk | BCG | Active | - | - | - | - | - | - | - | - | - | |
|
|
0077001617SLMT,1F,SNB Laird Technologies EMI |
3,516 | - |
RFQ |
Ficha técnica |
Bulk | Slot Mount | Active | Fingerstock | - | 0.320 (8.13mm) | 0.169 (4.29mm) | 0.110 (2.79mm) | Beryllium Copper | Tin | 299.99µin (7.62µm) | Slot |
|
|
0077001717SLMT,2F,SNB Laird Technologies EMI |
2,108 | - |
RFQ |
Ficha técnica |
Bulk | Slot Mount | Active | Fingerstock | - | 0.320 (8.13mm) | 0.356 (9.04mm) | 0.110 (2.79mm) | Beryllium Copper | Tin | 299.21µin (7.60µm) | Slot |
|
|
0077001719SLMT,2F,NIB Laird Technologies EMI |
3,989 | - |
RFQ |
Ficha técnica |
Bulk | Slot Mount | Active | Fingerstock | - | 0.320 (8.13mm) | 0.356 (9.04mm) | 0.110 (2.79mm) | Beryllium Copper | Nickel | 299.99µin (7.62µm) | Slot |
|
|
0077001819SLMT,3F,NIB Laird Technologies EMI |
3,622 | - |
RFQ |
Ficha técnica |
Bulk | Slot Mount | Active | Fingerstock | - | 0.320 (8.13mm) | 0.543 (13.79mm) | 0.110 (2.79mm) | Beryllium Copper | Nickel | 299.21µin (7.60µm) | Slot |
|
|
0077001917SLMT,4F,SNB Laird Technologies EMI |
2,145 | - |
RFQ |
Ficha técnica |
Bulk | Slot Mount | Active | Fingerstock | - | 0.320 (8.13mm) | 0.730 (18.54mm) | 0.110 (2.79mm) | Beryllium Copper | Tin | 299.21µin (7.60µm) | Slot |
|
|
0077002317SLMT,1F,SNB Laird Technologies EMI |
3,857 | - |
RFQ |
Ficha técnica |
Bulk | Slot Mount | Active | Fingerstock | - | 0.370 (9.40mm) | 0.225 (5.71mm) | 0.130 (3.30mm) | Beryllium Copper | Tin | 299.21µin (7.60µm) | Slot |
|
|
0077002417SLMT,2F,SNB Laird Technologies EMI |
2,851 | - |
RFQ |
Ficha técnica |
Bulk | Slot Mount | Active | Fingerstock | - | 0.370 (9.40mm) | 0.475 (12.07mm) | 0.130 (3.30mm) | Beryllium Copper | Tin | 299.99µin (7.62µm) | Slot |
|
|
0077004617SLMT,2F,SNB Laird Technologies EMI |
2,685 | - |
RFQ |
Ficha técnica |
Bulk | Slot Mount | Active | Fingerstock | - | 0.320 (8.13mm) | 0.356 (9.04mm) | 0.110 (2.79mm) | Beryllium Copper | Tin | 299.21µin (7.60µm) | Adhesive |
|
|
0077006217SLMT,1F,SNB Laird Technologies EMI |
2,872 | - |
RFQ |
Ficha técnica |
Bulk | Slot Mount | Active | Fingerstock | - | 0.320 (8.13mm) | 0.169 (4.29mm) | 0.110 (2.79mm) | Beryllium Copper | Tin | 299.99µin (7.62µm) | Slot |
|
|
0077006219SLMT,1F,NIB Laird Technologies EMI |
2,304 | - |
RFQ |
Ficha técnica |
Bulk | Slot Mount | Active | Fingerstock | - | 0.320 (8.13mm) | 0.169 (4.29mm) | 0.110 (2.79mm) | Beryllium Copper | Nickel | 299.21µin (7.60µm) | Slot |
|
|
0078001502SLMT,1F,BF,USFT Laird Technologies EMI |
2,902 | - |
RFQ |
Ficha técnica |
Bulk | Ultrasoft Slot Mount | Active | Fingerstock | - | 0.600 (15.24mm) | 0.250 (6.35mm) | 0.220 (5.59mm) | Beryllium Copper | - | - | Slot |
|
|
0078001519SLMT,1F,NIB,USFT Laird Technologies EMI |
3,601 | - |
RFQ |
Ficha técnica |
Bulk | Ultrasoft Slot Mount | Active | Fingerstock | - | 0.600 (15.24mm) | 0.250 (6.35mm) | 0.220 (5.59mm) | Beryllium Copper | Nickel | 299.21µin (7.60µm) | Slot |
|
|
0078001602SLMT,1F,BF,USFT Laird Technologies EMI |
3,297 | - |
RFQ |
Ficha técnica |
Bulk | Ultrasoft Slot Mount | Active | Fingerstock | - | 0.320 (8.13mm) | 0.169 (4.29mm) | 0.110 (2.79mm) | Beryllium Copper | - | - | Slot |
|
|
0078001617SLMT,1F,SNB,USFT Laird Technologies EMI |
3,682 | - |
RFQ |
Ficha técnica |
Bulk | Ultrasoft Slot Mount | Active | Fingerstock | - | 0.320 (8.13mm) | 0.169 (4.29mm) | 0.110 (2.79mm) | Beryllium Copper | Tin | 299.21µin (7.60µm) | Slot |
|
|
0078001702SLMT,2F,BF,USFT Laird Technologies EMI |
2,519 | - |
RFQ |
Ficha técnica |
Bulk | Ultrasoft Slot Mount | Active | Fingerstock | - | 0.320 (8.13mm) | 0.356 (9.04mm) | 0.110 (2.79mm) | Beryllium Copper | - | - | Slot |
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