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RFI e EMI - Contatos, Fingerstock e juntas
| Foto: | Número da peça do fabricante | Disponibilidade | Preço | Quantidade | Ficha técnica | Packaging | Series | ProductStatus | Type | Shape | Width | Length | Height | Material | Plating | Plating-Thickness | AttachmentMethod |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
4246AB51K01200GK NICU NRS PU V0 REC Laird Technologies EMI |
3,753 | - |
RFQ |
Ficha técnica |
Bulk | 51K | Active | Fabric Over Foam | Rectangle | 0.091 (2.30mm) | 12.000 (304.80mm) | 0.051 (1.30mm) | Polyurethane Foam, Nickel-Copper Polyester (NI/CU) | - | - | - |
|
|
4042AB51K01200GK NICU NRS PU V0 REC Laird Technologies EMI |
3,147 | - |
RFQ |
Ficha técnica |
Bulk | 51K | Active | Fabric Over Foam | Rectangle | 0.126 (3.20mm) | 12.000 (304.80mm) | 0.118 (3.00mm) | Polyurethane Foam, Nickel-Copper Polyester (NI/CU) | - | - | - |
|
|
4078PA51H00300GK NICU PTAFG PU V0 DSH Laird Technologies EMI |
2,475 | - |
RFQ |
Ficha técnica |
Bulk | 51H | Active | Fabric Over Foam | D-Shape | 0.358 (9.10mm) | 3.000 (76.20mm) | 0.118 (3.00mm) | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) | - | - | Adhesive |
|
|
0097077902DCON,BF 0.6X17.5X44.2MM Laird Technologies EMI |
2,936 | - |
RFQ |
Bulk | - | Active | Fingerstock | - | 0.690 (17.53mm) | 1.740 (44.20mm) | 0.025 (0.64mm) | Beryllium Copper | Unplated | - | Slot | |
|
|
0097077817DCON,9P,SNB Laird Technologies EMI |
3,251 | - |
RFQ |
Ficha técnica |
Bulk | D Connector | Active | Fingerstock | - | 0.690 (17.53mm) | 1.410 (35.81mm) | 0.025 (0.64mm) | Beryllium Copper | Tin | 299.21µin (7.60µm) | Slot |
|
|
7-19PCI-SS-9.20.067 X 0.177 SS 9.2--7-19PCI-SS Leader Tech Inc. |
3,451 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Fingerstock | - | 0.180 (4.57mm) | 9.200 (233.68mm) | 0.070 (1.78mm) | Beryllium Copper | - | - | Adhesive |
|
19-04-27855-S6305CHO-SEAL S6305 NI/C 0.048 1' Parker Chomerics |
3,499 | - |
RFQ |
Ficha técnica |
Spool | - | Active | Gasket | Round | 0.048 (1.22mm) | 12.000 (304.80mm) | - | Conductive Elastomer | Nickel | - | Non-Conductive Adhesive |
|
|
8564-0167-12OSTRHOLCTL,ECE012 10.3X5.7X7MM Laird Technologies EMI |
3,144 | - |
RFQ |
Bulk | - | Active | - | - | - | - | - | - | - | - | - | |
|
|
0097077917DCON,15P,SNB Laird Technologies EMI |
3,223 | - |
RFQ |
Ficha técnica |
Bulk | D Connector | Active | Fingerstock | - | 0.690 (17.53mm) | 1.740 (44.20mm) | 0.025 (0.64mm) | Beryllium Copper | Tin | 299.21µin (7.60µm) | Slot |
|
|
0097082517DCON,150,SNB Laird Technologies EMI |
2,684 | - |
RFQ |
Ficha técnica |
Bulk | D Connector-Slotted | Active | Fingerstock | - | 0.690 (17.53mm) | 1.740 (44.20mm) | 0.025 (0.64mm) | Beryllium Copper | Tin | 299.21µin (7.60µm) | Slot |
|
|
8863-0100-89OSTRSD,ECE089 1.0MM Laird Technologies EMI |
3,751 | - |
RFQ |
Bulk | Electroseal™ EcE89 | Active | - | - | - | - | - | - | - | - | - | |
|
19-04-25875-S6305CHO-SEAL S6305 NI/C 0.050 1' Parker Chomerics |
2,702 | - |
RFQ |
Ficha técnica |
Spool | - | Active | Gasket | Round | 0.050 (1.27mm) | 12.000 (304.80mm) | - | Conductive Elastomer | Nickel | - | Non-Conductive Adhesive |
|
CF710EA02541049GK, NICU,CF,V0 1X25.4X104.9MM Laird Technologies EMI |
2,810 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | - | - | - | - | - | - | - | - | - |
|
|
4056AB51K01200GK NICU NRS PU V0 REC Laird Technologies EMI |
2,258 | - |
RFQ |
Ficha técnica |
Bulk | 51K | Active | Fabric Over Foam | Rectangle | 0.201 (5.10mm) | 12.000 (304.80mm) | 0.059 (1.50mm) | Polyurethane Foam, Nickel-Copper Polyester (NI/CU) | - | - | - |
|
|
4688AA51G01800GK NICU NRSG PU V0 REC Laird Technologies EMI |
3,182 | - |
RFQ |
Ficha técnica |
Bulk | 51G | Active | Fabric Over Foam | Rectangle | 0.118 (3.00mm) | 18.000 (457.20mm) | 0.079 (2.00mm) | - | - | - | - |
|
|
8560-0144-81DIECUT,ECE081 Laird Technologies EMI |
3,135 | - |
RFQ |
Bulk | 8560 | Active | Gasket | Round | 0.657 (16.70mm) | - | 0.063 (1.60mm) | - | - | - | - | |
|
4520PA22101800GASKET FAB/FOAM 2.03X457.2MM SQ Laird Technologies EMI |
2,132 | - |
RFQ |
Ficha técnica |
Bulk | 221 FOF | Active | Fabric Over Foam | Square | 2.000 (50.80mm) | 18.000 (457.20mm) | 2.000 (50.80mm) | - | - | - | Adhesive |
|
|
0097078117DCON,37P,SNB Laird Technologies EMI |
3,254 | - |
RFQ |
Ficha técnica |
Bulk | D Connector | Active | Fingerstock | - | 0.690 (17.53mm) | 2.930 (74.42mm) | 0.025 (0.64mm) | Beryllium Copper | Tin | 299.21µin (7.60µm) | Slot |
|
4184PA22101800GSKT FAB/FOAM 3.8X457.2MM DSHAPE Laird Technologies EMI |
3,873 | - |
RFQ |
Ficha técnica |
Bulk | 221 FOF | Active | Fabric Over Foam | D-Shape | 0.150 (3.80mm) | 18.000 (457.20mm) | 0.059 (1.50mm) | - | - | - | Adhesive |
|
|
0097073217GB,4F,SNB Laird Technologies EMI |
3,606 | - |
RFQ |
Bulk | Foldover | Active | Fingerstock | - | - | - | - | Beryllium Copper | - | - | Slot |
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