RFI e EMI - Contatos, Fingerstock e juntas

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type Shape Width Length Height Material Plating Plating-Thickness AttachmentMethod
4629PA51H01800

4629PA51H01800

GASKET FAB/FOAM 10X457.2MM RECT

Laird Technologies EMI
2,776 -

RFQ

4629PA51H01800

Ficha técnica

Bulk 51H Active Fabric Over Foam Rectangle 0.394 (10.00mm) 18.000 (457.20mm) 0.059 (1.50mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
4688PA51G01800

4688PA51G01800

GASKT FABRIC/FOAM 3X457.2MM RECT

Laird Technologies EMI
2,908 -

RFQ

4688PA51G01800

Ficha técnica

Bulk 51G Active Fabric Over Foam Rectangle 0.118 (3.00mm) 18.000 (457.20mm) 0.079 (2.00mm) - - - Adhesive
4629AB51H01800

4629AB51H01800

GK NICU PTAFG PU V0 REC

Laird Technologies EMI
2,214 -

RFQ

4629AB51H01800

Ficha técnica

Bulk 51H Active Fabric Over Foam Rectangle 0.394 (10.00mm) 18.000 (457.20mm) 0.059 (1.50mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - -
8864-0173-93

8864-0173-93

OSTRHOL,ECE093 2.2X1.3MM

Laird Technologies EMI
2,343 -

RFQ

8864-0173-93

Ficha técnica

Bulk Electroseal™ Active Gasket Round 0.085 (2.16mm) - - - - - -
4181PA51H01900

4181PA51H01900

GK NICU PTAFG PU V0 DSH

Laird Technologies EMI
3,075 -

RFQ

4181PA51H01900

Ficha técnica

Bulk 51H Active Fabric Over Foam D-Shape 0.394 (10.00mm) 19.000 (482.60mm) 0.079 (2.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
4701AB51H01700

4701AB51H01700

GK NICU PTAFG PU V0 REC

Laird Technologies EMI
2,346 -

RFQ

4701AB51H01700

Ficha técnica

Bulk 51H Active Fabric Over Foam Rectangle 0.374 (9.50mm) 17.000 (431.80mm) 0.252 (6.40mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - -
3-23T-BD-12

3-23T-BD-12

0.03 X 0.23 BD 12.0--3-23T-BD-12

Leader Tech Inc.
2,504 -

RFQ

3-23T-BD-12

Ficha técnica

Bulk - Active Fingerstock - 0.230 (5.84mm) 12.000 (304.80mm) 0.030 (0.76mm) Beryllium Copper Unplated - Adhesive
4286PA51G01800

4286PA51G01800

GASKET FAB/FOAM 10X457.2MM RECT

Laird Technologies EMI
3,482 -

RFQ

4286PA51G01800

Ficha técnica

Bulk 51G Active Fabric Over Foam Rectangle 0.394 (10.00mm) 18.000 (457.20mm) 0.118 (3.00mm) - - - Adhesive
4602PA51H01800

4602PA51H01800

GK,NICU,PTAFG,PU,V0,REC

Laird Technologies EMI
3,898 -

RFQ

4602PA51H01800

Ficha técnica

Bulk 51H Active Fabric Over Foam Rectangle 0.236 (6.00mm) 18.000 (457.20mm) 0.079 (2.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
0078002102

0078002102

SLMT,STR,BF,USFT

Laird Technologies EMI
3,045 -

RFQ

0078002102

Ficha técnica

Bulk Ultrasoft Slot Mount Active Fingerstock - 0.320 (8.13mm) 16.000 (406.40mm) 0.110 (2.79mm) Beryllium Copper - - Slot
19-05-11440-S6305

19-05-11440-S6305

CHO-SEAL S6305 0.145X0.246 1'

Parker Chomerics
3,529 -

RFQ

19-05-11440-S6305

Ficha técnica

Spool - Active Gasket D-Shape 0.246 (6.25mm) 12.000 (304.80mm) 0.145 (3.68mm) Conductive Elastomer Nickel - Non-Conductive Adhesive
4220PA51H02200

4220PA51H02200

GK,NICU,PTAFG,PU,V0,REC .040X.20

Laird Technologies EMI
2,513 -

RFQ

Bulk 51H Active Fabric Over Foam Rectangle 0.200 (5.08mm) 22.000 (558.80mm) 0.040 (1.02mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
4906PA51G01800

4906PA51G01800

GK,NICU,NRSG,PU,V0,DSH

Laird Technologies EMI
3,977 -

RFQ

4906PA51G01800

Ficha técnica

Bulk 51G Active Fabric Over Foam D-Shape 0.189 (4.80mm) 18.000 (457.20mm) 0.130 (3.30mm) - - - Adhesive
4609PA51G01800

4609PA51G01800

GSKT FAB/FOAM 10.16X457.2MM DSHP

Laird Technologies EMI
2,346 -

RFQ

4609PA51G01800

Ficha técnica

Bulk 51G Active Fabric Over Foam D-Shape 0.402 (10.20mm) 18.000 (457.20mm) 0.181 (4.60mm) - - - Adhesive
8516-0122-59

8516-0122-59

MILCONNECTOR MIM618

Laird Technologies EMI
3,800 -

RFQ

Bulk MIL Connector Active Gasket - - - - - - - -
4789PA51H01800

4789PA51H01800

GSKT FAB/FOAM 9.5X457.2MM DSHAPE

Laird Technologies EMI
3,961 -

RFQ

4789PA51H01800

Ficha técnica

Bulk 51H Active Fabric Over Foam D-Shape 0.374 (9.50mm) 18.000 (457.20mm) 0.252 (6.40mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
10-05-6419-S6305

10-05-6419-S6305

CHO-SEAL S6305 0.156X0.156 1'

Parker Chomerics
2,406 -

RFQ

10-05-6419-S6305

Ficha técnica

Spool - Active Gasket D-Shape 0.156 (3.96mm) 12.000 (304.80mm) 0.156 (3.96mm) Conductive Elastomer Nickel - Non-Conductive Adhesive
0C77001002

0C77001002

GASKET BECU 8.1MMX7.6M

Laird Technologies EMI
3,848 -

RFQ

Bulk Slot Mount Active Fingerstock - 0.320 (8.13mm) 16.000 (406.40mm) 0.110 (2.79mm) Beryllium Copper Unplated - Slot
8864-0060-89

8864-0060-89

OSTRHOL,ECE089 .085X.040

Laird Technologies EMI
2,145 -

RFQ

Bulk Electroseal™ Active Gasket Round 0.085 (2.16mm) - - - - - -
0097007002

0097007002

CSTR, FRG,BF .130X.280X.135X1.21

Laird Technologies EMI
3,506 -

RFQ

Bulk - Active Fingerstock - - - - - Unplated - -
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1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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